JPH0441906B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for partially processing a laminated substrate.

(Prior art) Indications such as names can be written on the covers of laminated notebooks using water-based ink, ballpoint pen, black ink, etc., and photographs can be written on laminated substrates in albums, stamp collection books, etc. ,
It is often necessary to partially process laminated substrates, such as to form pockets for storing stamps and the like.

Conventionally, when forming a notation part on the cover of a laminated notebook, etc., where names can be written using water-based ink, ballpoint pen, black ink, etc., pressure-sensitive adhesive is used on the entire surface of the base material 1, as shown in Figure 4. A laminate film 3 was applied on the adhesive 2, and a mart ink coating layer 4 was formed on a part of the laminate film 3 using gravure coating, flexo coating, etc.

On the other hand, when forming pockets for accommodating photographs, stamps, etc. on a laminated base in albums, stamp collection books, etc., conventionally, as shown in Figure 5, the entire surface of the base material 1 is A pressure-sensitive adhesive 2 is applied to the laminate film 3, a laminate film 3 is crimped onto the laminate film 3, a film 5 of the same quality is placed on the laminate film 3, and the periphery is welded by heat sealing or welding. to form a pocket portion.

(Problems to be Solved by the Invention) However, when providing a writing section on the laminated substrate, as shown in FIG. Because it does not have the ability to absorb ink, it has the disadvantage that if it comes into contact with water during use, written characters may smudge or disappear.

Furthermore, when forming pockets or the like on the laminate film surface using heat sealing or welding on the above-mentioned laminated substrate, bulges, depressions, etc. may occur at the heat sealing or welding areas, as shown in Figure 5. , which is undesirable from a design point of view and causes further bulges and depressions.
When these laminated substrates are stacked one on top of the other, there are drawbacks such as bulkiness.

Therefore, it is an object of the present invention to solve various problems when partially processing a laminated substrate.

(Means for Solving the Problems) In the present invention, as a means for solving the above problems, adhesive is applied to a base material leaving a predetermined portion, and a laminate film is pressure-bonded on top of the adhesive. Furthermore, the present invention proposes a laminating method in which the laminate film is cut out along all or part of the periphery of a predetermined shaped portion to which no adhesive is applied.

(Function) That is, in the present invention, an adhesive such as a pressure sensitive adhesive is applied on the entire surface of the base material 1, leaving a predetermined shaped part such as a writing part or a pocket part, and a laminate film is pressure-bonded thereon. . Furthermore, in the case of a notation, etc., the laminate film is cut out along its periphery, and the cut portion of the laminate film is used as the notation.

If the adhesive is applied leaving a pocket on the substrate, the laminate film is cut out along the upper edge of the pocket to form the pocket.

(Experimental Example) The present invention will be described below based on illustrated embodiments.

The embodiment shown in FIGS. 1 and 2 shows an example in which a marking part 6 that can be written with water-based ink or the like is formed on a laminated substrate; 1 is a base material; Apply pressure-sensitive adhesive 2, leaving the area 6 [Fig. 1a]. PVC on the surface,
A laminate film 3 made of a material such as polypropylene, polyester, or polystyrene is crimped [FIG. 1b], and the laminate film 3 is further cut out along the periphery of the marking section 6 [FIG. 1c].

In this way, lamination is applied on the substrate 1, leaving the notation part 6, but since the notation part 6 is not laminated, it can be written with water-based ink or the like.

On the other hand, the embodiment shown in FIG. 3 shows an example in which a pocket is formed on a laminated substrate. In this embodiment, a pocket portion 7 is left on the substrate 1 and a pressure-sensitive adhesive 2 is applied to the surface. The steps up to the point where the laminate film 3 is crimped onto the substrate 1 are the same as the embodiments shown in FIGS.
The laminate film 4 is cut out along the upper edge of the upper pocket part 7 to form a cutout part 8.

In this manner, a pocket portion 7 having a notch portion 8 along the upper edge is formed on the substrate 1 on which the laminate film 3 is applied.

(Effects of the Invention) When a notation part is formed by cutting out a laminate film by the method of the present invention, since the notation part is not laminated, it is possible to write with water-based ink, ballpoint pen, or black ink. The characters written on the section will not smear or disappear.

Furthermore, in the method of the present invention, when forming a pocket part on a laminated substrate, no fusing process such as heat sealing or welding is performed as in the conventional method, so that the pocket part is formed flat, and when stacked. It also doesn't get bulky.

Further, according to the present invention, a pocket portion can be formed on a laminated substrate at a low cost and in any size.

In addition, in the above embodiment, an example was explained in which a marking part and a pocket part are formed on a laminated substrate, but the invention is not limited to this, and a design pattern or the like may be formed on the laminated substrate.

[Brief explanation of the drawing]

1A to 1C are views showing the process of forming a marking part on a laminated substrate by the method of the present invention, FIG. 2 is a perspective view of a laminated substrate manufactured by the same process, and FIG. 3 is a , FIG. 4 is a perspective view of a laminated substrate having a pocket portion manufactured by the method of the present invention, FIG. 4 is a longitudinal cross-sectional side view of a laminated substrate having a marking portion manufactured by a conventional method, and FIG.
FIG. 2 is a longitudinal cross-sectional side view of a laminated substrate having a pocket portion manufactured by a conventional method. In the figure, 1 is a substrate, 2 is an adhesive, 3 is a laminate film, 6 is a marking section, and 7 is a pocket section.

Claims (1)

[Claims] 1 Apply adhesive on the base material leaving a part of the specified shape, press the laminate film on top of it,
A lamination processing method characterized in that the laminate film is further cut out along all or part of the periphery of the predetermined shaped portion to which no adhesive is applied.