JPH0433256Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a carrier tape that allows chip parts to be easily replaced after being encapsulated at regular intervals.

Prior Art Chip parts such as chip capacitors, chip resistors, and chip transistors are shown in Figures 7 and 8.
They are sealed at regular intervals in a carrier tape 1 as shown in the figure and shipped. This carrier tape 1 is used for automatic mounting on a printed circuit board. In this enclosing process, a long bottom tape 4 is prepared in which recesses 3, 3, . A long top seal tape 5 to close this embossed opening.
The parts are pasted together and the joints are thermocompressed to integrate.
The carrier tape 1 is usually made of a transparent resin tape so that the enclosed state can be seen from the outside.

Before shipping, the carrier tape 1 containing the chip parts 2, 2... is visually inspected from the outside to check whether the enclosed chip parts 2 have any defects such as cracks or chips, and whether there are any marking defects. Furthermore, it is checked whether the directions are aligned in a predetermined direction. If a defective product is found, the defective product is replaced with a non-defective product, or if the chip parts 2 are oriented in a different direction, the orientation is adjusted, and all the stored chip parts 2 are shipped as non-defective products.

For replacement of the above-mentioned defective products, as shown in Figure 9,
After cutting and removing one side wall of the recess 3 of the bottom tape 4 with a cutter, taking out the chip component 2 inside, and replacing the chip component, as shown in FIG. This is done by sealing 6 with adhesive tape 7 such as cellophane tape.

Problems to be Solved by the Invention The conventional carrier tape described above must be repaired with adhesive tape 7 after chip parts are replaced.

However, this work is extremely troublesome as it requires many man-hours for cutting, replacing, and repairing, and causes an increase in costs.

In addition, if the adhesive tape 7 is applied incorrectly, there are problems in that the automatic mounting device becomes clogged, or the adhesive tape 7 peels off and the replaced chip component 2 falls off.

Means for Solving the Problems The carrier tape provided by this invention consists of a long bottom tape in which recesses for storing chip parts are formed at regular intervals, and a long top seal tape that closes the openings of the recesses. A perforation is formed near the bottom of the recess, and a cap for closing the chip component ejection hole opened along the perforation is placed at the overlapping part of the recess and the cap. It is characterized in that it is attached by engaging a provided locking part.

Function The carrier tape described above can be repaired very easily by simply cutting the bottom of the recess along the perforations, replacing the chip parts, and then fitting the cap.

Embodiment In FIG. 1 showing a carrier tape 9 of the present invention, 10 is a long bottom tape in which recesses 11, 11, . . . are formed at predetermined intervals, and 12 is a long top seal tape.

Here, locking parts 13, 13, etc., such as hemispherical protrusions, are formed at predetermined intervals along the bottom surface of the side surface of the recess 11.

This top seal tape 12 is a chip part 14.
It is joined to the bottom tape 10 so as to close the opening of the recess 11 containing the . This joining is, for example, thermocompression bonding, and the material of the bottom tape 10 and top seal tape 12 is, for example, a thin, elastic transparent resin such as vinyl chloride.

Chip parts 14, 14 are attached to this carrier tape 9.
If, after enclosing..., a defect such as a crack, a chip, or a poor seal is found in the chip part 14 during a visual inspection before shipping, the chip part 14 can be replaced with a non-defective part by checking the bottom surface 11a of the recess 11 as described below. This is done by cutting and removing along the perforations. When the chip component replacement etc. are completed, the cap 15 is attached to close the chip component removal hole 11b formed in the recess 11 by the above-mentioned cutting.

This cap 15 is a lid with a flange that covers the chip component removal hole 11b of the recess 11 from the outside.
6 has locking portions 17, 17, . . . formed at positions corresponding to the locking portions 13, 13, . . . of the recess 11.
The material of this cap 15 is the same as that of the bottom tape 10, for example, vinyl chloride.

This fitting of the cap 15 is easily done by simply pressing it down from above, as shown in FIG. to be integrated into.

In addition to the hemispherical protrusions shown in FIGS. 2 and 3, various shapes of the locking portions 13 and 17 are conceivable.

For example, as shown in FIG. 4, the locking portion of the recess 11 may be a mushroom-shaped protrusion 13a, and the locking portion of the cap 15 may be a corresponding mushroom-shaped recess 17a, or as shown in FIG. The locking portion of the recess 11 may be a protrusion 13b facing the top seal tape, and the locking portion of the cap 15 may be a hole 17b into which the protrusion 13b is fitted.

In addition, in order to facilitate cutting of the bottom surface 11a of the recess 11, as shown in FIG.
Perforations 18 are formed along the bottom surface. Utilizing this perforation 18 makes cutting easier and eliminates damage to the chip parts that tends to occur when cutting with a cutter.

Effects of the invention According to the invention, repair work after inspection of a carrier tape containing chip parts, which is performed before shipping, can be performed reliably in a short time.

Therefore, the cost of the repair process can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a carrier tape according to an embodiment of the present invention. 2 and 3 are sectional views showing the carrier tape shown in FIG. 1 before and after a cap is attached, respectively. FIGS. 4 and 5 are cross-sectional views showing other examples of shapes of protrusions formed on the recess and the cap, and FIG.
The figure is a perspective view showing another embodiment of the carrier tape. 7 to 10 show a conventional example, FIGS. 7 and 8 are a perspective view and a sectional view of the carrier tape before repair, FIG. 9 is a perspective view showing a state in which chip parts are taken out, and FIG. 10 FIG. 2 is a perspective view showing the state after repair. 9...Carrier tape, 10...Bottom tape, 11...Recess, 11a...Bottom surface, 11b...
Removal hole, 12...Top seal tape, 13,1
7...Locking portion, 14...Chip parts, 15...Cap.

Claims (1)

[Claims for Utility Model Registration] A bottom tape with a series of recesses for accommodating chip parts, and a top seal tape adhesive to close the opening on the recess side of the bottom tape, and a chip part is stored by cutting out the bottom of the recess. In the device for forming an ejection hole for a chip component, a perforation is formed near the bottom of the recess, and a cap that is cut along the perforation and closes the ejection hole formed is engaged with the recess by overlapping. A carrier tape characterized in that it is attached by means.