JPH0436845B2 - - Google Patents

Info

Publication number
JPH0436845B2
JPH0436845B2 JP58232240A JP23224083A JPH0436845B2 JP H0436845 B2 JPH0436845 B2 JP H0436845B2 JP 58232240 A JP58232240 A JP 58232240A JP 23224083 A JP23224083 A JP 23224083A JP H0436845 B2 JPH0436845 B2 JP H0436845B2
Authority
JP
Japan
Prior art keywords
wood
reaction
esterified
epoxy
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58232240A
Other languages
Japanese (ja)
Other versions
JPS60124203A (en
Inventor
Minoru Ueda
Hideaki Matsuda
Koichi Murakami
Masanori Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okura Industrial Co Ltd
Original Assignee
Okura Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okura Industrial Co Ltd filed Critical Okura Industrial Co Ltd
Priority to JP23224083A priority Critical patent/JPS60124203A/en
Publication of JPS60124203A publication Critical patent/JPS60124203A/en
Publication of JPH0436845B2 publication Critical patent/JPH0436845B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08HDERIVATIVES OF NATURAL MACROMOLECULAR COMPOUNDS
    • C08H8/00Macromolecular compounds derived from lignocellulosic materials

Description

【発明の詳細な説明】 本発明は、木材中の水酸基に二塩基酸無水物を
付加したカルボキシル基含有エステル化木材小片
……に対して分子中に2ケ以上のエポキシ基を含
む化合物をカルボキシル基:エポキシ基が当量比
で1.0:0.3〜1.5の範囲で反応させることを特徴と
する成形用化学修飾木材小片の製造法に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION The present invention aims at converting a compound containing two or more epoxy groups in the molecule into a carboxyl group-containing esterified wood piece, which is obtained by adding a dibasic acid anhydride to the hydroxyl group in the wood. The present invention relates to a method for producing chemically modified wood pieces for molding, characterized in that the reaction is carried out in an equivalent ratio of groups: epoxy groups in the range of 1.0:0.3 to 1.5.

石油や石炭等の化石資源は現在、工業用原料と
して多量に用いられているが、それらは埋蔵量に
限界があり、先行きが心配されている。一方、木
材は再生可能な資源であり、従来より色々な分野
に利用されている。しかしながら、小径木、間伐
材等の未利用木材の有効な利用法はあまり進んで
おらず、また、木材を使用する工業において工業
廃棄物として副生する木材小片などについても一
層有効な利用法の開発が望まれているのが現状で
ある。
Fossil resources such as oil and coal are currently used in large quantities as industrial raw materials, but their reserves are limited and there are concerns about their future prospects. On the other hand, wood is a renewable resource and has been used in various fields. However, the effective use of unused wood such as small-diameter trees and thinned wood has not progressed much, and even more effective methods have been developed for the use of small pieces of wood, which are produced as industrial waste in industries that use wood. The current situation is that development is desired.

それらの利用法の中で従来から行われている一
つの方法として、木材小片、特に木粉を熱可塑性
樹脂や熱硬化性樹脂等のプラスチツクに混入して
充填剤や増量剤として使用する技術は良く知られ
ている。しかしながら、このような利用法では木
粉がこれらの樹脂に物理的に混合され、樹脂中に
単に分散された状態で内在されているだけであ
る。また、樹脂中に添加する木粉の量が多くなる
に従つて、木材中の水分吸着能をもつ水酸基の数
が多くなり、得られたプラスチツク成形品は吸
水、吸湿による寸法安定性が悪くなる傾向が見ら
れる。従つて、プラスチツクに充填剤や増量剤と
して混入する木粉の量には限界があつた。
One of the conventional methods of using these materials is to mix small pieces of wood, especially wood flour, into plastics such as thermoplastic resins and thermosetting resins and use them as fillers and extenders. well known. However, in such applications, the wood flour is physically mixed with these resins and is merely incorporated therein in a dispersed state. Additionally, as the amount of wood flour added to the resin increases, the number of hydroxyl groups in the wood that have the ability to adsorb moisture increases, resulting in poor dimensional stability due to water absorption and moisture absorption of the resulting plastic molded product. A trend can be seen. Therefore, there was a limit to the amount of wood flour that could be mixed into plastics as a filler or extender.

一方、これまでに木粉の吸水及び吸湿による寸
法安定性を改良する目的で、木粉を無水酢酸等で
アセチル化処理する方法が知られている。また、
木粉に熱可塑性を付与する目的で、木粉をラウリ
ン酸等の高級脂肪酸でエステル化処理する方法が
知られている。しかしながら、このような公知の
方法で得られたエステル化木粉はそれ自体架橋性
がないために成形用として利用する場合には接着
剤を使用することがあつた。また、熱圧によりエ
ステル化木粉を可塑化してプラスチツク化シート
を作製したとしても機械的強度が弱いものであつ
た。
On the other hand, a method of acetylating wood flour with acetic anhydride or the like has been known for the purpose of improving the water absorption and dimensional stability of wood flour due to moisture absorption. Also,
A known method is to esterify wood flour with a higher fatty acid such as lauric acid in order to impart thermoplasticity to the wood flour. However, since the esterified wood flour obtained by such a known method does not have crosslinking properties, an adhesive has sometimes been used when it is used for molding. Further, even if a plasticized sheet was produced by plasticizing the esterified wood flour by hot pressing, the mechanical strength was weak.

また、本発明者らは、先に、木材小片に二塩基
酸無水物を反応させて、木材中の水酸基をエステ
ル化することにより、側鎖にカルボキシル基を有
するエステル化木材小片を得ること、及び得られ
たエステル化木材小片が熱圧により容易に可塑化
し得ることを見い出した。しかしながら、このよ
うなカルボキシル基含有エステル化木材小片は高
温下、水及び湿気に不安定であり、高温高湿(例
えば、40℃、95%RH)中に長時間放置すると、
エステル結合部が一部加水分解により切断される
という欠点があつた。また、前記と同様に熱圧に
よりカルボキシル基含有エステル化木材小片を可
塑化してプラスチツク化シートを作成したとして
も、得られたプラスチツク化シートは耐水性、そ
の他機械的強度の弱いものであつた。
In addition, the present inventors first reacted a dibasic acid anhydride to a small piece of wood to esterify the hydroxyl group in the wood, thereby obtaining an esterified wood piece having a carboxyl group in the side chain. It has also been found that the resulting esterified wood chips can be easily plasticized by hot pressure. However, such carboxyl group-containing esterified wood chips are unstable to water and moisture at high temperatures, and if left in high temperature and high humidity (e.g. 40℃, 95%RH) for a long time,
There was a drawback that the ester bond was partially cleaved by hydrolysis. Further, even if a plasticized sheet was prepared by plasticizing small pieces of carboxyl group-containing esterified wood using heat and pressure in the same manner as described above, the resulting plasticized sheet had poor water resistance and other mechanical strengths.

本発明者らは、上記の実状にかんがみ、鋭意研
究を重ねたところ、木材中の水酸基に二塩基酸無
水物を付加したカルボキシル基含有エステル化木
材小片……に対して分子中に2ケ以上のエポキシ
基を含む化合物をカルボキシル基:エポキシ基が
当量比で1.0:0.3〜1.5の範囲で反応させることに
より、架橋性を有し、組成によつては優れた熱可
塑的性質が付与された成形用化学修飾木材小片が
得られることを見い出し、本発明に至つたのであ
る。
In view of the above-mentioned circumstances, the present inventors have conducted intensive research and found that esterified wood particles containing carboxyl groups, in which dibasic acid anhydrides are added to the hydroxyl groups in the wood, have two or more molecules in the molecule. By reacting a compound containing an epoxy group with an equivalent ratio of carboxyl group to epoxy group in the range of 1.0:0.3 to 1.5, it has crosslinking properties and depending on the composition, excellent thermoplastic properties are imparted. It was discovered that chemically modified wood pieces for molding can be obtained, leading to the present invention.

即ち、本発明は木材中の水酸基に二塩基酸無水
物を付加したカルボキシル基含有エステル化木材
小片……に対して分子中に2ケ以上のエポキシ基
を含む化合物をカルボキシル基:エポキシ基が当
量比で1.0:0.3〜1.5の範囲で反応させることによ
り、エステル化木材小片のカルボキシル基がエポ
キシ化合物中いのエポキシ基と付加エステル化反
応を起して、エステル化木材小片に該エポキシ化
合物を付加結合させた成形用化学修飾木材小片の
製造法を提供するものである。
That is, the present invention uses a carboxyl group-containing esterified wood piece obtained by adding a dibasic acid anhydride to the hydroxyl group in the wood. By reacting at a ratio of 1.0:0.3 to 1.5, the carboxyl groups of the esterified wood pieces undergo an addition esterification reaction with the epoxy groups in the epoxy compound, and the epoxy compound is added to the esterified wood pieces. A method for producing bonded, moldable, chemically modified wood pieces is provided.

本発明の製造法によつて得られた成形用化学修
飾木材小片は、木材工業において工業廃棄物とし
て副生する木粉等が主成分であるため、産業上価
値が大であるとともに、高温下においても水及び
湿気に安定な優れた特性を有する成形品を与える
ことができるものである。
The chemically modified wood pieces for molding obtained by the production method of the present invention have great industrial value and can be used under high temperature It is also possible to provide molded products having excellent properties that are stable against water and moisture.

本発明において使用するカルボキシル基含有エ
ステル化木材小片とは、木材小片に二塩基酸無水
物を反応させ、木材組成中に含まれているセルロ
ース、ヘミセルロース、リグニン等の化学成分中
の水酸基をエステル化することにより、木材小片
中にカルボキシル基を化学的に導入したものであ
る。
The carboxyl group-containing esterified wood chips used in the present invention are made by reacting the wood chips with a dibasic acid anhydride to esterify the hydroxyl groups in chemical components such as cellulose, hemicellulose, and lignin contained in the wood composition. By doing so, carboxyl groups are chemically introduced into small pieces of wood.

木材小片の種類としては、木材チツプ、木材繊
維、微細化した木粉等があり、原木、樹種には特
に制限はない。例えば、赤マツ、スギ、ヒノキ、
カバ、ラジアタパイン、ラワン等が使用される。
Types of small pieces of wood include wood chips, wood fibers, finely divided wood powder, etc., and there are no particular restrictions on the raw wood or tree species. For example, red pine, cedar, cypress,
Birch, radiata pine, lauan, etc. are used.

また、二塩基酸無水物とはジカルボン酸無水物
であり、具体的には無水マレイン酸、無水コハク
酸、無水フタル酸、無水テトラヒドロフタル酸、
無水テトラプロムフタル酸、無水ヘキサヒドロフ
タル酸、無水3.6ジクロルフタル酸、無水4.5ジク
ロルフタル酸、、無水イタコン酸等が挙げられる。
特に工業的に有利で低廉な無水マレイン酸、無水
コハク酸、無水フタル酸等が好ましい。木材小片
と二塩基酸無水物とのエステル化反応は無触媒下
でも充分に進行するが、反応を促進させるために
炭酸ナトリウム、ジメチルベンジルアミン、ピリ
ジン等の塩基性触媒を用いてもよい。また、エス
テル化反応はメチルホルムアミド、ジメチルスル
ホキシド等の溶媒中で反応を行つてもよい。ま
た、無溶媒下で直接木材小片に二塩基酸無水物を
添加し、反応温度60℃以上で加熱攪拌することに
より、付加によるエステル化反応が円滑に進み、
木材小片に二塩基酸無水物が容易に付加して種々
の付加率のカルボキシル基含有エステル化木材小
片を得ることができる。上記の溶媒中または無溶
媒下でのエステル化反応において、二塩基酸無水
物の添加量は乾燥木材小片に対して好ましくは5
〜200重量%、より好ましくは10〜80重量%であ
る。カルボキシル基含有エステル化木材小片の二
塩基酸無水物の付加率は乾燥木材小片を基準とし
て好ましくは5〜120重量%、より好ましくは10
〜70重量%である。反応後、反応生成物を洗浄し
て、乾燥し、本発明において使用するカルボキシ
ル基含有エステル化木材小片を得るのである。ま
た、未反応の無水酸の量が少い場合には、反応
後、反応生成物を洗浄しないで、そのまま本発明
において使用するカルボキシル基含有エステル化
木材小片として用いてもよい。この少量の無水酸
の存在は本発明の実施において何ら不都合を生じ
ない。
In addition, dibasic acid anhydrides are dicarboxylic acid anhydrides, specifically maleic anhydride, succinic anhydride, phthalic anhydride, tetrahydrophthalic anhydride,
Examples include tetrapromphthalic anhydride, hexahydrophthalic anhydride, 3.6-dichlorophthalic anhydride, 4.5-dichlorophthalic anhydride, and itaconic anhydride.
Particularly preferred are maleic anhydride, succinic anhydride, phthalic anhydride, etc., which are industrially advantageous and inexpensive. Although the esterification reaction between the wood chips and the dibasic acid anhydride proceeds satisfactorily even in the absence of a catalyst, a basic catalyst such as sodium carbonate, dimethylbenzylamine, or pyridine may be used to accelerate the reaction. Further, the esterification reaction may be carried out in a solvent such as methylformamide or dimethyl sulfoxide. In addition, by adding the dibasic acid anhydride directly to a small piece of wood in the absence of a solvent and heating and stirring at a reaction temperature of 60°C or higher, the esterification reaction by addition proceeds smoothly.
Dibasic acid anhydride can be easily added to wood chips to obtain carboxyl group-containing esterified wood chips with various addition rates. In the above-mentioned esterification reaction in a solvent or without a solvent, the amount of dibasic acid anhydride added is preferably 5 to 50% per dry wood piece.
-200% by weight, more preferably 10-80% by weight. The addition rate of dibasic acid anhydride to the carboxyl group-containing esterified wood chips is preferably 5 to 120% by weight, more preferably 10% by weight based on the dry wood chips.
~70% by weight. After the reaction, the reaction product is washed and dried to obtain carboxyl group-containing esterified wood pieces used in the present invention. Further, when the amount of unreacted acid anhydride is small, the reaction product may be used as it is as a carboxyl group-containing esterified wood piece used in the present invention without washing after the reaction. The presence of this small amount of acid anhydride does not cause any disadvantage in the practice of the invention.

本発明において使用する分子中に2ケ以上のエ
ポキシ基を含む化合物としては、例えば、ビスフ
エノールAとエピクロルヒドリンより得られるビ
スフエノール型エポキシ化合物、フエノール樹脂
とエピクロルヒドリンより得られるノポラツク型
エポキシ化合物、ハロゲン化ビスフエノールAと
エピクロルヒドリンより得られるハロゲン化エポ
キシ化合物、ボリアルキレングリコールとエピク
ロルヒドリンより得られるボリアルキレンエーテ
ル型エポキシ化合物、ポリブタジエンの二重結合
部分を過酢酸等によりエポキシ化したポリブタジ
エン型エポキシ化合物、その他、ジイソシアネー
トとグリシドールから得られるエポキシ化合物、
ビニル化合物とグリシジルアクリレートまたはメ
タクリレートとの共重合体等が挙げられる。特に
工業的に多量生産されており、かつ、安価に入手
できるビスフエノール型エポキシ化合物が好まし
い。
Examples of compounds containing two or more epoxy groups in the molecule used in the present invention include bisphenol type epoxy compounds obtained from bisphenol A and epichlorohydrin, nopolak type epoxy compounds obtained from phenolic resin and epichlorohydrin, and halogenated Halogenated epoxy compounds obtained from bisphenol A and epichlorohydrin, polyalkylene ether type epoxy compounds obtained from polyalkylene glycol and epichlorohydrin, polybutadiene type epoxy compounds obtained by epoxidizing the double bond portion of polybutadiene with peracetic acid, etc., and other diisocyanates. and epoxy compounds obtained from glycidol,
Examples include copolymers of vinyl compounds and glycidyl acrylate or methacrylate. Particularly preferred are bisphenol type epoxy compounds that are industrially produced in large quantities and available at low cost.

これらエポキシ化合物の使用量はエステル化木
材小片中のカルボキシル基1当量に対してエポキ
シ基が0.3〜1.5当量になるようにする。好ましく
は0.8〜1.2当量になるようにするのがよい。エポ
キシ基が0.3当量未満では、未反応の該エステル
化木材小片の量が多くなりすぎ、得られる化学修
飾木材小片の酸価が高くなり好ましくない。ま
た、1.5当量を超えると、エポキシ化合物の未反
応物が化学修飾木材小片中に残存するだけでな
く、経済的にも高くつくので好ましくない。な
お、エステル化木材小片に未反応の二塩基酸無水
物が存在している場合には、二塩基酸無水物の無
水酸基と同当量のエポキシ基になるようエポキシ
化合物を上記に追加することが好ましい。この場
合には、副反応として無水酸とエポキシ化合物と
の反応も起り、この反応生成物は本発明において
得られる成形用化学修飾木材小片に共存するが、
最終成形品には何ら悪影響をきたさない。
The amount of these epoxy compounds used is such that the amount of epoxy groups is 0.3 to 1.5 equivalents per equivalent of carboxyl group in the esterified wood chips. The amount is preferably 0.8 to 1.2 equivalents. If the amount of epoxy groups is less than 0.3 equivalent, the amount of unreacted esterified wood pieces becomes too large, and the resulting chemically modified wood pieces have a high acid value, which is not preferable. Further, if the amount exceeds 1.5 equivalents, not only unreacted epoxy compounds remain in the chemically modified wood pieces, but also it is economically expensive, which is not preferable. In addition, if unreacted dibasic acid anhydride exists in the esterified wood chips, an epoxy compound may be added to the above so that the epoxy group has the same amount as the anhydride group of the dibasic acid anhydride. preferable. In this case, a reaction between the acid anhydride and the epoxy compound also occurs as a side reaction, and this reaction product coexists in the chemically modified wood pieces for molding obtained in the present invention.
It does not have any negative effect on the final molded product.

次に、本発明の製造法を手順を追つて説明す
る。まず、木材小片は真空乾燥器や熱風乾燥器等
により乾燥して、水分を木材含水率5%以下に除
去して使用するのが好ましい。次に、木材中の水
酸基に二塩基酸無水物を付加したカルボキシル基
含有エステル化木材小片の製造は前記したとおり
であり、このようにして木材小片に二塩基酸無水
物を付加エステル化反応させた後、一般的には、
反応生成物をアセトン及び水等で洗浄して乾燥さ
せる。得られたエステル化木材小片は、木材中の
水酸基が二塩基酸無水物と開環エステル化反応を
起して、木材小片に二塩基酸無水物が付加され、
側鎖にカルボキシル基が導入されていることが赤
外線吸収スペクトルの分析結果より明白に認めら
れる。このエステル化木材小片を本発明において
使用するカルボキシル基含有エステル化木材小片
として用いるのである。また、前述の如く未反応
の二塩基酸無水物が少ない場合には上記反応生成
物を洗浄しないで、このまま本発明において使用
するエステル化木材小片として用いてもよい。
Next, the manufacturing method of the present invention will be explained step by step. First, it is preferable to dry the small pieces of wood using a vacuum dryer, hot air dryer, etc. to remove moisture to a wood moisture content of 5% or less before use. Next, the production of carboxyl group-containing esterified wood pieces in which a dibasic acid anhydride is added to the hydroxyl groups in the wood is as described above, and in this way, the wood pieces are subjected to an addition esterification reaction with a dibasic acid anhydride. After that, generally
The reaction product is washed with acetone, water, etc. and dried. The obtained esterified wood pieces undergo a ring-opening esterification reaction between the hydroxyl groups in the wood and the dibasic acid anhydride, and the dibasic acid anhydride is added to the wood pieces.
It is clearly recognized from the infrared absorption spectrum analysis that a carboxyl group has been introduced into the side chain. These esterified wood pieces are used as carboxyl group-containing esterified wood pieces used in the present invention. Further, as described above, when the amount of unreacted dibasic acid anhydride is small, the reaction product may be used as it is as the esterified wood pieces used in the present invention without being washed.

次に、上記のカルボキシル基含有エステル化木
材小片…に対して分子中に2ケ以上のエポキシ基
を含む化合物をカルボキシル基:エポキシ基が当
量比で1.0:0.3〜1.5の範囲で反応させるのであ
る。反応方法は特別に限定しない。しかし、低温
で反応する場合には長時間必要とするため、一般
には高温反応が好ましい。ここでは反応容器中で
の加熱攪拌について述べる。この場合はカルボキ
シル基含有エステル化木材小片と上記エポキシ化
合物を、攪拌機付きの反応容器に添加して、所定
温度で加熱攪拌することにより行う。エポキシ化
合物としては前記したビスフエノール型エポキシ
化合物が好ましい。分子量が大きくなれば成形加
工した場合の架橋密度が減少するので通常200〜
2000程度の平均分子量のものがよく、更には、液
状タイプのものが好ましい。また、場合によつて
は希釈剤として、エポキシ化合物に対して反応性
を有しない溶媒、例えば、キシレン、フタル酸ジ
ブチル、フタル酸ジオクチル、リン酸トリクレジ
ル等をエポキシ化合物に適当に配合して、溶解し
てからエステル化木材小片に添加してもよい。ま
た、エステル化木材小片とエポキシ化合物との付
加エステル化反応は無触媒下でも充分に進行する
が、反応を促進させるために炭酸ナトリウム、ジ
メチルベンジルアミン等の塩基性触媒を用いても
よい。反応温度はエポキシ化合物の種類によつて
異なるが、80℃〜200℃の範囲が好ましい。反応
時間は1〜10時間が好ましい。
Next, the above carboxyl group-containing esterified wood pieces are reacted with a compound containing two or more epoxy groups in the molecule at an equivalent ratio of carboxyl group:epoxy group of 1.0:0.3 to 1.5. . The reaction method is not particularly limited. However, since a long time is required when the reaction is carried out at a low temperature, a high temperature reaction is generally preferred. Here, heating and stirring in the reaction vessel will be described. In this case, the carboxyl group-containing esterified wood pieces and the above-mentioned epoxy compound are added to a reaction vessel equipped with a stirrer, and the mixture is heated and stirred at a predetermined temperature. As the epoxy compound, the above-mentioned bisphenol type epoxy compound is preferred. As the molecular weight increases, the crosslinking density decreases when molded, so it is usually 200~
It is preferable to have an average molecular weight of about 2000, and more preferably a liquid type. In some cases, as a diluent, a solvent that does not have reactivity with the epoxy compound, such as xylene, dibutyl phthalate, dioctyl phthalate, tricresyl phosphate, etc., may be appropriately blended with the epoxy compound to dissolve it. and then added to the esterified wood chips. Further, although the addition esterification reaction between the esterified wood chips and the epoxy compound proceeds satisfactorily even without a catalyst, a basic catalyst such as sodium carbonate or dimethylbenzylamine may be used to accelerate the reaction. The reaction temperature varies depending on the type of epoxy compound, but is preferably in the range of 80°C to 200°C. The reaction time is preferably 1 to 10 hours.

反応時間の経過とともにエステル化木材小片の
カルボキシル基とエポキシ化合物のエポキシ基が
エステル化反応を起して付加結合される。反応は
カルボキシル基とエポキシ基が部分的に結合され
た段階で止めることが好ましい。この部分的にエ
ポキシ化合物が付加結合された成形用化学修飾木
材小片は熱圧成形した場合に、可塑化され易く、
且つ可塑化と同時或は可塑化後架橋反応が更に進
行して固くて強い木質成形品を与えることができ
るのである。しかし、本発明においては、少くと
も系中に未反応のフリーなエポキシ化合物が存在
しない程度に反応を行わすことが必要である。未
反応のフリーなエポキシ化合物が多く存在する
と、熱圧成形の際に高圧を加えるとそれが系外に
除かれて不経済であるからである。
As the reaction time progresses, the carboxyl groups of the esterified wood chips and the epoxy groups of the epoxy compound undergo an esterification reaction and are additionally bonded. It is preferable to stop the reaction at the stage where the carboxyl group and the epoxy group are partially bonded. When this chemically modified wood piece for molding, to which an epoxy compound is partially added and bonded, is easily plasticized when hot-press molded,
In addition, the crosslinking reaction proceeds simultaneously with the plasticization or after the plasticization, making it possible to provide a hard and strong wood molded product. However, in the present invention, it is necessary to carry out the reaction at least to the extent that no unreacted free epoxy compound is present in the system. This is because if there is a large amount of unreacted free epoxy compound, it will be removed from the system when high pressure is applied during hot press molding, which is uneconomical.

以上の如くして本発明の成形用化学修飾木材小
片を得るのであるが、場合によつては反応生成物
をアセトン等で洗浄して精製してもよい。
The chemically modified wood pieces for molding of the present invention are obtained in the manner described above, but depending on the case, the reaction product may be purified by washing with acetone or the like.

前述の如く、版はの製造法により得られた成形
用化学修飾木材小片は木材小片中の側鎖のカルボ
キシル基にエポキシ化合物のエポキシ基が付加結
合されて得られるものであり、架橋性を有してお
り、高温下、水及び湿気に安定な優れた特性を有
する成形品を与えることができるものである。
As mentioned above, the chemically modified wood pieces for molding obtained by the production method of the plate are obtained by adding the epoxy group of an epoxy compound to the side chain carboxyl group in the wood pieces, and have crosslinking properties. This makes it possible to provide molded products with excellent properties that are stable against water and humidity at high temperatures.

また、本発明の製造法により得られた成形用化
学修飾木材小片は、木材工業において工業廃棄物
として副生する木材小片が主原料であり、木材の
もつ軽くて加工性の優れた特性を有する成形品を
与えることができるものであり、該成形用化学修
飾木材小片を熱圧加工して得られた成形品は多く
の分野において工業用部品材料として好適なもの
である。
In addition, the chemically modified wood pieces for molding obtained by the production method of the present invention are mainly made from wood pieces produced as industrial waste in the wood industry, and have the characteristics of light weight and excellent workability of wood. It is possible to give molded articles, and the molded articles obtained by heat-pressing the chemically modified wood pieces for molding are suitable as materials for industrial parts in many fields.

次に本発明を実施例により更に具体的に説明す
るが、本発明はこれらに制限されるものではな
い。
Next, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto.

参考例 1 24メツシユ篩を通過した赤松材の乾燥木粉(含
水率5%以下)15.0部、無水コハク酸60.0部触媒
として炭酸ナトリウム0.32部を反応容器に添加し
て、110℃で6時間攪拌下に反応せしめてカルボ
キシル基含有エステル化木粉(以下、エステル化
木粉と称す。)を得た。このエステル化木粉の木
粉に付加された無水コハク酸の付加率は木粉を基
準として46.7重量%であつた。
Reference Example 1 15.0 parts of dried red pine wood powder (moisture content 5% or less) passed through a 24-mesh sieve, 60.0 parts of succinic anhydride, and 0.32 parts of sodium carbonate as a catalyst were added to a reaction vessel and stirred at 110°C for 6 hours. A carboxyl group-containing esterified wood flour (hereinafter referred to as esterified wood flour) was obtained by the following reaction. The addition rate of succinic anhydride added to the wood flour of this esterified wood flour was 46.7% by weight based on the wood flour.

実施例 1 参考例1で得たエステル化木粉100部に、三井
石油化学エポキシ(株)製EPOMIK R139、エ
ポキシ当量180〜190のビスフエノールAのジグリ
シジルエーテル(以下、ビスフエノールAのジグ
リシジルエーテルと称す。)45部を反応容器に添
加して、140℃で6時間攪拌下に反応せしめて成
形用化学修飾木粉を得た。更に粉末状反応生成物
から一部を取り出し、ソツクスレー抽出器を用い
てアセトン洗浄した後、乾燥した。その後、成形
用化学修飾木粉のエステル化木粉に付加されたビ
スフエノールAのジグリシジルエーテルの付加率
を測定したところ、エステル化木粉を基準として
35.6重量%であつた。
Example 1 To 100 parts of the esterified wood flour obtained in Reference Example 1, EPOMIK R139 manufactured by Mitsui Petrochemical Epoxy Co., Ltd., diglycidyl ether of bisphenol A (hereinafter referred to as diglycidyl ether of bisphenol A) having an epoxy equivalent of 180 to 190 was added. (referred to as ether) was added to a reaction vessel and reacted at 140° C. for 6 hours with stirring to obtain chemically modified wood flour for molding. Further, a portion of the powdered reaction product was taken out, washed with acetone using a Soxhlet extractor, and then dried. After that, when we measured the addition rate of diglycidyl ether of bisphenol A added to the esterified wood flour of chemically modified wood flour for molding, we found that
It was 35.6% by weight.

応用例 1 実施例1で得た成形用化学修飾木粉をホツトプ
レスを用いて、180℃、500Kg/cm2、60分間の条件
下で熱圧成形に供したところ、厚さ0.6mmで表面
平滑性の優れた赤褐色半透明な可塑化されたボー
ドが得られた。この可塑化されたボードは強靱で
硬く、高温高湿試験(試験片を40℃、95%RH中
に3日間置いた後、80℃で乾燥して試験片の表面
を観察した。)において全く変化がなかつた。
Application example 1 When the chemically modified wood powder for molding obtained in Example 1 was subjected to hot pressure molding under the conditions of 180°C, 500 kg/cm 2 and 60 minutes using a hot press, the surface was smooth with a thickness of 0.6 mm. A reddish-brown translucent plasticized board with excellent properties was obtained. This plasticized board was tough and hard, and showed no resistance in high-temperature, high-humidity tests (after placing the test piece in 40°C and 95% RH for 3 days, drying it at 80°C and observing the surface of the test piece). There was no change.

比較例 1 参考例1で得たエステル化木粉をホツトプレス
を用いて、180℃、500Kg/cm2、10分間の条件下で
熱圧成形に供したところ、厚さ0.6mmの褐色半透
明な可塑化されたボードが得られた。この可塑化
されたボードは柔らかくて強度の弱いものであ
り、また高温高湿試験においても、ボード表面に
白い粉末が見られ、耐水性の弱いものであつた。
Comparative Example 1 When the esterified wood flour obtained in Reference Example 1 was subjected to hot pressure molding at 180°C, 500 kg/cm 2 for 10 minutes using a hot press, a brown translucent product with a thickness of 0.6 mm was formed. A plasticized board was obtained. This plasticized board was soft and had low strength, and white powder was observed on the board surface even in high temperature and high humidity tests, and water resistance was low.

参考例 2 24メツシユ篩を通過した赤松材の乾燥木粉(含
水率5%以下)15.0部、無水マレイン酸60.0部、
触媒として炭酸ナトリウム0.32部を反応容器に添
加して、120℃で6時間攪拌下に反応せしめてエ
ステル化木粉を得た。このエステル化木粉の木粉
に付加された無水マレイン酸の付加率は木粉を基
準として50.1重量%であつた。
Reference example 2 15.0 parts of dried red pine wood powder (moisture content 5% or less) passed through a 24 mesh sieve, 60.0 parts of maleic anhydride,
0.32 parts of sodium carbonate as a catalyst was added to the reaction vessel, and the mixture was reacted at 120°C for 6 hours with stirring to obtain esterified wood flour. The addition rate of maleic anhydride added to the wood flour of this esterified wood flour was 50.1% by weight based on the wood flour.

実施例 2 参考例2で得たエステル化木粉100部に、ビス
フエノールAのジグリシジルエーテル45部を反応
容器に添加して、140℃で6時間攪拌下に反応せ
しめて成形用化学修飾木粉を得た。この反応生成
物はかたい固形状となつたため、粉砕機で粉砕さ
せた。
Example 2 45 parts of diglycidyl ether of bisphenol A was added to 100 parts of the esterified wood flour obtained in Reference Example 2 in a reaction vessel, and the mixture was reacted with stirring at 140°C for 6 hours to produce chemically modified wood for molding. Got the powder. Since this reaction product was in a hard solid state, it was ground in a grinder.

応用例 2 実施例2で得た成形用化学修飾木粉をホツトプ
レスを用いて、180℃、500Kg/cm2、40分間の条件
下で熱圧成形に供したところ、厚さ0.6mmで表面
滑性の優れた光沢のある黒褐色のボードが得られ
た。このボードは強靱で硬く、高温高湿試験にお
いて全く変化がなかつた。
Application example 2 When the chemically modified wood powder for molding obtained in Example 2 was subjected to hot pressure molding at 180°C, 500 kg/cm 2 and 40 minutes using a hot press, it was found to have a thickness of 0.6 mm and a smooth surface. A glossy black-brown board with excellent properties was obtained. This board is strong and hard, and did not change at all during high temperature and high humidity tests.

比較例 2 参考例2で得たエステル化木粉をホツトプレス
を用いて、180℃、500Kg/cm2、10分間の条件下で
熱圧成形に供したところ、厚さ0.6mmの赤褐色半
透明な可塑化されたボードが得られた。この可塑
化されたボードは柔らかくて強度の弱いものであ
り、また高温高湿試験においても、ボード表面に
一部白い粉末が見られ、耐水性の弱いものであつ
た。
Comparative Example 2 The esterified wood flour obtained in Reference Example 2 was subjected to hot pressure molding at 180°C, 500 kg/cm 2 for 10 minutes using a hot press, and a reddish-brown translucent product with a thickness of 0.6 mm was obtained. A plasticized board was obtained. This plasticized board was soft and had low strength, and even in a high temperature and high humidity test, some white powder was observed on the surface of the board, indicating that it had low water resistance.

Claims (1)

【特許請求の範囲】[Claims] 1 木材中の水酸基に二塩基酸無水物を付加した
カルボキシル基含有エステル化木材小片に対して
分子中に2ケ以上のエポキシ基を含む化合物をカ
ルボキシル基:エポキシ基が当量比で1.0:0.3〜
1.5の範囲で反応させることを特徴とする成形用
化学修飾木材小片の製造法。
1. A compound containing two or more epoxy groups in the molecule is added to a carboxyl group-containing esterified wood piece obtained by adding a dibasic acid anhydride to the hydroxyl group in the wood at an equivalent ratio of carboxyl group:epoxy group of 1.0:0.3~
A method for producing chemically modified wood pieces for molding, characterized in that the reaction is carried out in a range of 1.5.
JP23224083A 1983-12-10 1983-12-10 Manufacture of chemical decorative wooden chip for forming Granted JPS60124203A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23224083A JPS60124203A (en) 1983-12-10 1983-12-10 Manufacture of chemical decorative wooden chip for forming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23224083A JPS60124203A (en) 1983-12-10 1983-12-10 Manufacture of chemical decorative wooden chip for forming

Publications (2)

Publication Number Publication Date
JPS60124203A JPS60124203A (en) 1985-07-03
JPH0436845B2 true JPH0436845B2 (en) 1992-06-17

Family

ID=16936163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23224083A Granted JPS60124203A (en) 1983-12-10 1983-12-10 Manufacture of chemical decorative wooden chip for forming

Country Status (1)

Country Link
JP (1) JPS60124203A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311334A (en) * 1986-07-03 1988-01-18 大倉工業株式会社 Manufacture of woody system molded board
JPS6354204A (en) * 1986-08-26 1988-03-08 大倉工業株式会社 Manufacture of improved wood
JPS63102905A (en) * 1986-10-17 1988-05-07 Hokkaido Preparation of water-resistant particle board and fiber board
JPH02145339A (en) * 1988-11-29 1990-06-04 Okura Ind Co Ltd Manufacture of surface cured woody decoration plate
JP4280888B2 (en) * 2001-03-23 2009-06-17 独立行政法人産業技術総合研究所 Process for producing biodegradable polycarboxylic acid ester / carboxylic acid
JP4304251B2 (en) * 2005-09-09 2009-07-29 独立行政法人産業技術総合研究所 Method for producing epoxy resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587308A (en) * 1981-07-03 1983-01-17 大建工業株式会社 Manufacture of decorative wood
JPS5825904A (en) * 1981-08-08 1983-02-16 大建工業株式会社 Method of improving woody material
JPS58148748A (en) * 1982-03-02 1983-09-03 伊藤 禎美 Method of molding paper cone

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587308A (en) * 1981-07-03 1983-01-17 大建工業株式会社 Manufacture of decorative wood
JPS5825904A (en) * 1981-08-08 1983-02-16 大建工業株式会社 Method of improving woody material
JPS58148748A (en) * 1982-03-02 1983-09-03 伊藤 禎美 Method of molding paper cone

Also Published As

Publication number Publication date
JPS60124203A (en) 1985-07-03

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