JPH04351968A - Probe - Google Patents

Probe

Info

Publication number
JPH04351968A
JPH04351968A JP15399491A JP15399491A JPH04351968A JP H04351968 A JPH04351968 A JP H04351968A JP 15399491 A JP15399491 A JP 15399491A JP 15399491 A JP15399491 A JP 15399491A JP H04351968 A JPH04351968 A JP H04351968A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
hard
probe
coat
adhesive layer
2b
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15399491A
Inventor
Yoshifumi Ikuyama
Katsuki Kakiyama
Masanori Maenozono
Akira Oba
Seiji Oishi
Original Assignee
Vacuum Metallurgical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To provide an inexpensive probe having abrasion resistance and capable of reducing adhesion of foreign matters significantly.
CONSTITUTION: A laminated coat 2 consisting of an adhesive layer 2a and a hard layer 2b is farmed on a probe 1 using stainless as its base material. The adhesive layer 2a as a backing coat of the laminated coat is formed of titanium by means of an ion plating method, and the hard layer 2b as a finish coat is formed of titanium nitride by means of the same method. The adhesive layer 2a can strengthen sticking force between the stainless base material and the hard later 2b, so that the surface of the probe 1 can be coated with the hard laser of the titanium nitride having excellent electrical conductivity.
COPYRIGHT: (C)1992,JPO&Japio
JP15399491A 1991-05-29 1991-05-29 Probe Pending JPH04351968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15399491A JPH04351968A (en) 1991-05-29 1991-05-29 Probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15399491A JPH04351968A (en) 1991-05-29 1991-05-29 Probe

Publications (1)

Publication Number Publication Date
JPH04351968A true true JPH04351968A (en) 1992-12-07

Family

ID=15574596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15399491A Pending JPH04351968A (en) 1991-05-29 1991-05-29 Probe

Country Status (1)

Country Link
JP (1) JPH04351968A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965943A (en) * 1997-10-01 1999-10-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with bonding pad electrode
US6016061A (en) * 1997-07-24 2000-01-18 Mitsubishi Denki Kabushiki Kaisha Cantilever type probe needle for probe card and method of fabrication and control thereof
WO2003035541A2 (en) * 2001-10-15 2003-05-01 Infineon Technologies Ag Probe needle for testing semiconductor chips and method for producing said probe needle
US7081767B2 (en) 2001-07-02 2006-07-25 Nhk Spring Co., Ltd. Electroconductive contact unit
JP2007218675A (en) * 2006-02-15 2007-08-30 Fujitsu Ltd Probe, and manufacturing method of probe
JP2008185596A (en) * 1994-02-21 2008-08-14 Renesas Technology Corp Connection device
CN105158531A (en) * 2014-06-06 2015-12-16 旺矽科技股份有限公司 Probe and method for manufacturing the probe
KR20170017095A (en) * 2015-08-05 2017-02-15 주식회사 유진텍 Zirconia-nickel pin for voltage measuring terminal of fuel cell and the method of manufacturing the same
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185596A (en) * 1994-02-21 2008-08-14 Renesas Technology Corp Connection device
US6016061A (en) * 1997-07-24 2000-01-18 Mitsubishi Denki Kabushiki Kaisha Cantilever type probe needle for probe card and method of fabrication and control thereof
US5965943A (en) * 1997-10-01 1999-10-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with bonding pad electrode
US7081767B2 (en) 2001-07-02 2006-07-25 Nhk Spring Co., Ltd. Electroconductive contact unit
DE10150291A1 (en) * 2001-10-15 2003-05-08 Infineon Technologies Ag Probe needle for testing semiconductor chips, and processes for their preparation
WO2003035541A3 (en) * 2001-10-15 2003-08-14 Infineon Technologies Ag Probe needle for testing semiconductor chips and method for producing said probe needle
US7212019B2 (en) 2001-10-15 2007-05-01 Infineon Technologies Ag Probe needle for testing semiconductor chips and method for producing said probe needle
WO2003035541A2 (en) * 2001-10-15 2003-05-01 Infineon Technologies Ag Probe needle for testing semiconductor chips and method for producing said probe needle
JP2007218675A (en) * 2006-02-15 2007-08-30 Fujitsu Ltd Probe, and manufacturing method of probe
US9835653B2 (en) 2014-05-13 2017-12-05 International Business Machines Corporation Solder bump array probe tip structure for laser cleaning
CN105158531A (en) * 2014-06-06 2015-12-16 旺矽科技股份有限公司 Probe and method for manufacturing the probe
KR20170017095A (en) * 2015-08-05 2017-02-15 주식회사 유진텍 Zirconia-nickel pin for voltage measuring terminal of fuel cell and the method of manufacturing the same

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