JPH0440369A - Semiconductor acceleration sensor - Google Patents

Abstract

PURPOSE:To prevent a sensor chip from breaking by providing pedestals at both ends of the sensor chip and supporting both the ends. CONSTITUTION:The pedestals 12 which are equal in height are provided at both the ends of the sensor chip 11 consisting of a semiconductor which is formed in a long and thin plate shape. A weight 13 is fitted to one end of an arm type base 14 made of a thin and long plate and the other end of the base 14 is coupled with the chip 11 at its lengthwise intermediate position. When acceleration operates, the chip 11 receives the force from the weight 13 and is strained, and an electric signal corresponding to the acceleration is obtained. At this time, the force which operates on the chip 11 from the side of the weight 13 is dispersed in the two directions where the pedestals 12 are present, so even when the force operates on the chip 1 as a bending or torsional force, the chip 11 is prevented from breaking.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an acceleration sensor using a semiconductor chip.

(Prior Art) A conventional semiconductor acceleration sensor has a Δ value as shown in FIG. weight 3
is attached.

In this semiconductor acceleration sensor, the force generated in the weight 3 due to acceleration tends to bend the sensor chip l, so the acceleration is detected by the bending (problem to be solved by the invention). Since the thickness of the sensor chip l is small, there is a problem in that the sensor chip l is easily damaged when it receives an external impact.

An object of the present invention is to provide a semiconductor acceleration sensor whose sensor chip is difficult to damage.

(Means for Solving the Problems) The acceleration sensor of the present invention has a structure in which pedestals are provided at both ends of the sensor chip to support both ends, and a weight is attached to the middle of the sensor chip either directly or via an arm-like support. It is characterized by

[For production]

Since a pedestal is provided at both ends of the sensor chip and the sensor chip is supported at both ends, the strength of the sensor chip is effectively improved. If a weight is attached directly to the sensor chip, a force will be applied depending on the mass and acceleration of the weight, or the position of the sensor chip will be affected. When a weight is attached to the sensor chip via an arm-like support,
In a configuration in which the support body protrudes to one side, a torsional force acts on the sensor chip, and in a symmetrical configuration in which the support body protrudes to both sides by the same length, the torsional force cancels out on both sides and does not act on the sensor chip.

Since the force acting on the sensor chip from the weight due to acceleration corresponds to acceleration, acceleration can be detected in the same way as in the past in any case.

(Embodiment) An embodiment of the present invention is shown in FIG. 1, in which:
] is a sensor chip made of semiconductor, and is formed into a long and thin rectangular plate shape. Reference numeral 12 denotes pedestals, which are provided at both ends of the sensor chip 11 and have the same height. 13 is weighted and attached to one end of an arm-shaped support 14 made of a long JI plate, and the other end of the support 14 is connected to the sensor chip 11 at an intermediate position in the longitudinal direction.

This semiconductor sensor is used by attaching the lower surface of the pedestal 12, 12 to a predetermined base, and connecting lead wires to the electrode portions of the sensor chip 11. When acceleration acts, weight 13
When the sensor 11 receives a force and is distorted, an electrical signal corresponding to the acceleration can be obtained.

In the above embodiment, the weight 13 is attached to the intermediate position of the sensor chip 11 via the support 14, but in addition to this, the sensor chip 1 of the support I4
1 may be extended to the opposite side to the weight 13, and a separate weight may be provided to create a symmetrical structure on both sides.Alternatively, a weight may be directly attached to the intermediate position of the sensor chip 11 to support the support 14. The configuration may be omitted.

(Effects of the Invention) This invention has a structure in which a pedestal is provided at both ends of the sensor chip of a semiconductor acceleration sensor, and both ends are supported, so that the force acting on the sensor chip from the weight side is directed to two directions where the respective pedestals are located. Since it is dispersed, whether the force acts on the sensor chip as a bending force or as a twisting force, it has the effect of preventing damage to the sensor chip.

[Brief explanation of drawings]

FIG. 1 is a perspective view of one embodiment of the present invention, and FIG. 2 is a perspective view showing the configuration of a conventional acceleration sensor. 11...sensor chip, 12...pedestal, 1
3... Weight, 14... Arm-like support. Qi IE21

Claims (1)

[Claims] (1) A semiconductor acceleration sensor characterized in that a pedestal is provided at both ends of a sensor chip to provide a both-end support structure, and a weight is attached to the middle of the sensor chip either directly or via an arm-shaped support.