JPH0438024U - - Google Patents

Info

Publication number

JPH0438024U

JPH0438024U JP7923190U JP7923190U JPH0438024U JP H0438024 U JPH0438024 U JP H0438024U JP 7923190 U JP7923190 U JP 7923190U JP 7923190 U JP7923190 U JP 7923190U JP H0438024 U JPH0438024 U JP H0438024U

Authority

JP

Japan

Prior art keywords

electrode

wetting time

solder wetting

surface mount

mount chip

Prior art date

1990-07-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 5
• 239000000463 material Substances 0.000 claims 6
• 238000009736 wetting Methods 0.000 claims 4
• 239000000758 substrate Substances 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1

Cited By (1)