JPH0440762U - - Google Patents
Info
- Publication number
- JPH0440762U JPH0440762U JP8283990U JP8283990U JPH0440762U JP H0440762 U JPH0440762 U JP H0440762U JP 8283990 U JP8283990 U JP 8283990U JP 8283990 U JP8283990 U JP 8283990U JP H0440762 U JPH0440762 U JP H0440762U
- Authority
- JP
- Japan
- Prior art keywords
- disposed outside
- crucible
- reflecting plate
- heater section
- cooling pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 239000005416 organic matter Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8283990U JPH0440762U (zh) | 1990-08-03 | 1990-08-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8283990U JPH0440762U (zh) | 1990-08-03 | 1990-08-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0440762U true JPH0440762U (zh) | 1992-04-07 |
Family
ID=31630003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8283990U Pending JPH0440762U (zh) | 1990-08-03 | 1990-08-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0440762U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100430104B1 (ko) * | 2001-09-18 | 2004-05-03 | 디지웨이브 테크놀러지스 주식회사 | 선형 증착과 간접 가열을 이용한 진공증착장치 및 그증착방법 |
JP2006063447A (ja) * | 2004-08-25 | 2006-03-09 | Samsung Sdi Co Ltd | 有機物蒸着装置 |
JP2014125681A (ja) * | 2012-12-26 | 2014-07-07 | Au Optronics Corp | 蒸着装置 |
-
1990
- 1990-08-03 JP JP8283990U patent/JPH0440762U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100430104B1 (ko) * | 2001-09-18 | 2004-05-03 | 디지웨이브 테크놀러지스 주식회사 | 선형 증착과 간접 가열을 이용한 진공증착장치 및 그증착방법 |
JP2006063447A (ja) * | 2004-08-25 | 2006-03-09 | Samsung Sdi Co Ltd | 有機物蒸着装置 |
JP4516499B2 (ja) * | 2004-08-25 | 2010-08-04 | 三星モバイルディスプレイ株式會社 | 有機物蒸着装置 |
JP2014125681A (ja) * | 2012-12-26 | 2014-07-07 | Au Optronics Corp | 蒸着装置 |