JPH0435317B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to cutting of an enamel plate whose surface is coated with vitreous enamel. In particular, it is used for dividing and cutting enamel plates used as substrates for electronic parts and the like.

BACKGROUND ART Conventionally, there are almost no special technologies related to the above-mentioned fields. A cutting method commonly used for hard materials is used, in which a circumferential blade with diamond powder fixed to the tip is rotated to cut the material, or a fusion cutting method, such as burning gas and irradiating its arc, is used. .

Further, as a similar technique, there is a method or apparatus for cutting a wired glass plate. This is related to the cutting of reinforcing glass plates with metal mesh, which are construction materials. It is similar to cutting an enameled metal plate in the sense that it is a technique for cutting a plate made of laminated glass and metal. This wired glass plate was cut by a method as shown in the cutaway diagram of FIG. 2, as disclosed in, for example, Japanese Patent Publication No. 1405/1983. That is, in order to cut the glass plate 1 containing the metal mesh 2a into two parts 7 and 8, cutting lines 4 are placed at the desired cutting locations as shown in FIG. 2A. Next, as shown in Fig. 2B, break the glass plate in the same way as a normal glass plate (at this time, the mesh 2a is made of metal, so it has not been cut yet), and then, as shown in Fig. 2C,
By relatively moving parts 7 and 8, net 2a is created.
It is for cutting.

Problems to be Solved by the Invention In the conventional cutting method using a diamond blade, the cutting speed is slow, the diamond blade is expensive as it wears out as it cuts, and the blade quickly becomes clogged with chips from the metal part of the enamel plate. It has the disadvantage of causing a large amount of waste, making it unsuitable for industries that process large quantities.

In addition, with melt cutting methods such as gas combustion solar radiation, the temperature of the enamel plate becomes extremely high.
Cutting with other items such as electronic components mounted on the enamel board has the disadvantage that there is a risk of damaging the items on the board, and the processing speed is not very fast. Ta.

Next is a method for cutting wired glass plates, but even if this method is applied to enamel plates, it is difficult to cut the metal parts of enamel plates because the thickness of the metal part is generally thicker than the thickness of the glass part. .

The present invention solves these problems,
The purpose is to enable reliable cutting in an inexpensive manner.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a cutting method in which two parallel cutting lines are formed on the surface of a substrate and shearing is performed between the two cutting lines.

Effects The present invention has the above-mentioned configuration in which two mutually parallel cutting lines are formed in the surface glass layer, so that cracks and nail skipping of the glass layer that occur when shearing are prevented from progressing by the two cutting lines. It stops, does not spread beyond that point, and can easily cut large quantities of enamel plates with little cutting loss.

Embodiment FIG. 1 is a sectional view sequentially showing an embodiment of the method for cutting an enamel plate of the present invention. As shown in FIG. 1A, electronic components and their wiring conductors 13 are mounted on an enamel plate having a glass enamel layer 11 with a thickness of about 0.1 mm on a steel plate 12 with a thickness of about 0.5 mm.

As shown in FIG. 1B, two parallel cuts 14 are cut into this enamel plate with a distance of about 2 mm from each other using a glass cutter blade. Thereafter, by using a shearing machine having a pedestal 15 and a blade 16 as shown in FIG. 1C, the blade 16 is moved in the direction of the arrow to shear, resulting in cutting and division as shown in FIG. 1D.

As shown in the figure, the enamel glass 11a between the two cut lines has cracks and chipped nails, but the enamel glass 11b outside thereof is not damaged. Therefore, the enamel plate can be cut without damaging any electronic parts or the like on the enamel glass 11b.

Effects of the Invention As explained above, the present invention suppresses the cracking of enamel glass and the flying of nails due to cutting, thereby reducing damage to the plate, and the processing speed is much faster than when cutting with a diamond blade. Since there are no products available, cutting can be done at low cost. It also has the advantage that a large amount of cutting can be performed with a simple machine without the need to apply heat and damage the attachments on the enamel plate, unlike arc melt cutting.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing a cutting method according to an embodiment of the present invention, and FIG. 2 is a process diagram showing an example of a conventional cutting method. 11...Glass enamel layer, 12...Iron plate, 1
4... Cut muscle.

Claims (1)

[Claims] 1. A method for cutting an enamel plate by making two parallel cuts on the enamel surface and shearing between the two cuts.