JPH04335016A - Water-soluble epoxy resin composition - Google Patents
Water-soluble epoxy resin compositionInfo
- Publication number
- JPH04335016A JPH04335016A JP13329691A JP13329691A JPH04335016A JP H04335016 A JPH04335016 A JP H04335016A JP 13329691 A JP13329691 A JP 13329691A JP 13329691 A JP13329691 A JP 13329691A JP H04335016 A JPH04335016 A JP H04335016A
- Authority
- JP
- Japan
- Prior art keywords
- water
- epoxy resin
- parts
- soluble epoxy
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004846 water-soluble epoxy resin Substances 0.000 title claims description 15
- 239000000203 mixture Substances 0.000 title claims description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 12
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 10
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 23
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 5
- 239000012975 dibutyltin dilaurate Substances 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- -1 amino compound Chemical class 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- 229920006173 natural rubber latex Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000003021 water soluble solvent Substances 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、水溶解性あるいは水分
散性に優れた水溶性エポキシ樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water-soluble epoxy resin composition having excellent water solubility or water dispersibility.
【0002】0002
【従来の技術】従来、水溶性エポキシ樹脂は、エポキシ
樹脂中のエポキシ基にアミノ化合物あるいはカルボキシ
化合物などを反応させてアミノ基あるいはカルボン酸基
などを導入して水溶性化樹脂をうることが知られていた
。しかしながら、従来のこれらの水溶性エポキシ樹脂は
官能基であるエポキシ基の含有量が減少しているので、
エポキシ基による架橋反応は期待できない。従ってエポ
キシ樹脂としての物性は期待出来なかった。またこれら
の水溶性エポキシ樹脂はカチオン性、アニオン性である
ので他成分を混合する際、イオン的制限があるという問
題があった。[Prior Art] Conventionally, it has been known that water-soluble epoxy resins can be obtained by reacting an amino compound or a carboxy compound with an epoxy group in the epoxy resin to introduce an amino group or a carboxylic acid group. It was getting worse. However, these conventional water-soluble epoxy resins have a reduced content of epoxy groups, which are functional groups.
A crosslinking reaction due to epoxy groups cannot be expected. Therefore, the physical properties as an epoxy resin could not be expected. Furthermore, since these water-soluble epoxy resins are cationic and anionic, there is a problem in that there are ionic limitations when mixing other components.
【0003】0003
【発明が解決しようとする課題】本発明者は、非イオン
性で、エポキシ基を用いない方法で水溶化するエポキシ
樹脂を見出すべく鋭意検討した結果、エポキシ樹脂中の
水酸基にモノアルコキシポリエチレングリコールとポリ
イソシアネートを反応させることにより水溶性化が可能
になることを見出し本発明を完成するに至った。[Problems to be Solved by the Invention] As a result of intensive studies to find an epoxy resin that is non-ionic and can be made water-soluble by a method that does not use epoxy groups, the present inventor discovered that monoalkoxypolyethylene glycol was added to the hydroxyl groups in the epoxy resin. The present invention was completed by discovering that water solubility can be achieved by reacting polyisocyanate.
【0004】0004
【課題を解決するための手段】即ち、本発明はエポキシ
樹脂の水酸基1モルに対してモノアルコキシポリエチレ
ングリコール0.25〜1.0モルおよびポリイソシア
ネートのイソシアネート基0.50〜2.0モルを反応
させて得られることを特徴とする水溶性エポキシ樹脂組
成物である。[Means for Solving the Problems] That is, in the present invention, 0.25 to 1.0 mole of monoalkoxypolyethylene glycol and 0.50 to 2.0 mole of isocyanate group of polyisocyanate are added to 1 mole of hydroxyl group of epoxy resin. This is a water-soluble epoxy resin composition characterized by being obtained by reaction.
【0005】本発明のエポキシ樹脂としては、下記の一
般式(1) で示す化合物が挙げられる。[0005] Examples of the epoxy resin of the present invention include compounds represented by the following general formula (1).
【0006】[0006]
【化1】[Chemical formula 1]
【0007】本発明に用いる一般式(1) の具体例と
しては、ビス(4−ヒドロキシフェニル)−2,2−プ
ロパンのポリグリシジルエーテルが挙げられるSpecific examples of general formula (1) used in the present invention include polyglycidyl ether of bis(4-hydroxyphenyl)-2,2-propane.
【000
8】上記のエポキシ樹脂のほか、ポリフェノール化合物
のポリグリシジルエーテルを使用することができる。こ
こで使用しうるポリフェノール化合物としては、例えば
、4,4′−ジヒドロキシベンゾフェノン、ビス(4−
ヒドロキシフェニル)−1,1−エタン、ビス(4−ヒ
ドロキシフェニル)−1,1−イソブタン、ビス(4−
ヒドロキシ−tert−ブチル−フェニル)−2,2−
プロパン、4,4′−ジヒドロキシジフェニルエーテル
、4,4′−ジヒドロキシフェニルスルホン、フェノー
ルノボラック、クレゾールノボラックなどが挙げられる
。000
8] In addition to the above-mentioned epoxy resins, polyglycidyl ethers of polyphenol compounds can be used. Examples of polyphenol compounds that can be used here include 4,4'-dihydroxybenzophenone, bis(4-
hydroxyphenyl)-1,1-ethane, bis(4-hydroxyphenyl)-1,1-isobutane, bis(4-
Hydroxy-tert-butyl-phenyl)-2,2-
Examples include propane, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxyphenyl sulfone, phenol novolak, and cresol novolak.
【0009】また、特殊エポキシ樹脂として、ポリプロ
ピレングリコールジグリシジルエーテル、ネオペンチル
グリコールジグリシジルエーテル、ダイマー酸エポキシ
化物なども使用できる。Further, as special epoxy resins, polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, dimer acid epoxidized products, etc. can be used.
【0010】本発明のモノアルコキシポリエチレングリ
コールとしては、下記の一般式(2)で示される化合物
が挙げられる。Examples of the monoalkoxypolyethylene glycol of the present invention include compounds represented by the following general formula (2).
【0011】[0011]
【化2】
(ここでRはメチル基、エチル基、プロピル基あるいは
フェニル基である。)[Chemical formula 2] (Here, R is a methyl group, an ethyl group, a propyl group, or a phenyl group.)
【0012】nは平均5〜120である。Rは特にメチ
ル基が好ましく、またはnは特に10〜30が好ましい
。[0012] n is 5 to 120 on average. R is particularly preferably a methyl group, or n is particularly preferably 10-30.
【0013】例えば、n=14のメトキシポリエチレン
グリコール(分子量650)などが使用できる。For example, methoxypolyethylene glycol (molecular weight 650) with n=14 can be used.
【0014】本発明に用いるポリイソシアネートとして
は、フェニレンジイソシアネート、トリレンジイソシア
ネート、キシリレンジイソシアネート、ナフチレンジイ
ソシアネート、ジフェニルメタンジイソシアネートなど
およびこれら異性体からなる芳香族系ジイソシアネート
、1,6─ヘキサメチレンジイソシアネート、1,12
−ドデカンジイソシアネートなどの脂肪族ジイソシアネ
ート、シクロヘキサンジイソシアネート、ジシクロヘキ
シルメタンジイソシアネート、イソホロンジイソシアネ
ートなどの脂環式ジイソシアネートなどを挙げることが
できる。Examples of the polyisocyanate used in the present invention include phenylene diisocyanate, tolylene diisocyanate, xylylene diisocyanate, naphthylene diisocyanate, diphenylmethane diisocyanate, aromatic diisocyanates consisting of isomers thereof, 1,6-hexamethylene diisocyanate, 1 ,12
Examples include aliphatic diisocyanates such as -dodecane diisocyanate, alicyclic diisocyanates such as cyclohexane diisocyanate, dicyclohexylmethane diisocyanate, and isophorone diisocyanate.
【0015】また、これらの化合物と活性水素基含有化
合物との反応によるイソシアネート基末端化合物、ある
いは、これらの化合物の反応、例えばカルボジイミド化
反応によるイソシアネート変性体なども挙げることがで
きる。[0015] Also included are isocyanate-terminated compounds obtained by reacting these compounds with active hydrogen group-containing compounds, and isocyanate-modified products obtained by reacting these compounds, such as carbodiimidization reactions.
【0016】また、メタノール、n−ブタノール、ベン
ジルアルコール、アセト酢酸エチル、ε−カプロラクタ
ム、メチルエチルケトンオキシム、フェノール、クレゾ
ールなどの活性水素を分子内に1個有するブロック剤で
一部または全部を安定化したポリイソシアネートなども
挙げることができる。[0016] In addition, some or all of the compounds were stabilized with a blocking agent having one active hydrogen in the molecule, such as methanol, n-butanol, benzyl alcohol, ethyl acetoacetate, ε-caprolactam, methyl ethyl ketone oxime, phenol, and cresol. Mention may also be made of polyisocyanates.
【0017】エポキシ樹脂、モノアルコキシポリエチレ
ングリコールおよびポリイソシアネートの配合比は、エ
ポキシ樹脂の水酸基1モルに対してモノアルキコシポリ
エチレングリコールを0.25〜1.0モル、ポリイソ
シアネート基を0.50〜2.0モルである。The blending ratio of the epoxy resin, monoalkoxy polyethylene glycol and polyisocyanate is 0.25 to 1.0 mole of monoalkoxy polyethylene glycol and 0.50 to 1.0 mole of polyisocyanate group per mole of hydroxyl group of the epoxy resin. It is 2.0 mol.
【0018】モノアルコキシポリエチレングリコールが
0.25モル未満およびポリイソシアネートが0.50
モル未満の場合はエポキシ樹脂が水溶化されず、また、
それぞれ1.0モルおよび2.0モルを超える場合は未
反応のイソシアネート基が系内に残り、水を添加した際
、発泡現象を起こすので好ましくない。Less than 0.25 mole of monoalkoxypolyethylene glycol and 0.50 mole of polyisocyanate
If the amount is less than mol, the epoxy resin will not be water-solubilized, and
If the amount exceeds 1.0 mol and 2.0 mol, respectively, unreacted isocyanate groups remain in the system, causing a foaming phenomenon when water is added, which is not preferable.
【0019】本発明の反応方法は、3成分同時反応方法
でも、あるいはモノアルコキシポリエチレングリコール
とポリイソシアネートを予め反応させた後、エポキシ樹
脂と反応させる方法でもよい。The reaction method of the present invention may be a three-component simultaneous reaction method or a method in which monoalkoxypolyethylene glycol and polyisocyanate are reacted in advance and then reacted with an epoxy resin.
【0020】反応の際、通常ウレタン化反応で用いる溶
媒を使用することができる。溶媒の例としては、アセト
ン、酢酸エチル、メチルエチルケトン、テトラヒドロフ
ランなどがある。[0020] During the reaction, a solvent commonly used in urethanization reactions can be used. Examples of solvents include acetone, ethyl acetate, methyl ethyl ketone, tetrahydrofuran, and the like.
【0021】反応の際、必要に応じてトリエチレンジア
ミン、ジブチル錫ジラウレートなどのウレタン化触媒を
用いることが出来る。反応温度としては20〜160℃
で実施できる。[0021] During the reaction, a urethanization catalyst such as triethylenediamine or dibutyltin dilaurate may be used as required. The reaction temperature is 20-160℃
It can be carried out with
【0022】本発明によって得られた水溶性エポキシ樹
脂は、水を添加して容易に水溶液状または乳濁状とする
ことが出来る。水のほかにアセトン、ジオキサンなどの
水溶性溶剤を一部使用することができる。The water-soluble epoxy resin obtained by the present invention can be easily made into an aqueous solution or emulsion by adding water. In addition to water, some water-soluble solvents such as acetone and dioxane can be used.
【0023】本発明によって得られる水溶性エポキシ樹
脂は、必要に応じて他の樹脂を添加することができる。
他の樹脂として例えば、ポリビニルアルコール、ポリエ
チレングリコール、ポリエチレングリコール、ポリプロ
ピレングリコール共重合体、水溶性アルキッド樹脂、ブ
タジエン系エマルジョン、塩ビ酢ビ系エマルジョン、天
然ゴムラテックス、水溶性セルロースなどが挙げられる
。[0023] Other resins may be added to the water-soluble epoxy resin obtained by the present invention, if necessary. Examples of other resins include polyvinyl alcohol, polyethylene glycol, polyethylene glycol, polypropylene glycol copolymers, water-soluble alkyd resins, butadiene emulsions, vinyl chloride-vinyl acetate emulsions, natural rubber latex, and water-soluble cellulose.
【0024】また、本発明によって得られる水溶性エポ
キシ樹脂は、必要に応じて他の物質、例えば酸化防止剤
、紫外線吸収剤、耐熱性向上剤、着色剤、無機および有
機充填剤、可塑剤、滑剤、帯電防止剤、補強材、分散安
定剤などを添加することができる。The water-soluble epoxy resin obtained by the present invention may also contain other substances, such as antioxidants, ultraviolet absorbers, heat resistance improvers, colorants, inorganic and organic fillers, plasticizers, A lubricant, an antistatic agent, a reinforcing agent, a dispersion stabilizer, etc. can be added.
【0025】[0025]
【発明の効果】本発明の水溶性エポキシ樹脂はアミン系
硬化剤などを用いて、水系の塗料、接着剤、バインダー
、各種処理剤などに用いられる。また、非水系としても
使用することができ、この場合は硬化樹脂の帯電防止効
果を向上することができる。[Effects of the Invention] The water-soluble epoxy resin of the present invention can be used in water-based paints, adhesives, binders, various processing agents, etc. by using an amine curing agent. It can also be used as a nonaqueous system, and in this case, the antistatic effect of the cured resin can be improved.
【0026】[0026]
【実施例】本発明について、実施例および比較例により
さらに詳細に説明するが、本発明はこれらにより何ら限
定されるものではない。なお、実施例および比較例にお
いて、「部」および「%」はすべて「重量部」および「
重量%」を示す。EXAMPLES The present invention will be explained in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto. In addition, in Examples and Comparative Examples, "parts" and "%" all refer to "parts by weight" and "parts by weight".
% by weight.
【0027】実施例1
温度計、冷却器、攪拌機、窒素ガス導入口兼原料仕込み
口を備えた500mlのフラスコに、モノメトキシポリ
エチレングリコール(分子量690)82.9部(水酸
基として、0.12モル)、2,4−トリレンジイソシ
アネート20.9部(イソシアネート基として、0.2
4モル)およびアセトン69.2部を仕込み55℃に加
熱混合した。8時間後、エピコート1001(シェル化
学製、水酸基価146)のアセトン溶液(樹脂分60%
)77.1部(水酸基0.12モル)およびジブチル錫
ジラウレート0.01部を添加した。55℃、4時間後
イソシアネート基濃度が0.1%以下であることを確認
して反応を終了した。上記水溶性エポキシ樹脂150部
に水300部を加えて攪拌すると透明な水溶液が得られ
た。Example 1 82.9 parts of monomethoxypolyethylene glycol (molecular weight 690) (0.12 mol as hydroxyl group) was placed in a 500 ml flask equipped with a thermometer, a cooler, a stirrer, and a nitrogen gas inlet and raw material inlet. ), 20.9 parts of 2,4-tolylene diisocyanate (0.2 parts as isocyanate group)
4 mol) and 69.2 parts of acetone were charged and mixed while heating to 55°C. After 8 hours, an acetone solution (resin content 60%) of Epikote 1001 (manufactured by Shell Chemical, hydroxyl value 146) was added.
) 77.1 parts (0.12 mol of hydroxyl groups) and 0.01 part of dibutyltin dilaurate were added. After 4 hours at 55°C, it was confirmed that the isocyanate group concentration was 0.1% or less, and the reaction was terminated. When 300 parts of water was added to 150 parts of the water-soluble epoxy resin and stirred, a transparent aqueous solution was obtained.
【0028】実施例2
実施例1と同じフラスコに分子量800のモノメトキシ
ポリエチレングリコール69.3部(水酸基として、0
.0866モル)、2,4−トリレンジイソシアネート
15.1部(イソシアネート基として0.174モル)
およびアセトン56.3部を仕込み55℃に加熱混合し
た。8時間後、エピコート1004(水酸基価185)
のアセトン溶液(樹脂分60%)109.3部(水酸基
0.217モル)およびジブチル錫ジラウレート0.0
1部を添加した。55℃、4時間後イソシアネート基濃
度が0.1%以下であることを確認して反応を終了した
。上記の水溶性エポキシ樹脂150部に水300部を加
えて攪拌すると乳白色の水溶液が得られた。この水溶液
を68℃に加熱してアセトンを留出させた後も安定な乳
白色の水溶液であった。Example 2 Into the same flask as in Example 1, 69.3 parts of monomethoxypolyethylene glycol having a molecular weight of 800 (as hydroxyl group, 0
.. 0866 mol), 15.1 parts of 2,4-tolylene diisocyanate (0.174 mol as isocyanate group)
and 56.3 parts of acetone were added and mixed while heating to 55°C. After 8 hours, Epicote 1004 (hydroxyl value 185)
acetone solution (resin content 60%) 109.3 parts (hydroxyl group 0.217 mol) and dibutyltin dilaurate 0.0
1 part was added. After 4 hours at 55°C, it was confirmed that the isocyanate group concentration was 0.1% or less, and the reaction was terminated. When 300 parts of water was added to 150 parts of the above water-soluble epoxy resin and stirred, a milky white aqueous solution was obtained. Even after this aqueous solution was heated to 68° C. to distill off acetone, it remained a stable milky white aqueous solution.
【0029】実施例3
実施例1と同じフラスコに分子量690のモノメトキシ
ポリエチレングリコール78.1部(水酸基として、0
.113モル)、ジフェニルメタンジイソシアネート2
8.3部(イソシアネート基として、0.226モル)
、アセトン70.9部およびエピコート1001のアセ
トン溶液(樹脂分60%)72.7部(水酸基0.11
3モル)を仕込み55℃に加熱混合した。55℃、2時
間後ジブチル錫ジラウレート0.01部を添加してさら
に3時間反応させた。イソシアネート基濃度が0.1%
以下であることを確認して反応を終了した。上記の水溶
性エポキシ樹脂150部に水300部を加えて攪拌する
と半透明の水溶液が得られた。Example 3 Into the same flask as in Example 1, 78.1 parts of monomethoxypolyethylene glycol having a molecular weight of 690 (as hydroxyl group, 0
.. 113 mol), diphenylmethane diisocyanate 2
8.3 parts (0.226 mol as isocyanate group)
, 70.9 parts of acetone and 72.7 parts of an acetone solution of Epicote 1001 (resin content 60%) (0.11 parts of hydroxyl group)
3 mol) and heated and mixed at 55°C. After 2 hours at 55°C, 0.01 part of dibutyltin dilaurate was added and the reaction was continued for an additional 3 hours. Isocyanate group concentration is 0.1%
The reaction was terminated after confirming that the following conditions were met. When 300 parts of water was added to 150 parts of the above water-soluble epoxy resin and stirred, a translucent aqueous solution was obtained.
【0030】実施例4
実施例1と同じフラスコに分子量690のモノメトキシ
ポリエチレングリコール73.4部(水酸基として0.
106モル)、ヘキサメチレンジイソシアネーと17.
8部(イソシアネート基として0.212モル)、アセ
トン60.9部およびエピコート1001のアセトン溶
液(樹脂分60%)97.8部(水酸基0.152モル
)を仕込み55℃に加熱混合した。55℃、2時間後ジ
ブチル錫ジラウレート0.07部を添加してさらに4時
間反応させた。イソシアネート基濃度が0.1%以下で
あることを確認して反応を終了した。上記の水溶性エポ
キシ樹脂150部に水300部を加えて攪拌すると半透
明の水溶液が得られた。Example 4 Into the same flask as in Example 1, 73.4 parts of monomethoxypolyethylene glycol having a molecular weight of 690 (0.4 parts as hydroxyl groups) was added.
106 mol), hexamethylene diisocyanate and 17.
8 parts (0.212 mol as isocyanate groups), 60.9 parts of acetone, and 97.8 parts (0.152 mol of hydroxyl groups) of an acetone solution of Epicoat 1001 (resin content 60%) were charged and mixed under heating at 55°C. After 2 hours at 55°C, 0.07 part of dibutyltin dilaurate was added and the reaction was continued for an additional 4 hours. The reaction was terminated after confirming that the isocyanate group concentration was 0.1% or less. When 300 parts of water was added to 150 parts of the above water-soluble epoxy resin and stirred, a translucent aqueous solution was obtained.
Claims (1)
モノアルコキシポリエチレングリコール0.25〜1.
0モルおよびポリイソシアネートのイソシアネート基0
.50〜2.0モルを反応させて得られることを特徴と
する水溶性エポキシ樹脂組成物。Claim 1: Monoalkoxypolyethylene glycol 0.25 to 1.0% per mole of hydroxyl group of epoxy resin.
0 moles and 0 isocyanate groups of polyisocyanate
.. A water-soluble epoxy resin composition obtained by reacting 50 to 2.0 moles.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13329691A JPH04335016A (en) | 1991-05-10 | 1991-05-10 | Water-soluble epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13329691A JPH04335016A (en) | 1991-05-10 | 1991-05-10 | Water-soluble epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04335016A true JPH04335016A (en) | 1992-11-24 |
Family
ID=15101342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13329691A Pending JPH04335016A (en) | 1991-05-10 | 1991-05-10 | Water-soluble epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04335016A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010526347A (en) * | 2007-05-08 | 2010-07-29 | コーロン インダストリーズ インク | Lip cord for optical cable and manufacturing method thereof |
-
1991
- 1991-05-10 JP JP13329691A patent/JPH04335016A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010526347A (en) * | 2007-05-08 | 2010-07-29 | コーロン インダストリーズ インク | Lip cord for optical cable and manufacturing method thereof |
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