JPH0440537U - - Google Patents
Info
- Publication number
- JPH0440537U JPH0440537U JP8154990U JP8154990U JPH0440537U JP H0440537 U JPH0440537 U JP H0440537U JP 8154990 U JP8154990 U JP 8154990U JP 8154990 U JP8154990 U JP 8154990U JP H0440537 U JPH0440537 U JP H0440537U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor device
- groove
- pad portion
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8154990U JPH0440537U (ru) | 1990-07-31 | 1990-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8154990U JPH0440537U (ru) | 1990-07-31 | 1990-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0440537U true JPH0440537U (ru) | 1992-04-07 |
Family
ID=31627600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8154990U Pending JPH0440537U (ru) | 1990-07-31 | 1990-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440537U (ru) |
-
1990
- 1990-07-31 JP JP8154990U patent/JPH0440537U/ja active Pending