JPH0442437A - Device and method for manufacturing magnetic disk - Google Patents

Abstract

PURPOSE:To perform magnetic recording with superior magnetic characteristic and high density by placing a substrate under oxygen atmosphere after applying etching to the surface of the substrate. CONSTITUTION:A carrier on which the substrate is set is transferred from a carry-in room 1 to a surface treating room 2 evacuated in advance, and when argon gas pressure in the surface treating room 2 arrives at prescribed pressure, a high frequency power is applied to a disk substrate, and the etching of the surface of the substrate is performed for a prescribed time. The substrate to which the etching is applied is placed under the oxygen atmosphere for a constant time, and an oxide layer on the surface of the substrate eliminated when the etching is performed is reproduced. Thereby, the filming of a magnetic disk can be performed on the surface of an extremely clean substrate, and the superior magnetic characteristic can be attached, and the magnetic recording with high density can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an apparatus and method for manufacturing a magnetic disk used in a magnetic disk device.

BACKGROUND OF THE INVENTION Conventional magnetic disk drives for recording data are progressing year by year in terms of higher recording densities, shorter access times, and faster transfer rates.

Along with this, magnetic disks are required to have high coercive force and high residual magnetic flux density, and oxide-coated magnetic disks are being replaced by metal thin film magnetic disks manufactured by sputtering or plating methods. . Furthermore, in order to reduce the separation length between the magnetic head and the magnetic disk, the flying height of the magnetic head has been reduced from the conventional 0.3 .mu.m to 0.2 .mu.m1 or even less.

In other words, it goes without saying that magnetic disks used in high-density magnetic disk drives have excellent magnetic properties, as well as excellent mechanical properties such as head impact resistance due to a reduction in flying height, and even better resistance to various environments. It must be highly reliable and have excellent environmental resistance, such as not corroding even under conditions.

The magnetic and mechanical properties of a magnetic disk are determined by the manufacturing conditions of the magnetic disk, for example, in the case of a magnetic disk manufactured by a sputtering method, the manufacturing conditions such as the heating temperature of the substrate, the operating pressure, and the input power. It also strongly depends on the material of the substrate and the roughness and cleanliness of the surface.

For example, in a magnetic disk manufactured by depositing a film on a substrate that has residue from cleaning the substrate, so-called cleaning residue, there is a portion where the film is deposited directly on the disk substrate surface, and a portion where the film is deposited directly on the disk substrate surface. This means that there is a portion where the film was formed through the cleaning residue material. In this magnetic disk, the adhesion between the film and the substrate is weak in the part where the film is formed on the surface of the substrate via the cleaning residue, and the magnetic properties are different from the part where the film is formed directly on the surface of the substrate. Moreover, problems such as deterioration of head impact resistance, occurrence of errors due to separation of the film, and occurrence of modulation loss due to local changes in magnetic properties occur, making it impossible to use it in magnetic disk drives. Therefore,
In order to manufacture a magnetic disk for use in a high-density magnetic disk device, it is necessary to form a film on an extremely clean surface of a disk substrate, free from any contaminants that have been transferred over the entire surface of the substrate.

Current methods of cleaning magnetic disks include using organic solvents and hot water, and the substrate is cleaned with great care in order to obtain an extremely clean surface over the entire surface of the substrate. It is very difficult to completely remove cleaning unevenness, cleaning residue, stains, etc. from the entire surface of the substrate, and various problems as described above occur.

In a dry film forming method such as a sputtering method, there is a method of etching the surface of the substrate with Ar ions as a method of cleaning the substrate immediately before film forming. This method physically removes the surface layer of the substrate and exposes the substrate material itself to the surface of the substrate, making it possible to obtain an extremely clean surface over the entire surface of the substrate. Therefore, a film formed on a substrate treated in this way has a homogeneous film over the entire substrate, has extremely strong adhesion between the substrate and the film, and has excellent mechanical properties and environmental resistance. It is possible to form an excellent film.

Problems to be Solved by the Invention However, magnetic disks fabricated by forming a film on a substrate whose surface has been etched do not exhibit magnetic differences induced by concentric circles formed on the surface of the substrate, so-called textures. The direction of orientation is reversed in the vanishing region 9, that is, magnetic anisotropy is induced in which the texture direction is the axis of hard magnetization, so K,
The magnetic properties in the texture direction become very poor, and the recording and reproducing properties deteriorate significantly, making it impossible to use it as a magnetic disk for high-density magnetic recording. For this reason, in the past, as shown in Figure 4, in-line magnetic disk manufacturing equipment without a mechanism for etching the surface of the substrate did not etch the surface of the substrate, leaving cleaning residue on the surface of the substrate. Since magnetic disks are manufactured by forming a film without sufficiently removing the deposits, there are parts where the adhesion between the film and the substrate is weak, resulting in deterioration of head impact resistance and the occurrence of errors due to film separation. This has the problem that modulation scenes occur. The present invention solves the above conventional problems, and is a magnetic disk that has excellent magnetic properties, can perform high-density magnetic recording, has strong adhesion between the substrate and film, and has excellent mechanical properties and environmental resistance. The purpose of this invention is to provide a manufacturing device and a method for manufacturing the same.

Means for Solving the Problem In order to solve this problem, a magnetic disk manufacturing apparatus and a manufacturing method thereof according to the present invention provide a magnetic disk having a mechanism for etching the surface of a substrate and a mechanism for subsequently placing the substrate in an oxygen atmosphere. A manufacturing device or a magnetic disk manufacturing method that involves etching the surface of a substrate and then placing the substrate in an oxygen atmosphere, or a magnetic disk equipped with a mechanism for etching the surface of the substrate in an oxygen atmosphere. The present invention is configured to include a manufacturing apparatus or a method for manufacturing a magnetic disk using etching the surface of a substrate under an M-accumulation atmosphere.

Operation: With this configuration, a magnetic disk can be deposited on the surface of an extremely clean substrate.

Example Examples of the present invention will be described below.

As shown in FIG. 1, the magnetic disk manufacturing apparatus includes a loading chamber 1 for loading substrates, a surface treatment chamber 2 for etching and oxidizing the surface of the substrate, and a substrate heating chamber 3 for adjusting the temperature of the substrate.
, a sputtering chamber 4 in which a film is deposited on a substrate by sputtering, and an unloading chamber 6 in which the deposited magnetic disk is taken out. The carrying-in chamber 1, substrate heating chamber 3, film-forming chamber 4, and carrying-out chamber 6 are no different from conventional magnetic disk manufacturing equipment.

The surface treatment chamber 2 will be explained in detail using FIG. 2.

As shown in FIG. 2, the surface treatment chamber 2 includes a vacuum pump 6, a vacuum gauge 7, a high frequency power source 8, an argon gas introduction system 9, and an oxygen gas introduction system 10. The vacuum pump 6 is a clean cryopump capable of obtaining a high vacuum, and is connected to the surface treatment chamber 2 via a valve 11 and an orifice 12. The valve 11 opens and closes the connection between the vacuum pump 6 and the surface treatment chamber 2. The orifice 12 changes the conductance between the vacuum pump 6 and the surface treatment chamber 2 to adjust the gas pressure within the surface treatment chamber 2. The vacuum gauge 7 is a detector that measures the degree of vacuum within the surface treatment chamber 2. The argon gas introduction system 9 and the oxygen gas introduction system 10 have valves 13 and 14 for opening and closing gas introduction.
, and flow meters 16 and 16 for adjusting the amount of gas introduced.
have.

The operation of the magnetic disk manufacturing apparatus configured as above will be described below.

When the carrier 17 with the substrate set therein is placed in the loading chamber 1, the loading chamber 1 is evacuated. Once the specified degree of vacuum is reached,
The carrier 17 moves from the loading chamber 1 to the surface treatment chamber 2.

Since the surface treatment chamber 2 has been evacuated in advance, the loading chamber 1
There is no problem in moving the carrier 17 from the surface treatment chamber 2 to the surface treatment chamber 2. When the carrier 17 enters the surface treatment chamber 2, etching of the substrate begins. When the valve 13 of the argon gas introduction system is opened, a preset amount of argon gas is introduced into the surface treatment chamber 2 while being regulated by the flow meter 16 . The opening degree of the orifice 12 is adjusted while measuring the gas pressure in the surface treatment chamber 2 with the vacuum gauge 7 so that the argon gas pressure in the surface treatment chamber 2 becomes a predetermined gas pressure. When the argon gas pressure in the surface treatment chamber 2 reaches a predetermined pressure, high frequency power is applied to the disk substrate to etch the surface of the substrate for a predetermined period of time. After etching the surface of the substrate for a predetermined time, the high frequency power source 8 is turned off and the valve 13 of the argon gas introduction system is closed to complete the etching of the surface of the substrate.

As a result, cleaning residues adhering to the surface of the substrate are completely removed, and the surface of the substrate becomes extremely clean. However, this etching of the surface of the substrate also removes the oxide layer on the surface of the substrate. Next, the etched substrate is placed in an oxygen atmosphere to regenerate the oxide layer on the surface of the substrate.

When the valve 14 of the oxygen gas introduction system is opened, a preset amount of oxygen gas is introduced into the surface treatment chamber 2 while being regulated by the flow meter 16 . The opening degree of the orifice 12 is adjusted while measuring the gas pressure in the surface treatment chamber 2 with a vacuum gauge so that the oxygen gas pressure in the surface treatment chamber 2 becomes a predetermined gas pressure. The substrate thus etched is placed in an oxygen atmosphere at a predetermined time to regenerate the oxide layer on the surface of the substrate that was removed during etching.

When a predetermined time has elapsed, the valve 14 of the oxygen gas introduction system is closed, the orifice 12 is fully opened, and evacuation of the surface treatment chamber 2 is started. When a predetermined degree of vacuum is reached, the carrier moves to the substrate heating chamber 3. When a predetermined substrate temperature is reached, the carrier 17 is moved to the film forming chamber 4, and film formation begins on the extremely clean disk substrate. When the film formation is completed, the carrier 17 is moved to the unloading chamber 6 and the magnetic disk is taken out. As described above, the υ magnetic disk is manufactured by the magnetic disk manufacturing apparatus of this embodiment.

The magnetic disk manufacturing apparatus of this embodiment uses #1, in which the surface of the substrate is etched and then placed in an oxygen atmosphere to regenerate the oxide layer. A magnetic disk can also be manufactured by forming a magnetic film, a protective film, or the like. Next, its operation will be explained.

When the carrier 17 with the substrate set therein is placed in the loading chamber 1, the loading chamber 1 is evacuated. Once the specified degree of vacuum is reached,
The carrier 17 moves from the loading chamber 1 to the surface treatment chamber 2.

Since the surface treatment chamber 2 has been evacuated in advance,
There is no problem in moving the carrier 17 from the surface treatment chamber 2 to the surface treatment chamber 2. When the carrier 17 enters the surface treatment chamber 2, etching of the disk substrate begins. When the pulp 13 of the argon gas introduction system is opened, a preset amount of argon gas is introduced into the surface treatment chamber 2 while being regulated by the flow meter 15 . At this time, when the pulp 14 of the oxygen gas introduction system is simultaneously opened, a preset amount of oxygen gas is introduced into the surface treatment chamber 2 while being regulated by the flow meter 16. The opening degree of the orifice 12 is adjusted while measuring the gas pressure in the surface treatment chamber 2 with the vacuum gauge 7 so that the pressure of the mixed gas of argon gas and oxygen gas in the surface treatment chamber 2 becomes a predetermined gas pressure. . When the pressure of the mixed gas of argon gas and oxygen gas in the surface treatment chamber 2 reaches a predetermined pressure, high frequency power is applied to the disk substrate to etch the surface of the substrate for a predetermined period of time. After etching the surface of the disk substrate for a predetermined period of time, the high frequency power is turned off, the argon gas introduction system pulp 13 and the oxygen gas introduction system 0 pulp 14 are closed, and the etching of the surface of the disk substrate is completed.

As a result, cleaning residues adhering to the surface of the substrate are completely removed, and the surface of the substrate becomes extremely clean. Moreover, when etching the surface of the substrate, since the operating gas contains oxygen gas, etching of the surface of the substrate and oxidation of the surface of the substrate proceed simultaneously, resulting in an oxidized layer on the surface of the substrate. It will never disappear.

After the etching of the surface of the substrate is completed, the orifice 12 is fully opened and the surface treatment chamber 2 is evacuated. When a predetermined degree of vacuum is reached, the carrier moves to the substrate heating chamber 3. When a predetermined substrate temperature is reached, the carrier 17 is moved to the film forming chamber 4, and film formation begins on the extremely clean substrate.

When the film formation is completed, the carrier 17 is moved to the unloading chamber 6 and the magnetic disk is taken out. A magnetic disk is manufactured by the magnetic disk manufacturing apparatus of this embodiment as described above.

EXAMPLES The present invention will be explained in more detail by showing Examples and Comparative Examples below.

(Example 1) As shown in FIG. 3, a NIP alloy film 19 is formed on the surface of a lightweight, non-magnetic AItMg alloy substrate 18 by electroless plating to maintain the mechanical strength of the magnetic disk. do. Since the surface of the plated NiP alloy film is uneven, it is polished to a mirror surface using Al2O3 abrasive grains. Furthermore, a texture concentric with the substrate is applied to the surface so that the center line average roughness Ra becomes an appropriate value.

The cleaning of the substrate is performed by ultrasonic cleaning with pure water, scrubber cleaning, and ultrasonic cleaning with an organic solvent, and then ends with steam cleaning with an organic solvent.

The substrate that has been cleaned is set in the magnetic disk manufacturing apparatus of the embodiment. Start evacuation and when the vacuum level reaches 10 Torr, introduce argon gas and increase the argon gas pressure to 3 mT.
orr. A high frequency power of 300 W is applied to the substrate side to etch the surface of the substrate. The thickness of the film removed by etching the surface of the substrate is several tens of layers, and this etching completely removes cleaning residues such as organic films attached to the substrate, resulting in an extremely clean surface. . Moreover, this etching also removes the oxide layer on the surface of the substrate. Therefore, without breaking the vacuum, the introduced gas was changed from argon gas to oxygen gas, and the oxygen gas pressure was 50 m.
An oxide layer is formed on the surface of the substrate by holding it in a Torr atmosphere for 3 minutes. Note that this step only replaces the gas, so the surface of the substrate is not contaminated. Further, on the surface of the substrate which has been made active by uniformly removing the surface layer of the surface of the substrate, oxygen gas, which is a chemically active gas, forms a uniform surface oxidation layer over the entire surface of the substrate.

The reason why the amount of the surface of the substrate to be removed by etching was set at several tens of layers is as follows.

From the results of various experiments conducted before conducting this example, it was found that the presence or absence of an oxide layer determines the direction of magnetic anisotropy induced by texture, although the reason is not clear. In other words, if there is an oxide layer on the surface of the substrate, the direction of the magnetic anisotropy induced by the texture will be parallel to the texture, but if there is no oxide layer on the surface of the substrate, the direction of the magnetic anisotropy will be parallel to the texture. It was found that the direction of the easy axis of induced magnetic anisotropy is perpendicular to the texture.

Therefore, what is important here is that only the organic film remaining on the surface of the substrate can be removed by etching the surface of the substrate, without removing the oxide layer on the surface of the substrate.

However, since the organic film remaining on the surface of the substrate is not uniform over the surface of the substrate, only the organic film remaining on the surface of the substrate can be removed by etching the surface of the substrate. I can't.

Therefore, it is necessary to increase the thickness to be removed by etching the surface of the substrate by several tens of layers so that the entire surface of the substrate has a homogeneous surface with no residual organic film or oxidized layer.

Therefore, if the surface of the substrate is removed by etching several dozen people as described above and then placed in an oxygen atmosphere, an extremely clean substrate having a homogeneous oxide layer over the entire surface of the substrate can be obtained.

After the surface of the substrate is subjected to the surface treatment described above, film formation is started. A Cr base film 20 with a film thickness of 200 μm to improve the magnetic properties of the magnetic film was formed by DC-magnetron sputtering at a sialbone gas pressure of 1 m Tor-r.
A magnetic disk of Example 1 was manufactured by successively forming a CoNiCr magnetic film 21 with a thickness of 0.0 mm and a C surface protection film with a thickness of 2 mm.

(Example 2) Next, a magnetic disk of Example 2 was produced. Using the same substrate as in Example 1, the cleaning of the substrate is completed by performing ultrasonic cleaning with pure water, scrubber cleaning, ultrasonic cleaning with an organic solvent, and then steam cleaning with an organic solvent as in Example 1. The substrate that has been cleaned is set in the magnetic disk manufacturing apparatus shown in the embodiment. The degree of vacuum was 10"-' when the vacuum was started.
When the pressure reaches the Torr level, introduce argon gas and oxygen gas and reduce the pressure of the mixed gas of argon gas and oxygen gas to 3 Torr.
Let it be mTorr. In this Example 2, the partial pressure of argon gas is 1.6 mTorr, and the partial pressure of oxygen gas is 1.5 mTorr.
It was set as rr.

A high frequency power of 300 W is applied to the substrate side to etch the surface of the substrate. The amount of etching required for the surface of the substrate is several dozen people, and this etching completely removes cleaning residue such as organic films and stains that had adhered to the substrate, resulting in an extremely clean surface. Moreover, when etching the surface of the substrate, the operating gas contains oxygen gas, so even if the oxide layer is removed by etching, the chemically active oxygen gas will immediately cover the surface of the substrate, and therefore the substrate surface will be etched. The oxide layer on the surface of the substrate does not disappear from the surface. Therefore, in Example 1, the surface of the substrate was kept in an oxygen atmosphere after etching in order to regenerate the oxide layer on the surface of the substrate that was removed during etching, but in Example 2, the surface of the substrate was etched. After the etching is completed, the surface of the substrate can be obtained which has an oxidized layer over the entire surface as in Example 1 without placing the substrate in an oxygen atmosphere, and which is also extremely clean over the entire surface. A magnetic disk of Example 2 was fabricated by forming a film in the same manner as in Example 1, except that the surface of the substrate was subjected to the surface treatment described above.

In Example 2, the ratio of the partial pressure of argon gas to the partial pressure of oxygen gas was set to 1:1, but the ratio of the partial pressure of argon gas to the partial pressure of oxygen gas may be any value. The amount of etching per unit time, that is, the amount of etching and the ease of oxidation vary depending on the partial pressure ratio of argon gas and oxygen gas. That is, as the partial pressure of argon gas increases, the etching rate increases, but oxidation becomes more difficult.

- On the other hand, as the partial pressure of oxygen gas increases, oxidation becomes easier but the etching rate decreases. Therefore, the partial pressure ratio of argon gas and oxygen gas may be determined to be an appropriate partial pressure ratio depending on the degree of cleanliness of the surface of the substrate after cleaning. For example, if the surface of the substrate after cleaning has a lot of cleaning residue and other deposits and the cleanliness is poor, treatment may be performed such as increasing the partial pressure of argon gas and increasing the etching rate.

(Comparative Example 1) Using the same substrate as in Example 1, the substrate was cleaned by ultrasonic cleaning with pure water, scrubber cleaning, and ultrasonic cleaning with an organic solvent, followed by steam cleaning with an organic solvent. Finish with washing. The substrate that has been cleaned is set in the magnetic disk manufacturing apparatus shown in the example. After evacuation begins and the degree of vacuum reaches the 10-7 Torr level, argon gas is introduced to bring the argon gas pressure to 3 mTorr. 300
High frequency power of W is applied to the substrate side to etch the surface of the substrate. The amount of etching on the surface of the board took several dozen people.
This etching completely removes cleaning residues such as organic films and stains adhering to the substrate, resulting in an extremely clean surface. In this state, the surface oxide layer on the surface of the substrate is also removed. In Example 1, the argon gas was then replaced with oxygen gas and the substrate was held in an oxygen gas atmosphere to form an oxide layer on the surface of the substrate, but in Comparative Example 1
A magnetic disk of Comparative Example 1 was prepared by forming a film in the same manner as in Example 1 without replacing argon gas with oxygen gas, that is, without forming an oxide layer on the surface of the substrate of the disk.

(Comparative Example 2) The same substrate as in Example 1 was used, and the substrate was cleaned in the same manner as in Example 1 by ultrasonic cleaning with pure water, Nukura (- cleaning), ultrasonic cleaning with organic solvent, and then ultrasonic cleaning with organic solvent. The substrate that has been cleaned is placed in the magnetic disk manufacturing apparatus shown in the example. Vacuuming is started and when the chamber + vacuum level reaches 10" Torr, the substrate is cleaned in Comparative Example 1. However, in Comparative Example 2, the surface of the substrate was not treated, that is, the surface of the substrate was cleaned at υ before being set in the sputtering apparatus, and Example 1 was applied to the substrate. A magnetic disk of Comparative Example 2 was prepared by forming a film in the same manner as in .

Example 1 produced as described above. Example 2゜Comparative example 1
Table 1 shows the evaluation results of the magnetic properties of each magnetic disk of Comparative Example 2.

Table 1 In Table 1, By is the residual magnetization in the direction parallel to the texture, B
r is the residual magnetization in the direction perpendicular to the texture 1) Bx
// Bx soil represents the strength of texture-induced magnetic anisotropy. Further, S represents the squareness ratio in the direction parallel to the texture, and Ha represents the coercive force in the direction parallel to the texture.

B of the magnetic disk of Example 1 manufactured on a substrate kept in an oxygen atmosphere after etching the surface of the substrate
r, / B r, and B of the magnetic disk of Example 2 manufactured on a substrate whose surface was etched in an oxygen atmosphere.
The x, ip/Bx soil induces a larger and stronger magnetic anisotropy than the B7/Bx soil of the magnetic disks of Comparative Examples 1 and 2. Also, in terms of S and Ha, the magnetic disks of Example 1 and 2 have superior magnetic properties compared to the magnetic disks of Comparative Examples 1 and 2.

In the magnetic disk of Comparative Example 1, in which only etching was performed on the surface of the substrate and the film was formed without forming an oxide layer on the surface of the substrate, Br//BrL<1, and the direction parallel to the texture is the axis of difficult magnetization. Magnetic anisotropy is induced. That is,
The magnetic properties of a magnetic disk formed on a substrate that has only been etched will be significantly inferior to those of a magnetic disk formed on a substrate that has not been etched.

In other words, in order to obtain magnetic properties with a magnetic disk that has been deposited on an extremely clean surface that has been etched onto the surface of the substrate, the substrate must be exposed to an oxygen atmosphere after the surface of the substrate has been etched to obtain an extremely clean surface. The oxide layer on the surface of the substrate that was removed during etching can be regenerated by holding the substrate, or the surface of the substrate can be etched in an atmosphere containing oxygen to prevent the oxide layer on the surface of the substrate from disappearing. is necessary.

In Example 1, the oxide layer removed by etching was regenerated by keeping the etched substrate in an oxygen atmosphere on the surface of the substrate, which was made extremely clean by etching, and then formed by sputtering. Since a magnetic disk is manufactured by forming a film, a magnetic disk having excellent magnetic properties can be manufactured.

In Example 2, the surface of the substrate was etched in an oxygen atmosphere to make the entire surface of the substrate extremely clean without eliminating the oxide layer on the surface of the substrate, and then a film was formed by sputtering. Since a magnetic disk is manufactured using this method, a magnetic disk having excellent magnetic properties can be manufactured.

Next, we investigated the occurrence of errors after the C8S test, which is an important problem when incorporating magnetic disks into actual drives.

The C8S test was conducted on the magnetic disk of Example 1, the magnetic disk of Example 2, and the magnetic disk of Comparative Example 2 at 2oO0.
We investigated the number of errors that occurred before and after performing the test 0 times. The results are shown in Table 2.

In Examples 1 and 2 of Table 2, no errors occurred before or after the CSS test.

On the other hand, in Comparative Example 2, errors occurred after the C8S test, and the number of errors was as many as 8.

That is, in Examples 1 and 2, by etching the surface of the substrate during film formation, the film was formed on an extremely clean substrate surface with no cleaning residue or stains on the surface of the substrate. Because the film was coated, the adhesion between the film and the disk substrate was good and the film was formed uniformly, so even in the C8S test, which is a test that easily damages magnetic disks, no damage was observed, and therefore errors occurred. There is none. On the other hand, in Comparative Example 2, the film was formed without etching the surface of the substrate during film formation, so the film was formed through the cleaning residue and smudges on the surface of the substrate, and therefore the film and disk If the film has poor adhesion to the substrate and is non-uniform, damage such as peeling of the film will occur in the C8S test, which is a test that can easily damage the magnetic disk, and this will be detected as an error. .

As described above, according to Example 1, the surface of the NiP-plated AfiMg substrate, which has a textured surface, is etched by high-frequency puttering, and organic matter deposits remaining on the surface of the substrate are removed. After removing the so-called cleaning residue and placing the extremely clean substrate in an oxygen atmosphere to regenerate the oxide layer on the surface of the substrate that was removed during etching, Cr, CoNiCr, etc.
According to Example 2, the surface of an AIMq substrate plated with NiP and having a textured surface was exposed to high frequency in an oxygen atmosphere. Cx, CoNiCr, and Cx, CoNiCr, and C were etched by Nuputtering to remove organic deposits remaining on the surface of the substrate, so-called cleaning residue, without eliminating the oxide layer on the surface of the substrate.
Since it is possible to create a magnetic disk in which films are continuously deposited, and magnetic anisotropy is induced with the axis of easy magnetization parallel to the texture, the coercive force in the texture direction increases.
Furthermore, since it has excellent magnetic properties with a large squareness ratio, high-density magnetic recording can be performed. Furthermore, Example 1
According to Example 2, the adhesion between the substrate and the film is strong, and the film is uniformly formed on the substrate, so it has excellent mechanical properties that do not suffer any damage even in the C8S test. Furthermore, a magnetic disk with excellent corrosion resistance can be manufactured.

In this example, when etching the surface of the substrate, argon gas was used as the operating gas, and a gas mixture of argon gas and oxygen gas was used. Nitrogen gas.

A magnetic disk having characteristics similar to those in this embodiment can be produced using a single gas such as carbon dioxide or a mixed gas such as neon gas and oxygen gas.

Furthermore, in this example, the surface of the substrate was etched by a sputtering method using high-frequency power, but the surface of the substrate may be etched by any sputtering method using DC power. Besides,
A magnetic disk having characteristics similar to those of this embodiment can be manufactured by any method such as ion milling.

Furthermore, in this example, an Af1Mq alloy substrate in which a non-magnetic substrate was plated with NiP was used, but the non-magnetic substrate was anodized! It may also be a substrate or a planutic substrate. In addition, in this example, the magnetic film includes a CoNiCr alloy,
Or was used for the non-magnetic base film, but the magnetic film was CoNiCr.
In addition to alloys, CoNi.

Alloys such as CoCr, CoCrTa, CoNiP, etc. may be used, and the nonmagnetic underlayer may be made of M in addition to Cr.
O, W, or an alloy containing them may be used.

Effects of the Invention As is clear from the description of the embodiments above, the present invention etches the surface of a non-magnetic substrate with a textured surface to eliminate organic matter deposits remaining on the surface of the substrate. After removing the so-called cleaning residue and placing the extremely clean substrate in an oxygen atmosphere to regenerate the oxide layer on the surface of the substrate that was removed during etching of the surface of the substrate,
A method of manufacturing a magnetic disk by successively forming a non-magnetic base film, a magnetic film, and a protective film, or etching the surface of a non-magnetic substrate with a texture in an oxygen atmosphere to form a substrate. After removing the organic deposits, so-called cleaning residue, remaining on the surface of the substrate without eliminating the oxide layer on the surface of the substrate, the non-magnetic base film, magnetic film, and protective film are continuously applied. This method of manufacturing magnetic disks by depositing a film on the substrate has excellent magnetic properties, enables high-density magnetic recording, has strong adhesion between the substrate and the film, and is formed uniformly on the substrate. Accordingly, it is possible to realize a manufacturing apparatus and method for manufacturing a magnetic disk having excellent mechanical properties and environmental resistance.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram of a magnetic disk manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a conceptual diagram of the configuration of a surface treatment chamber, and FIG. 3 is a partial sectional view of a magnetic disk according to an embodiment of the present invention. FIG. 4 is a block diagram of a conventional magnetic disk manufacturing apparatus. 1... Loading room, 2... Surface treatment room, 3
...Substrate heating chamber, 4... Film forming chamber, 6.
...Export room, 6...Vacuum pump, 7...
...Vacuum gauge, 8...High frequency power supply, 9.
... Argon gas introduction system, 10 ... Oxygen gas introduction system, 11.13, 14 ... Pulp, 12 ... Oliice, 16.16.・・・・・・
・Flowmeter, 17...Carrier, 18...
・A I Mq alloy substrate, 19...NiP
Alloy film, 2o...Cr base film, 21...
・CoNiCr magnetic film, 22...C surface protection film. Name of agent: Patent attorney Shigetaka Awano and 1 other person! @
1 figure

Claims (4)

[Claims] (1) A magnetic disk manufacturing apparatus comprising a mechanism for etching the surface of a substrate and then placing the substrate in an oxygen atmosphere. (2) A magnetic disk manufacturing apparatus, which is equipped with a mechanism for etching the surface of a substrate in an oxygen atmosphere. (3) A method for manufacturing a magnetic disk, which includes etching the surface of a substrate and then placing the substrate in an oxygen atmosphere. (4) A method for manufacturing a magnetic disk, the method using etching the surface of a substrate in an oxygen atmosphere.