JPH043451A - Semiconductor cooling device - Google Patents

Abstract

PURPOSE:To shorten time required for sealing a cooling medium liquid into a chamber and for extracting its liquid from the chamber by coupling the chamber to a constant-pressure appliance with a piping system and then, controlling pressure in the chamber so that it is almost equal to atmospheric pressure. CONSTITUTION:When cooling capacity of a condenser 12 and a liquid cooler 11 is relatively insufficient in comparison with the heating value of each LSI chip 10, a temperature T1 in an IP mainframe 6 rises and a working point moves in the direction which improves the capacity of the cooler 11. when the temperature T1 in the IP mainframe 6 is about to rise, pressure P1 in the IP mainframe 6 is about to rise as well. The bellows 3 of a constant-pressure appliance 1 acts on this device so that pressure P1 in the bellows balances with pressure which is obtained by adding the force F of a spring in the bellows to pressure that is applied to the outside of the bellows. Yet, in the case where the bellows is equipped with the spring having only a slight spring force, once pressure P1 in the mainframe 6 is about to rise, the bellows 3 expands and then, the volume inside the bellows increases. Such a state of the bellows lowers P1 and makes it almost equal to atmospheric pressure.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a computer with LSI chips arranged on a substrate.
In a semiconductor device that cools an LSI chip that generates heat by immersing it in a refrigerant liquid and boiling the refrigerant liquid, the mechanism for sealing in and extracting the refrigerant liquid and the pressure inside the chamber containing the refrigerant liquid are completely eliminated. , relates to a mechanism for controlling the pressure to a state close to atmospheric pressure.

[Conventional technology]

2. Description of the Related Art Among devices that cool an LSI chip or the like by directly immersing the LSI chip or substrate in a coolant liquid, a device has been announced that cools the LSI chip by convection without boiling the coolant liquid.

A liquid with a relatively high boiling point is used as the refrigerant liquid.

A typical example is Japanese Patent Application No. 58-215155. In this example, Fluorinert is used as the refrigerant liquid. In this case, the amount of heat generated from the LSI chip is small, the refrigerant liquid does not boil, and heat is absorbed only by sensible heat transport of the refrigerant liquid. The operating pressure is only the pump pressure, which is relatively low and is kept close to atmospheric pressure.

[Problem to be solved by the invention]

As the amount of heat generated by LSI chips in semiconductor devices increases,
Heat cannot be removed only by convective heat transfer of the refrigerant liquid; boiling heat transfer of the refrigerant liquid must be utilized. When boiling heat transfer is performed, LS
Since bubbles of the refrigerant liquid are generated in the I-chip portion, the gas phase of the refrigerant increases, and the pressure inside the chamber increases. The pressure inside the chamber becomes considerably greater than the atmospheric pressure, which is the pressure surrounding the chamber. In order to cope with this, it is necessary to make the chamber structure a pressure-resistant structure, but in a chamber structure in which an LSI chip or a board is placed inside, it is necessary to connect the inside and outside of the chamber with signal lines, etc. It cannot be made into a high-pressure container.

An object of the present invention is to connect a constant pressure regulator to a chamber structure, and to
To provide a mechanism for keeping the internal pressure of a chamber constant even when an SI chip operates and boiling occurs, and for sealing a refrigerant liquid into the chamber or extracting the refrigerant liquid from the chamber in as short a time as possible. It is in.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a constant pressure regulator connected by piping to a chamber containing a refrigerant liquid. The pressure regulator has a flexible bellows structure, and the expansion and contraction action of the flexible bellows balances the internal pressure of the chamber with the pressure outside the chamber, that is, the atmospheric pressure, and keeps the internal pressure of the chamber almost constant at atmospheric pressure. It is something to do.

The liquid collector and liquid extractor also have a bellows structure, and the bellows are expanded and contracted by air pressure or a mechanical mechanism, and the bellows body is stretched and the refrigerant liquid is returned to the bellows body, or vice versa. Then, the bellows body is contracted to seal the refrigerant liquid into the chamber.

[Effect]

A chamber in which an LSI chip and a substrate are installed is connected to a flexible bellows body that closes both ends of a flexible bellows structure, and a portion of the bellows structure is open to the atmosphere outside the chamber.

Now, assume that the semiconductor cooling device of the present invention is activated and refrigerant liquid boils from the LSI chip section.

When boiling occurs, bubbles of the refrigerant liquid are generated from the LSI chip portion, the gas phase portion of the refrigerant liquid that occupies the chamber increases, and the pressure inside the chamber tends to rise. At this time, if the bellows structure is a flexible structure, the bellows expands and increases the volume by the gas phase portion of the refrigerant liquid. The pressure within the chamber and flexible bellows structure is then mostly absorbed by the flexibility of the bellows structure, making it possible to keep it at a value close to atmospheric pressure.

On the other hand, when the bellows structure is connected to the other lower end of the chamber via a valve, for example, if a refrigerant liquid is sealed in the chamber, this valve can be opened to stretch the bellows structure. The refrigerant liquid can be returned to the bellows side. This is the action as a liquid collector. vice versa,
By opening the valve and contracting the bellows, the refrigerant liquid that was on the bellows body side can be transported to the chamber side.

This is the action as a liquid extractor. The expansion and contraction of the bellows structure is performed by pneumatic pressure or a mechanical mechanism. When using pneumatic pressure, the bellows body is surrounded by a sealed container, and the bellows structure is Shrink your body. On the other hand, when a mechanical mechanism is used, for example, in a gear mechanism, by rotating a gear, an external force is applied to the bellows body, causing the bellows to contract.

〔Example〕

An embodiment of the pressure regulator 1 is shown in FIGS. 1 and 2. FIG. 1 is a perspective view showing the structure of the pressure regulator, and FIG. 2 is a sectional view. A bellows container 3 is inserted into a cylindrical container 2. The bellows container 3 has a structure in which a plurality of donut-shaped plates 3a are stacked one on top of the other, and the inner side (3c side) and the outer side (3d side) are integrated alternately. One end of the bellows container 3 is closed by a closing plate 3b, and the other end is closed by the bottom plate 2 of the cylindrical container 2.
It is blocked by a. Therefore, the donut-shaped plate 3a
The cover plate 3b and the bottom plate 2a have a structure that maintains a confidential state. Holes 4 and 5 are provided in the top plate 2b and bottom plate 2a of the cylindrical container 2, for example, a seat 4a provided with a tapered screw.
, 5a are attached.

The pressure regulator 1 is connected to the IP main body and performs the following operations. FIG. 3 shows a method of connecting the IP main body 6 and the pressure regulator 1.

The IP main body 6 includes a chamber 8 in which a refrigerant liquid 7, which is a boiling liquid, is sealed, and a substrate 9, an LSI chip 10. A liquid cooler 11, a condenser 12, etc. are inserted. The upper side of the LP main body 6 where the condenser 12 is arranged and the seat 5a attached to the bottom body 2a of the constant pressure regulator 1 are connected to the piping 1-
Connected by 4. For example, the refrigerant liquid 7 is 1.

As shown in FIG. 3, an amount of liquid has been drawn into the chamber 8 such that the liquid level is between the substrate 9 or the LSI chip 10 and the condenser 12. Therefore, refrigerant vapor 15 is sealed on the condenser 12 side from this liquid level. When the computer starts operating, the LSI chip 10 generates heat and the refrigerant liquid 7
comes to a boil. As the boiled refrigerant vapor flows through the refrigerant liquid 7, it is passed through the liquid cooler 11 and further into the condenser 12.
As a result, it becomes i-liquid and falls back to its original state. In this way, the LSI chip 10 that generates heat is cooled and the LSI chip 10 is cooled.
The temperatures of multiple semiconductor elements within chip 10 are maintained within predetermined tolerances. At this time, during steady operation, the amount of heat generated by the plurality of LSI chips 1o, the liquid cooler 11, and the condenser 12
The amount of heat produced is balanced, and the refrigerant liquid 7 in the chamber 8
, and the temperature of the refrigerant vapor 15 become substantially uniform, and therefore the pressure within the chamber 8 also becomes substantially uniform.

Incidentally, in the case of a computer, power supply system wiring or signal line wiring is taken out from the IP chamber 8 to the outside of the chamber. Such electrical wiring must be insulated from, for example, the metal chamber 8, and a hermetic seal method, for example, is used to take it out. In other words, an insulator made of a base material is inserted between the electrical wiring and the chamber 8, which is very weak in terms of pressure resistance, and the pressure inside the chamber 8 is kept as close to atmospheric pressure as possible. It is necessary to keep the pressure difference between the inside and outside of the chamber 8 small. Therefore, the pressure regulator 1 is provided to maintain the IP main body 6 at a state close to atmospheric pressure. As mentioned above, the pressure regulator 1 is connected to the upper side of the IP main body 6 and the piping 14.
connected by.

For example, if the cooling capacity of the condenser 12 and the liquid cooler 11 is relatively insufficient compared to the calorific value of the LSI chip 10, the temperature Tz inside the IP main body 6 will rise and the condenser 12 or the temperature difference (Tz Tz) from the temperature T2 of the liquid cooler 11 is increased, and the operating point moves in the direction of increasing the capacity of the condenser 12 or the liquid cooler 11. I
When the temperature T1 of the IP main body 6 is about to rise, the pressure Ps inside the IP main body 6 is also about to rise. By the way, in the bellows 3 of the pressure regulator 1, the pressure P1 inside the bellows is equal to the pressure outside the bellows (equal to atmospheric pressure in this case) and the spring force F of the bellows.
It acts to balance the addition of However, if the spring force F of the bellows is very small, the IP body 6
When the internal pressure P1 tries to rise, the bellows 3 expands and the volume inside the bellows increases, as shown in FIG. 4(a), and P1 decreases and becomes almost equal to atmospheric pressure.

On the other hand, contrary to the explanation so far, the condenser 12 or
When the cooling capacity of the liquid cooler 11 is relatively large compared to the calorific value of the LSI chip 10, the temperature T inside the IP main body 6
On the contrary, z decreases and the condenser 12 or liquid cooler 1
The operating point moves in the direction of decreasing the capacity of the condenser 12 or the liquid cooler 11 by decreasing the temperature difference (TI T2) from the temperature T2 of the condenser 12 or the liquid cooler 11. When the temperature T1 of the IP main body 6 tries to fall, the pressure P1 inside the IP main body 6 also tries to fall.

In this case, as shown in FIG. 4(b), the bellows 3 contracts, the volume inside the bellows decreases, and Pl becomes high and becomes equal to atmospheric pressure. Due to the function of the bellows 3, the internal pressure of the IP main body 6 can be maintained at almost atmospheric pressure.

An example of a bellows is shown below. Thickness 0.3mm, inner diameter 26
0wn, 29 donut-shaped plates 3a with an outer diameter of 3541 m are stacked one on top of the other, and the inner and outer sides are seam welded. By providing such a bellows structure, the pressure P1 inside the IP main body 6 could be suppressed to atmospheric pressure ±103 Pa.

Other examples are shown below. When the internal pressure Pz of the IP main body 6 tries to increase, the bellows 3 expands as shown in FIG. 4(a). Therefore, when the bellows expands to a certain extent, a limit switch is activated to stop the operation of the LSI chip. For example, as shown in FIG. 2, a limit switch 16 is provided at the bottom of the top plate 2b of the cylindrical container 2, and a projection 17 for pushing the limit switch is provided on the cover plate 3b of the bellows 3. In this way, the IP body 6
Even if the internal pressure P1 rises too much, the bellows 3 expands, the protrusion 17 activates the limit switch 16, and the operation of the LSI chip disposed within the IP main body 6 is stopped. In this way, boiling of the refrigerant liquid 7 is stopped, and I
The pressure inside the P main body 6 can be reduced. This also serves as a safety device in case the pressure inside the IP main body 6 rises too much for some reason.

Next, an example of a liquid recovery device will be described. A refrigerant liquid 7 is sealed inside the IP main body 6. By the way, the board 9. L.S.
1 for computers with IP configured with I-chip 10, etc.
For example, if the LSI chip 10 or the like breaks down for some reason, the faulty LSI chip must be replaced. In this case, first, I
The refrigerant liquid 7 in the P main body 6 must be taken out of the IP main body 6. Moreover, in cases where the process needs to be carried out in as short a time as possible, the refrigerant liquid 7 is transferred to the IP main body 6.
The liquid collector 18 collects the liquid to the outside. An embodiment of the liquid recovery device 18 is shown in FIG. The liquid recovery device 18 includes a constant pressure device 1,
The bellows container 20 has a similar shape, and the bellows container 20 is inserted into the cylindrical container 19. The bottom 21 of the IP main body 6 and a hole 22 provided in the top plate 19b of the cylindrical container 19 communicate with each other via a valve 23.

On the other hand, a hole 24 is provided in the bottom plate 19a of the cylindrical container 19.
5 are in communication with each other via a valve 26. The refrigerant liquid 7 is contained inside the IP body 6 as well as in the cylindrical container 1 of the liquid recovery device 18.
The space between the bellows container 9 and the bellows container 20 is also sealed. Therefore, for example, when the refrigerant liquid 7 is sealed into the IP main body 6, the valves 23 and 26 are opened to operate the bebicon 25. The bellows container 20 swells, and the refrigerant liquid 7
After moving into the P main body 6 and closing the valve 23 when the appropriate amount has entered, the operation of the Bebicon 25 is stopped. On the other hand, for example, during maintenance, the refrigerant liquid 7 is removed from the IP main body 6.
When removing the gas, open the valve 23 and at the same time open the valve 26 side to the atmosphere. The bellows container 20 is contracted by the liquid head of the refrigerant liquid, and the refrigerant liquid 7 in the IP main body 6 is
The refrigerant liquid 7 is moved to the liquid recovery device 18 side, and the refrigerant liquid 7 is placed on the IP main body 6 side.
disappears.

Another embodiment is shown in FIG. The difference from the embodiment shown in FIG. 5 is that the bellows container 20 is driven using a drive device 26. The drive device 26 has a thread row 27 on the negative side.
A rod 28 is attached to the baffle plate 3b at the tip of the bellows, and a screw row 30 provided around the circumference of the gear 29 is intertwined with the screw row 27, and as the gear 29 rotates, the rod 27 moves up and down, causing the bellows to move up and down. can be driven.

〔Effect of the invention〕

According to the present invention, the pressure inside the chamber containing an LSI chip, a substrate, etc., and containing a refrigerant liquid for cooling the LSI chip that generates heat due to boiling can be controlled to a constant atmospheric pressure. .

Therefore, it becomes possible to reduce the wall thickness of the chamber.

Furthermore, by providing a dedicated liquid recovery device and a liquid extractor, the time required to extract the liquid into the chamber and the time required to recover the liquid from outside the chamber can be reduced. The pneumatic method allows the time to be approximately 3 minutes.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a longitudinal sectional view of FIG. 1, and FIG. 3 is a longitudinal sectional view of a second embodiment of the invention.
FIG. 4 is an explanatory diagram showing the operation of the present invention, FIG. 5 is a longitudinal sectional view showing a liquid recovery device and a liquid extractor according to an embodiment of the present invention, and FIG. 6 is a second embodiment of the present invention. FIG. DESCRIPTION OF SYMBOLS 1... Constant pressure regulator, 2... Cylindrical container, 3... Bellows container, 6... IP main body, 7... Refrigerant liquid, 8... Chamber, 9... Substrate, 10... LSI chip, 15・
...Refrigerant vapor, 18...Liquid recovery device, 23...Valve.

Claims (1)

[Scope of Claims] 1. A device for cooling the LSI chip, etc., which generates heat due to boiling of the refrigerant liquid, by arranging an LSI chip and board parts inside a chamber, and sealing a refrigerant liquid in the chamber. A semiconductor cooling device, characterized in that the chamber and the pressure regulator are connected through a piping system to control the pressure inside the chamber to be substantially constant at atmospheric pressure.