JPH04336217A - Buffer jig for mold equipped with ejector mechanism - Google Patents

Buffer jig for mold equipped with ejector mechanism

Info

Publication number
JPH04336217A
JPH04336217A JP10767291A JP10767291A JPH04336217A JP H04336217 A JPH04336217 A JP H04336217A JP 10767291 A JP10767291 A JP 10767291A JP 10767291 A JP10767291 A JP 10767291A JP H04336217 A JPH04336217 A JP H04336217A
Authority
JP
Japan
Prior art keywords
mounting plate
elastic member
ejector mechanism
movable
support ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10767291A
Other languages
Japanese (ja)
Inventor
Eizo Kato
加藤 栄三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10767291A priority Critical patent/JPH04336217A/en
Publication of JPH04336217A publication Critical patent/JPH04336217A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/40Removing or ejecting moulded articles
    • B29C45/4005Ejector constructions; Ejector operating mechanisms

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To reduce vibration and to suppress noise by impinging a movable mounting plate and a support plate constituting an ejector mechanism against a buffer jig composed of an elastic member at the time of the return operation of the ejector mechanism to a standby position in a mold. CONSTITUTION:A buffer jig is constituted of an elastic member 13, the support ring 14 supported by the elastic member 13 and a bolt 15 piercing the support ring 14 and the through-hole 15c formed to a movable mounting plate 5 to clamp and fix the support ring 14.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明はエジェクタ機構を備え
た成形金型用緩衝具に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shock absorber for a molding die equipped with an ejector mechanism.

【0002】0002

【従来の技術】一般に、プラスチック射出成形金型は、
所定位置に配置された固定取付板に対し固定金型を支持
するとともに、この固定金型と対応して可動金型が可動
取付板に支持され、さらに前記可動金型は該可動金型を
固定金型から離隔した状態で樹脂成形品を可動金型から
押し出すためのエジェクタ機構を備えている。このエジ
ェクタ機構は可動金型に挿通支持されたエジェクタピン
と、該ピンを支持する支持板と、エジェクタピンを押し
戻す押し戻しピンと、エジェクタピン、押し戻しピン及
び支持板を押し出し位置から退避位置に向かって付勢保
持するバネと、さら可動金型を固定金型から離隔した状
態で、前記支持板をエジェクタピン及び押し戻しピンと
ともに前記バネの付勢力に抗して押し出す押圧部材とに
より構成されている。
[Prior Art] Generally, plastic injection molds are
A fixed mold is supported by a fixed mounting plate arranged at a predetermined position, and a movable mold is supported by the movable mounting plate in correspondence with the fixed mold, and further, the movable mold fixes the movable mold. It is equipped with an ejector mechanism for extruding the resin molded product from the movable mold while being separated from the mold. This ejector mechanism includes an ejector pin that is inserted into and supported by a movable mold, a support plate that supports the pin, a push-back pin that pushes back the ejector pin, and urges the ejector pin, push-back pin, and support plate from the push-out position toward the retracted position. It is comprised of a spring that holds the movable mold and a pressing member that pushes out the support plate together with the ejector pin and the push-back pin against the biasing force of the spring in a state where the movable mold is separated from the fixed mold.

【0003】0003

【発明が解決しようとする課題】ところが、前述したエ
ジェクタ機構は可動金型から樹脂成形品を押し出した後
、エジェクタピンを支持板とともにバネの蓄圧力により
待機位置に復帰させる場合、支持板が可動取付板にバネ
の力により衝突するため、振動が発生するとともに、騒
音が生じ、生活環境に悪影響を及ぼすという問題があっ
た。
[Problems to be Solved by the Invention] However, in the ejector mechanism described above, when the ejector pin and the support plate are returned to the standby position by the accumulated force of the spring after extruding the resin molded product from the movable mold, the support plate is movable. Since the spring collides with the mounting plate, vibrations and noise are generated, which has a negative impact on the living environment.

【0004】この発明の目的は上記従来の問題点を解消
してエジェクタ機構の動作時に振動及び騒音を抑制して
騒音公害をなくすことができるエジェクタ機構を備えた
成形金型用緩衝具を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a shock absorber for a molding die equipped with an ejector mechanism that can eliminate the above-mentioned conventional problems and suppress vibration and noise during operation of the ejector mechanism, thereby eliminating noise pollution. There is a particular thing.

【0005】[0005]

【課題を解決するための手段】請求項1記載の発明は上
記目的を達成するため、エジェクタ機構を装着した可動
金型を取り付ける可動取付板に対し、取り外し可能に取
り付けられる弾性部材により構成している。又、請求項
2記載の発明は、請求項1において弾性部材を可動取付
板に支持される支持リングに支持するという構成をとっ
ている。
[Means for Solving the Problems] In order to achieve the above object, the invention as claimed in claim 1 comprises an elastic member that is removably attached to a movable mounting plate on which a movable mold equipped with an ejector mechanism is attached. There is. Further, the invention as set forth in claim 2 has a configuration in which the elastic member is supported by a support ring supported by a movable mounting plate in claim 1.

【0006】さらに、請求項3記載の発明は、請求項2
において支持リングは可動取付板に形成された挿通孔を
貫通して該支持リングを締め付け固定するボルトを備え
ている。
[0006]Furthermore, the invention according to claim 3 is based on claim 2.
The support ring is provided with a bolt that passes through an insertion hole formed in the movable mounting plate and tightens and fixes the support ring.

【0007】[0007]

【作用】請求項1〜3記載の発明は、エジェクタ機構に
より成形品が可動金型から押し出された後、エジェクタ
機構の支持板が可動取付板側の待機位置に復帰されると
き、支持板が弾性部材に衝突するため振動が抑制され、
騒音が低減される。
[Operation] In the invention according to claims 1 to 3, after the molded product is extruded from the movable mold by the ejector mechanism, when the support plate of the ejector mechanism is returned to the standby position on the side of the movable mounting plate, the support plate is Vibration is suppressed because it collides with an elastic member,
Noise is reduced.

【0008】[0008]

【実施例】以下、この発明を具体化した一実施例を図1
及び図2に基づいて説明する。この実施例のプラスチッ
ク成形金型は、図2に示すように所定位置に配置された
固定取付板1に対し固定金型2を支持している。この固
定金型2と対向する可動金型3は連結ブロック4を介し
て可動取付板5に支持されている。さらに、前記可動金
型3及び取付板5は、該可動金型3を固定金型2から離
隔した状態で両金型2,3内のキャビティ(図示略)に
ある樹脂成形品を可動金型3から押し出すためのエジェ
クタ機構6を備えている。
[Example] An example embodying this invention is shown below in Figure 1.
This will be explained based on FIG. In the plastic molding die of this embodiment, a fixed die 2 is supported with respect to a fixed mounting plate 1 arranged at a predetermined position as shown in FIG. A movable mold 3 facing the fixed mold 2 is supported by a movable mounting plate 5 via a connecting block 4. Further, the movable mold 3 and the mounting plate 5 are configured to move the resin molded product in the cavity (not shown) in both the molds 2 and 3 to the movable mold while keeping the movable mold 3 separated from the fixed mold 2. It is equipped with an ejector mechanism 6 for extruding from 3.

【0009】このエジェクタ機構6は可動金型3に挿通
支持されたエジェクタピン7と、該エジェクタピン7を
押し戻す押し戻しピン8と、エジェクタピン7及び押し
戻しピン8を支持する二枚重の支持板9と、前記押し戻
しピン8に巻装され、エジェクタピン7及び支持板9を
可動金型3から待機位置に付勢保持するバネ10と、さ
ら可動金型3を固定金型2から離隔した状態で、可動取
付板5に形成した貫通孔5aから支持板9に当接して、
該支持板9を前記バネ10の付勢力に抗して押圧する押
し出しロッド11とにより構成されている。
This ejector mechanism 6 includes an ejector pin 7 inserted into and supported by the movable mold 3, a push-back pin 8 that pushes back the ejector pin 7, and a double support plate 9 that supports the ejector pin 7 and the push-back pin 8. A spring 10 is wound around the push-back pin 8 and biases and holds the ejector pin 7 and support plate 9 from the movable mold 3 to the standby position, and the movable mold 3 is separated from the fixed mold 2. , comes into contact with the support plate 9 through the through hole 5a formed in the movable mounting plate 5,
The push-out rod 11 presses the support plate 9 against the biasing force of the spring 10.

【0010】前記可動取付板5には、この発明の緩衝具
12が支持されている。この緩衝具12は可動取付板5
に形成した取付凹部5bに嵌合されるウレタンゴム、発
泡ウレタン樹脂、軟質樹脂等の弾性部材13と、該弾性
部材13を支持する支持リング14と、さらに前記可動
支持板5に形成した挿通孔5cから該支持リング14の
中心部に形成したネジ孔14aに螺合されて該リング1
4を取付板5に締め付け固定する締付ボルト15とによ
り構成されている。又、前記支持リング14の中央部に
は小径の取付筒部14bが一体に形成され、該取付筒部
14bは弾性部材13の中心部に形成した嵌合孔13a
に圧入嵌合されている。又、前記取付筒部14bの外周
面には抜け出し防止用の環状溝14cが形成され、前記
弾性部材13の圧入嵌合時に嵌合孔13aの内周面の一
部が図1に示すように弾性変形して環状溝14cに進入
し、弾性部材13が取付筒部14bから離脱しないよう
にしている。
A shock absorber 12 of the present invention is supported on the movable mounting plate 5. This buffer 12 is attached to the movable mounting plate 5
an elastic member 13 made of urethane rubber, foamed urethane resin, soft resin, etc. that is fitted into the mounting recess 5b formed in the mounting recess 5b; a support ring 14 that supports the elastic member 13; and an insertion hole formed in the movable support plate 5. The ring 1 is screwed into the screw hole 14a formed in the center of the support ring 14 from 5c.
4 and a tightening bolt 15 that tightens and fixes the mounting plate 5 to the mounting plate 5. Further, a small-diameter mounting cylinder portion 14b is integrally formed in the center of the support ring 14, and the mounting cylinder portion 14b is connected to a fitting hole 13a formed in the center of the elastic member 13.
It is press-fitted into the Further, an annular groove 14c for preventing slippage is formed on the outer peripheral surface of the mounting cylinder portion 14b, and when the elastic member 13 is press-fitted, a part of the inner peripheral surface of the fitting hole 13a is formed as shown in FIG. The elastic member 13 is elastically deformed and enters the annular groove 14c, thereby preventing the elastic member 13 from separating from the mounting cylinder portion 14b.

【0011】さらに、前記弾性部材13の表面は可動取
付板5の左側面から外側へ若干突出され、支持板9の右
側面の衝突による振動の低減を図り、かつエジェクタ機
構6を構成する支持板9の位置規制を行うようにしてい
る。次に、前記のように構成した成形用金型についてそ
の作用を説明する。今、図2は固定金型2及び可動金型
3により形成されるキャビティ内に樹脂が注入されて樹
脂成形品が製造された離型前の状態を示す。この状態に
おいて、可動取付板5及びエジェクタ機構6とともに可
動金型3が固定金型2から離隔される。
Furthermore, the surface of the elastic member 13 is slightly protruded outward from the left side surface of the movable mounting plate 5 to reduce vibrations caused by collision with the right side surface of the support plate 9, and to reduce vibrations caused by collision with the right side surface of the support plate 9. 9 position regulations are implemented. Next, the operation of the molding die configured as described above will be explained. Now, FIG. 2 shows a state before mold release, in which resin is injected into the cavity formed by the fixed mold 2 and the movable mold 3 to produce a resin molded product. In this state, the movable mold 3 is separated from the fixed mold 2 together with the movable mounting plate 5 and the ejector mechanism 6.

【0012】この離型状態において、可動金型3のキャ
ビティ内に残された樹脂成形品はエジェクタ機構6の押
し出しロッド11により支持板9がバネ10の弾力に抗
して押し出されるので、エジェクタピン7によりキャビ
テイ内から押し出される。そして、押し出しロッド11
が後退して支持板9がバネ10の蓄勢力により待機位置
に復帰され、支持板9は可動取付板5側の緩衝具12に
向かって移動する。このとき緩衝具12の弾性部材13
が取付板5の表面から若干突出しているので、支持板9
が弾性部材13に当たり取付板5に直接衝突することは
なく、振動及び騒音が抑制される。
In this mold release state, the resin molded product left in the cavity of the movable mold 3 is pushed out by the push rod 11 of the ejector mechanism 6 against the elasticity of the spring 10, so that the ejector pin 7, it is pushed out from inside the cavity. And the extrusion rod 11
moves backward, the support plate 9 is returned to the standby position by the stored force of the spring 10, and the support plate 9 moves toward the shock absorber 12 on the movable mounting plate 5 side. At this time, the elastic member 13 of the shock absorber 12
protrudes slightly from the surface of the mounting plate 5, so the support plate 9
hits the elastic member 13 and does not collide directly with the mounting plate 5, thereby suppressing vibration and noise.

【0013】次に、この発明の別の実施例を図3〜図5
に基づいて説明する。この実施例は可動取付板5に対し
支持板9を位置規制するストッパ自身に緩衝具としての
機能を付与したものである。そして、図5に示すように
前記支持リング14の背面側に支持筒部14dを一体に
形成し、該支持筒部14dを可動取付板5の挿通孔5c
に嵌入し、該支持筒部14dに形成したネジ孔14eに
ボルト15を螺合して緩衝具12を固定している。なお
、この実施例では弾性部材13の直径を例えば25mm
、その厚さを5.5mm、支持リング14の直径を16
mm、その厚さを3mmとしている。又、取付筒部14
bの直径を12.8mm、その厚さを5.0mmとして
いる。そして、取付筒部14bからの弾性部材13の飛
び出し長さを0.5mmとしている。さらに、前記環状
溝14cの幅を1.5mm、深さを1.0mmとしてい
る。
Next, another embodiment of the present invention is shown in FIGS. 3 to 5.
The explanation will be based on. In this embodiment, the stopper itself for regulating the position of the support plate 9 with respect to the movable mounting plate 5 is provided with a function as a shock absorber. As shown in FIG. 5, a support cylindrical portion 14d is integrally formed on the back side of the support ring 14, and the support cylindrical portion 14d is inserted into the insertion hole 5c of the movable mounting plate 5.
The shock absorber 12 is fixed by fitting into the supporting cylinder portion 14d and screwing a bolt 15 into a screw hole 14e formed in the support cylinder portion 14d. In this embodiment, the diameter of the elastic member 13 is, for example, 25 mm.
, its thickness is 5.5 mm, and the diameter of the support ring 14 is 16 mm.
mm, and its thickness is 3 mm. In addition, the mounting cylinder part 14
b has a diameter of 12.8 mm and a thickness of 5.0 mm. The length of the elastic member 13 protruding from the mounting cylinder portion 14b is set to 0.5 mm. Further, the annular groove 14c has a width of 1.5 mm and a depth of 1.0 mm.

【0014】又、この実施例では固定金型2側に可動金
型3を案内するロッド16が図示されている。さらに、
図4に示すように緩衝具12は二箇所に設けられている
。この実施例では弾性部材13が支持リング14から例
えば0.5mm出ているので、この弾性部材13の突出
部が支持板9により圧縮された後は、支持板9が支持リ
ング14により支持される。又、固定金型2から可動金
型3を離間すると、弾性部材13の圧縮長さ(0.5m
m)だけその弾性力によりエジェクタピン7及び押し戻
しピン8が支持板9とともに硬化後の成形品を可動金型
3のキャビティ内から押し出す方向へ移動するようにバ
ネ10の弾性力を設定しておくことにより、前記キャビ
ティから成形品が若干浮き上がり、従って、成形品の押
し出しが容易となり、成形品にクラックが発生するのを
抑制したり、押し出しスピードを速めたりすることがで
きる。
Further, in this embodiment, a rod 16 for guiding the movable mold 3 is shown on the fixed mold 2 side. moreover,
As shown in FIG. 4, the buffers 12 are provided at two locations. In this embodiment, the elastic member 13 protrudes from the support ring 14 by, for example, 0.5 mm, so after the protrusion of the elastic member 13 is compressed by the support plate 9, the support plate 9 is supported by the support ring 14. . Moreover, when the movable mold 3 is separated from the fixed mold 2, the compressed length of the elastic member 13 (0.5 m
The elastic force of the spring 10 is set so that the elastic force of the spring 10 moves the ejector pin 7 and the push-back pin 8 together with the support plate 9 in the direction of pushing out the cured molded product from the cavity of the movable mold 3 by the amount of elastic force of the spring 10. As a result, the molded product is slightly lifted out of the cavity, making it easier to extrude the molded product, suppressing the occurrence of cracks in the molded product, and increasing the extrusion speed.

【0015】なお、この発明は前記実施例に限定される
ものではなく、次のように具体化してもよい。 (1)図6に示すように可動取付板5の嵌合凹部5bに
弾性部材13を嵌合すること。この場合には弾性部材1
3の外径を凹部5bの内径よりも若干大きくすることに
より圧入嵌合して離脱を防止する。
[0015] The present invention is not limited to the above embodiments, but may be embodied as follows. (1) Fitting the elastic member 13 into the fitting recess 5b of the movable mounting plate 5 as shown in FIG. In this case, the elastic member 1
By making the outer diameter of the recess 5b slightly larger than the inner diameter of the recess 5b, the recess 5b is press-fitted and prevented from coming off.

【0016】(2)図7に示すように支持リング14を
可動取付板5の凹部5bに嵌合するとともに、該支持リ
ング9を磁石により形成して可動取付板5に吸着させ離
脱を防止するようにすること。 (3)緩衝具12の配置位置を任意に変更すること。
(2) As shown in FIG. 7, the support ring 14 is fitted into the recess 5b of the movable mounting plate 5, and the support ring 9 is made of a magnet to attract the movable mounting plate 5 and prevent it from coming off. To do so. (3) Arbitrarily changing the arrangement position of the shock absorber 12.

【0017】[0017]

【発明の効果】以上詳述したように、この発明は成形金
型においてエジェクタ機構の待機位置への復帰動作時に
可動取付板とエジェクタ機構を構成する支持板を弾性部
材よりなる緩衝具に当てて振動を低減し、騒音を抑制す
ることができる効果がある。
[Effects of the Invention] As described in detail above, the present invention applies the movable mounting plate and the support plate constituting the ejector mechanism to a shock absorber made of an elastic member when the ejector mechanism returns to the standby position in a molding die. This has the effect of reducing vibration and suppressing noise.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】緩衝具の取付構造を拡大して示す要部の断面図
である。
FIG. 1 is an enlarged cross-sectional view of the main parts of the mounting structure of a shock absorber.

【図2】この発明を具体化した一実施例を示す成形金型
全体を示す断面図である。
FIG. 2 is a sectional view showing an entire molding die showing an embodiment embodying the present invention.

【図3】この発明の別例を示す成形装置全体の断面図で
ある。
FIG. 3 is a sectional view of the entire molding apparatus showing another example of the present invention.

【図4】図3のA−A線断面図である。FIG. 4 is a sectional view taken along line AA in FIG. 3;

【図5】図3に使用した緩衝具の取付構造を拡大して示
す断面図である。
FIG. 5 is an enlarged sectional view showing the mounting structure of the shock absorber used in FIG. 3;

【図6】この発明の別例を示す部分断面図である。FIG. 6 is a partial cross-sectional view showing another example of the invention.

【図7】この発明の別例を示す部分断面図である。FIG. 7 is a partial cross-sectional view showing another example of the invention.

【符号の説明】[Explanation of symbols]

2  固定金型、3  可動金型、5  可動取付板、
5c  挿通孔、6  エジェクタ機構、12  緩衝
具、13  弾性部材、14  支持リング、15  
締付ボルト。
2 fixed mold, 3 movable mold, 5 movable mounting plate,
5c insertion hole, 6 ejector mechanism, 12 buffer, 13 elastic member, 14 support ring, 15
Tightening bolt.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】  エジェクタ機構を装着した可動金型を
取り付ける可動取付板に対し、取り外し可能に取り付け
られる弾性部材よりなるエジェクタ機構を備えた成形金
型用緩衝具。
1. A shock absorber for a molding die, comprising an ejector mechanism made of an elastic member that is removably attached to a movable mounting plate to which a movable die equipped with the ejector mechanism is attached.
【請求項2】  請求項1において弾性部材は可動取付
板に支持される支持リングを有するエジェクタ機構を備
えた成形金型用緩衝具。
2. A shock absorber for a mold according to claim 1, wherein the elastic member includes an ejector mechanism having a support ring supported by a movable mounting plate.
【請求項3】  請求項2において支持リングは可動取
付板に形成された挿通孔を貫通して該支持リングを締め
付け固定するボルトを有するエジェクタ機構を備えた成
形金型用緩衝具。
3. The shock absorber for a molding die according to claim 2, wherein the support ring is provided with an ejector mechanism having a bolt that passes through an insertion hole formed in the movable mounting plate and tightens and fixes the support ring.
JP10767291A 1991-05-13 1991-05-13 Buffer jig for mold equipped with ejector mechanism Pending JPH04336217A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10767291A JPH04336217A (en) 1991-05-13 1991-05-13 Buffer jig for mold equipped with ejector mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10767291A JPH04336217A (en) 1991-05-13 1991-05-13 Buffer jig for mold equipped with ejector mechanism

Publications (1)

Publication Number Publication Date
JPH04336217A true JPH04336217A (en) 1992-11-24

Family

ID=14465074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10767291A Pending JPH04336217A (en) 1991-05-13 1991-05-13 Buffer jig for mold equipped with ejector mechanism

Country Status (1)

Country Link
JP (1) JPH04336217A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210229333A1 (en) * 2020-01-28 2021-07-29 Seiko Epson Corporation Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210229333A1 (en) * 2020-01-28 2021-07-29 Seiko Epson Corporation Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold
US11845212B2 (en) * 2020-01-28 2023-12-19 Seiko Epson Corporation Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold

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