JPH04336300A - Ic memory card - Google Patents

Abstract

PURPOSE:To provide an IC memory card having high resistance against static electricity and a superior simplicity of operation. CONSTITUTION:The subject IC memory card consists of a communication member 6, a panel 1 which leads to a ground through the communication member 6 and a semiconductor-mounted substrate 5. The communication member 6 is sherical or elliptic.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC memory card, and more particularly to an electrostatic conduction member.

0002

2. Description of the Related Art FIG. 4 is an external view of an IC memory card, in which 1 is a panel, 2 is a frame, and 3 is a connector.

FIGS. 5 and 6 show examples of structures taken along the line A--A in FIG. 4. In both figures,
4 is a GND pattern portion, 5 is a semiconductor mounting board, 6 is a conductive coil spring (conductive member), and 7 is a semiconductor.

First, in the structure shown in FIG. 5, two conductive coil springs 6 are provided, one of which is connected to the lower panel 1 and GND.
The other one is placed between the pattern parts 4 and the upper and lower panels 1.
, 1, the conductive coil spring 6 is electrically connected to the panel 1.

Furthermore, in the structure shown in FIG.
A conductive coil spring 6 is sandwiched between the pattern portion 4 and the panel 1
It has a structure that allows electrical conduction.

[0006]

[Problems to be Solved by the Invention] In the case of the structure shown in FIG.
If the conductive coil spring 6 is inserted at an angle, or if uneven force is applied to the end of the conductive coil spring 6, there is a risk of the spring popping out, resulting in poor conduction or malfunction.

On the other hand, in the case of the structure shown in FIG. 6, since the conductive coil spring 6 is fixed to the semiconductor mounting board 5, there is no danger of the conductive coil spring 6 popping out, but due to the contact pressure with the panel 1, However, there is a drawback that it takes many man-hours to manage and attach the winding protruding from the semiconductor mounting board 5 during attachment.

[0008] This invention has the above-mentioned conventional products.
It solves the problems of generation of static electricity caused by poor conduction caused by protruding conductive members, semiconductors being easily destroyed by external static electricity, and poor workability, and has excellent anti-static properties and good workability. The purpose is to provide a unique IC memory card.

[0009]

[Means for Solving the Problems] The above object is to provide a conductive member, a panel guided to the ground by the conductive member,
In an IC memory card equipped with a semiconductor mounting board,
This is achieved by forming the conductive member into a spherical or elliptical shape.

0010

[Function] (1) In order to prevent the conductive member from popping out, it is necessary to have a shape that does not easily deflect due to external force. Therefore, by making it spherical or oval,
When attaching a conductive member such as a panel, an external force applied obliquely to the vertical direction of the fixing member that fixes the conductive member is dispersed to the wall surface of the fixing member and the other conductive member. This reduces deflection due to the overall deformation, and reduces conduction defects due to protrusion of the conductive member.

(2) The process of sandwiching the conductive member between the semiconductor mounting board GND and adding a conductive member for GND contact will reduce work efficiency, so a through hole is provided in the mounting board and a GND pattern is formed on the wall surface of the through hole. let A spherical or elliptical conductive member is inserted into this through hole and brought into contact with the wall surface of the through hole and other conductive members, thereby eliminating the need for sandwiching and the use of two conductive members.

0012

Embodiments Each embodiment of the present invention will be described below with reference to the drawings. Note that the same reference numerals are given to parts that are the same or can be considered to be the same as those in the conventional example, and redundant explanations are omitted.

FIG. 1, FIG. 2, and FIG. 3 show the first and second
FIG. 2 is a longitudinal cross-sectional view of a main part of an IC memory card according to a third embodiment.

First, in the first embodiment shown in FIG.
4a is a through-hole GND pattern portion, and 6a is a spherical conductive member, and the panel 1 and the through-hole GND pattern portion 4a are electrically connected by this conductive member 6a.

In the second embodiment shown in FIG. 2, the panel 1 and the through-hole GND pattern portion 4a are electrically connected to each other by a vertically elongated elliptical electrically conductive member 6b. When it is desired to secure the mounting area of the semiconductor 7 as much as possible, by using such a conductive member 6b, it is possible to reduce the diameter of the through hole and increase the mounting area.

In the third embodiment shown in FIG. 3, the panel 1 and the through-hole GND pattern portion 4a are electrically connected to each other by a horizontally elongated elliptical electrically conductive member 6c. When it is desired to reduce the thickness of the card, by using such a conductive member 6c, the distance between the upper and lower panels 1, 1 can be reduced, and the card can be made thinner.

[0017]

As explained above, in the present invention, by using spherical and elliptical conductive members, it is possible to prevent the deterioration of anti-static properties due to the conductive members popping out when attaching a conductive member such as a panel, etc. Malfunctions can be prevented. In addition, it is possible to easily establish electrical continuity between an outer peripheral member such as a panel and an internal member such as a semiconductor mounting board.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a main part of an IC memory card according to a first embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of a main part of an IC memory card according to a second embodiment of the present invention.

FIG. 3 is a longitudinal sectional view of a main part of an IC memory card according to a third embodiment of the present invention.

FIG. 4 is an external view of an IC memory card.

FIG. 5 is a vertical cross-sectional view of a main part of a conventional IC memory card.

FIG. 6 is a vertical sectional view of a main part of an IC memory card according to another conventional example.

[Explanation of symbols]

1 Panel 2 Frame 3 Connector 4 GND pattern section 4a Through hole GND pattern section 5 Semiconductor mounting board 6a Spherical conductive member 6b Vertically oval conductive member 6c Horizontally oval conductive member 7 Semiconductor

Claims (1)

[Claims] 1. An IC memory card comprising a conductive member, a panel guided to ground by the conductive member, and a semiconductor mounting board, characterized in that the conductive member has a spherical or elliptical shape. IC memory card.