JPH04332405A - Heat-resisting electric insulating conductor - Google Patents
Heat-resisting electric insulating conductorInfo
- Publication number
- JPH04332405A JPH04332405A JP3102535A JP10253591A JPH04332405A JP H04332405 A JPH04332405 A JP H04332405A JP 3102535 A JP3102535 A JP 3102535A JP 10253591 A JP10253591 A JP 10253591A JP H04332405 A JPH04332405 A JP H04332405A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conductive material
- inorganic hard
- insulating material
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 68
- 239000011810 insulating material Substances 0.000 claims abstract description 54
- 238000009413 insulation Methods 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 239000011226 reinforced ceramic Substances 0.000 claims description 6
- 239000002344 surface layer Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 abstract description 5
- 238000003475 lamination Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- 229910052681 coesite Inorganic materials 0.000 description 8
- 229910052906 cristobalite Inorganic materials 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 235000012239 silicon dioxide Nutrition 0.000 description 8
- 229910052682 stishovite Inorganic materials 0.000 description 8
- 229910052905 tridymite Inorganic materials 0.000 description 8
- 230000008646 thermal stress Effects 0.000 description 7
- 230000035882 stress Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007750 plasma spraying Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000003980 solgel method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005524 ceramic coating Methods 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 208000009766 Blau syndrome Diseases 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Inorganic Insulating Materials (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、発電機，電動機，変圧
器等のコイル用導電線，ケ−ブル等の導電性部品に係り
、特に液体金属を循環する電磁ポンプ用コイル等の高温
状態で使用する電気絶縁導体及びコイルに関する。[Industrial Field of Application] The present invention relates to conductive parts such as conductive wires and cables for coils of generators, motors, transformers, etc., and particularly to coils for electromagnetic pumps that circulate liquid metal, etc. under high temperature conditions. Related to electrically insulated conductors and coils used in
【０００２】0002
【従来の技術】従来の導線の絶縁には、導体上に、直接
もしくは油性エナメル塗料，ポリエステル塗料などの絶
縁塗料を塗布，焼き付けすることにより形成される絶縁
層を介して、ポリアミド樹脂，ポリビニルブチラ−ル樹
脂，ポリビニルホルマ−ル樹脂あるいはこれに耐熱性を
向上させるためにエポキシ樹脂，フェノ−ル樹脂，メラ
ミン樹脂などを混合した樹脂組成物を適当な溶剤に溶解
した樹脂液を同様に塗布、焼き付けしたものなど有機絶
縁材料が使用されているが、高温の液体金属を循環する
電磁ポンプ等に用いる高温用コイルの絶縁材料としては
、これらの有機絶縁材料は冷却しないかぎり使用できな
い。耐熱性に優れた絶縁材料としてマイカ、セラミック
などの無機硬質絶縁材料の使用が考えられるが、これら
は導体に比べ、熱膨張率が小さく、圧縮応力には強いが
、引張応力には脆い特性を有しているため、これらを絶
縁材としてコ−ティングした導体を高温にすると、両者
の熱膨張率の差による熱応力により絶縁材料に剥離、亀
裂が生じ、絶縁性能が著しく低下する。[Prior Art] Conventionally, conducting wires are insulated using polyamide resin, polyvinyl butyl resin, etc., either directly or through an insulating layer formed by applying and baking an insulating paint such as oil-based enamel paint or polyester paint onto the conductor. Similarly, apply a resin solution prepared by dissolving ral resin, polyvinyl formal resin, or a resin composition mixed with epoxy resin, phenol resin, melamine resin, etc. in an appropriate solvent to improve heat resistance. Organic insulating materials, such as baked ones, are used, but these organic insulating materials cannot be used as insulating materials for high-temperature coils used in electromagnetic pumps that circulate high-temperature liquid metal unless they are cooled. Inorganic hard insulating materials such as mica and ceramics can be used as insulating materials with excellent heat resistance, but these have a lower coefficient of thermal expansion than conductors and are strong against compressive stress but brittle against tensile stress. Therefore, when a conductor coated with these insulating materials is heated to a high temperature, the insulating material peels and cracks due to thermal stress due to the difference in coefficient of thermal expansion between the two, resulting in a significant drop in insulation performance.
【０００３】0003
【発明が解決しようとする課題】従来の導電線あるいは
巻線には、限られたスペ−スに大電流を供給したり、多
数の線をより合わせたりするので絶縁する必要があり、
導電体の他にこの絶縁物の占める比率が大きいこと、大
電流が流れる場合は電磁気力により線相互がこすれたり
、たたかれたりすること、上述の有機絶縁材料は電線の
抵抗発熱に対して耐熱性が乏しく、電流値に制約がある
こと、エナメル線などでは、これらの外的要因により絶
縁材料が容易に損傷し、絶縁破壊する恐れがあること等
の問題があった。[Problems to be Solved by the Invention] Conventional conductive wires or winding wires must be insulated because large currents are supplied to a limited space or a large number of wires are twisted together.
In addition to the conductor, this insulator accounts for a large proportion; when a large current flows, the wires rub or strike each other due to electromagnetic force; There are problems such as poor heat resistance, restrictions on current value, and enamelled wires, etc., where the insulating material is easily damaged by these external factors and there is a risk of dielectric breakdown.
【０００４】これらの問題を解決するために導電材表面
に耐熱性に優れ、絶縁抵抗の大きな無機硬質絶縁材料か
らなる薄膜を緻密かつ強固に形成することが考えられる
が、前述したように、無機硬質絶縁材料は、導体に比べ
、熱膨張率が小さく、引張応力には脆いことから高温に
すると両者の熱膨張率の差による熱応力により絶縁材料
に剥離、亀裂が生じ、絶縁性能が著しく低下する恐れが
あった。一方、例えば、特開昭６０−１１４５６１号公
報には、金属表面からのセラミックコーティングの剥離
や割れを防止するために、セラミックコーティング中に
金属粉末を混入し、その混入比率をコーティングの厚み
方向に変化させる技術が開示されている。しかしこの技
術をコイル用電線に適用しようとしても、コイルに用い
られる電線のように、コーティング後に曲げ加工を受け
ることは想定されておらず、曲げることによってコーテ
ィングに亀裂が生じ、絶縁低下を来す恐れがあった。
また、溶射によって形成されたコーティングには粒子間
に空隙が多く、絶縁性能の面からは好ましくなかった。In order to solve these problems, it is conceivable to form a dense and strong thin film made of an inorganic hard insulating material with excellent heat resistance and high insulation resistance on the surface of a conductive material. Rigid insulating materials have a smaller coefficient of thermal expansion than conductors and are brittle under tensile stress, so when heated to high temperatures, the thermal stress caused by the difference in the coefficient of thermal expansion between the two causes peeling and cracking in the insulating material, significantly reducing insulation performance. There was a fear that it would happen. On the other hand, for example, in Japanese Patent Application Laid-open No. 114561/1983, in order to prevent the ceramic coating from peeling or cracking from the metal surface, metal powder is mixed into the ceramic coating, and the mixing ratio is adjusted in the thickness direction of the coating. Techniques for changing this are disclosed. However, even if this technology is applied to wires for coils, it is not assumed that the wires used for coils will be bent after being coated, and bending will cause cracks in the coating, resulting in a decrease in insulation. There was fear. Furthermore, the coating formed by thermal spraying had many voids between particles, which was not desirable from the standpoint of insulation performance.
【０００５】本発明の課題は、高温でも耐熱性及び絶縁
性能が低下しないコイルを提供するにある。An object of the present invention is to provide a coil whose heat resistance and insulation performance do not deteriorate even at high temperatures.
【０００６】[0006]
【課題を解決するための手段】上記の課題は、導電材と
、該導電材の表面に形成された導電材と無機硬質絶縁材
料の混合積層と、該混合積層表面に形成された無機硬質
絶縁材料からなる絶縁皮膜とを含んでなり、少なくとも
絶縁皮膜の表面層の粒子間の空隙が無機硬質絶縁材料に
より充填されている耐熱電気絶縁導体により達成される
。[Means for Solving the Problem] The above problem is solved by a conductive material, a mixed laminated layer of a conductive material and an inorganic hard insulating material formed on the surface of the conductive material, and an inorganic hard insulating material formed on the surface of the mixed laminated layer. This is achieved by a heat-resistant electrically insulated conductor comprising an insulating film made of a material, and at least the voids between particles in the surface layer of the insulating film are filled with an inorganic hard insulating material.
【０００７】上記の課題はまた、導電材と混合積層の間
に、前記導電材と同材質からなる無数の微小空隙を有す
る層が設けられている請求項１に記載の耐熱電気絶縁導
体によっても達成される。The above problem can also be solved by the heat-resistant electrically insulated conductor according to claim 1, wherein a layer made of the same material as the conductive material and having countless microscopic voids is provided between the conductive material and the mixed laminated layer. achieved.
【０００８】上記の課題はまた、混合積層の導電材と無
機硬質絶縁材料の混合比が、該混合積層の厚さ方向に変
化している請求項１または２に記載の耐熱電気絶縁導体
によっても達成される。The above problem can also be solved by the heat-resistant electrically insulated conductor according to claim 1 or 2, wherein the mixing ratio of the conductive material and the inorganic hard insulating material in the mixed laminate varies in the thickness direction of the mixed laminate. achieved.
【０００９】上記の課題はまた、絶縁皮膜及びまたは混
合積層が、繊維強化セラミックス（ＦＲＣ）からなる請
求項１乃至３のいずれかに記載の耐熱電気絶縁導体によ
っても達成される。The above object is also achieved by the heat-resistant electrically insulated conductor according to any one of claims 1 to 3, wherein the insulating film and/or the mixed laminate is made of fiber reinforced ceramics (FRC).
【００１０】上記の課題はまた、耐熱電気絶縁導体を用
いて形成された高温コイルにおいて、前記耐熱電気絶縁
導体を請求項１乃至４のいずれかに記載の耐熱電気絶縁
導体とすることによっても達成される。The above object can also be achieved in a high-temperature coil formed using a heat-resistant electrically insulated conductor, by making the heat-resistant electrically insulated conductor the heat-resistant electrically insulated conductor according to any one of claims 1 to 4. be done.
【００１１】上記の課題はまた、請求項５に記載の高温
コイルにおいて、コイル表面に無機硬質絶縁材料を充填
することによっても達成される上記の課題はまた、耐熱
電気絶縁導体を用いて形成された高温コイルにおいて、
前記耐熱電気絶縁導体を導電材と、該導電材の表面に形
成された導電材と無機硬質絶縁材料の混合積層と、該混
合積層表面に形成された無機硬質絶縁材料からなる絶縁
皮膜とを含んで形成し、該耐熱電気絶縁導体を用いて構
成された高温コイル表面に無機硬質絶縁材料を充填する
ことによっても達成される。The above object can also be achieved by filling the coil surface with an inorganic hard insulating material in the high temperature coil according to claim 5. The above object can also be achieved by filling the coil surface with an inorganic hard insulating material. In the high temperature coil,
The heat-resistant electrically insulated conductor includes a conductive material, a mixed laminated layer of a conductive material and an inorganic hard insulating material formed on the surface of the conductive material, and an insulating film made of an inorganic hard insulating material formed on the surface of the mixed laminated layer. This can also be achieved by filling the surface of a high-temperature coil constructed using the heat-resistant electrically insulated conductor with an inorganic hard insulating material.
【００１２】上記の課題はまた、請求項５乃至７のいず
れかに記載の高温コイルにおいて、コイルの対地絶縁を
無機硬質絶縁材料の溶射皮膜で形成し、該溶射皮膜の粒
子間の空隙の一部あるいは全てを無機硬質絶縁材料によ
り充填することや、コイルの対地絶縁を繊維強化セラミ
ックスで形成することによっても達成される。The above-mentioned problem is also solved in the high-temperature coil according to any one of claims 5 to 7, in which the ground insulation of the coil is formed by a thermally sprayed coating of an inorganic hard insulating material, and one of the voids between particles of the thermally sprayed coating is formed. This can also be achieved by filling part or all of the coil with an inorganic hard insulating material, or by forming the coil's ground insulation with fiber-reinforced ceramics.
【００１３】[0013]
【作用】導電材と、ＺｒＯ２−ＭｇＯ，Ｚｒ−ＣａＯ，
ＺｒＯ２−Ｙ２Ｏ３等の無機硬質絶縁材料からなる絶縁
皮膜の間に設けられた、導電材と無機硬質絶縁材料の混
合積層は両者の中間的な熱膨張性、熱伝導性を有し、導
電材の発熱による導電材と絶縁皮膜の間の温度勾配を緩
和する。温度勾配が緩和されると熱応力が分散されるた
め、高温においても無機硬質絶縁材料からなる絶縁皮膜
に働く熱応力が低減される。また、絶縁皮膜を溶射によ
り形成させた場合に生じる空隙に無機硬質絶縁材料が充
填されると、該絶縁皮膜の電気絶縁性が向上する。さら
に、コイル形成時に絶縁皮膜に生じる亀裂に、無機硬質
絶縁材料が充填されると、亀裂部分の応力集中が緩和さ
れ、該絶縁皮膜の強度が向上する。[Function] Conductive material, ZrO2-MgO, Zr-CaO,
The mixed laminated layer of a conductive material and an inorganic hard insulating material, which is provided between the insulating films made of an inorganic hard insulating material such as ZrO2-Y2O3, has thermal expansion and thermal conductivity intermediate between the two. Alleviates the temperature gradient between the conductive material and the insulating film due to heat generation. Since the thermal stress is dispersed when the temperature gradient is relaxed, the thermal stress acting on the insulating film made of the inorganic hard insulating material is reduced even at high temperatures. Furthermore, when the inorganic hard insulating material is filled into the voids created when the insulating film is formed by thermal spraying, the electrical insulation properties of the insulating film are improved. Furthermore, when cracks that occur in the insulating film during coil formation are filled with an inorganic hard insulating material, stress concentration in the cracked portions is alleviated and the strength of the insulating film is improved.
【００１４】また、導電材と絶縁皮膜の間に設けられた
、無数の微小空隙を有する、金属層，金属とセラミック
の混合積層，セラミック層などは、高温状態での導電材
と絶縁皮膜の熱膨張差を吸収し、絶縁皮膜を構成する無
機硬質絶縁材料に働く熱応力を低減する。[0014] Furthermore, metal layers, mixed laminates of metal and ceramic, ceramic layers, etc., which have countless micro-gaps provided between the conductive material and the insulating film, can absorb heat between the conductive material and the insulating film at high temperatures. It absorbs the difference in expansion and reduces the thermal stress acting on the inorganic hard insulating material that makes up the insulating film.
【００１５】空隙への無機硬質絶縁材料の充填方法とし
ては、例えばオルトケイ酸塩四エチル溶液（ＴＥＯＳ）
を溶射皮膜の空隙に真空充填した後、焼成してＳｉＯ２
を空隙に充填するゾル、ゲル法を用いる。[0015] As a method for filling the voids with an inorganic hard insulating material, for example, a tetraethyl orthosilicate solution (TEOS) is used.
is vacuum-filled into the voids of the thermal sprayed coating, and then fired to form SiO2
A sol or gel method is used to fill the voids.
【００１６】[0016]
【実施例】以下、本発明の実施例を図１〜図６により説
明する。
実施例１
本実施例においては、導電材１として銅線を用い、絶縁
皮膜３を構成する無機硬質絶縁材料としてＺｒＯ２−Ｍ
ｇＯ，Ｚｒ−ＣａＯ，ＺｒＯ２−Ｙ２Ｏ３等を用いた。
図２に示すように銅とＺｒＯ２−ＭｇＯ，Ｚｒ−ＣａＯ
，ＺｒＯ２−Ｙ２Ｏ３等の混合粉末を原料としてプラズ
マ溶射法により導電材１の銅線表面上に混合積層２を形
成した。この時、銅線側に近い層程銅粉の混合率を高く
し、遠い層程銅粉の混合率を小さくして溶射することに
より両者の成分比が連続的に変化した混合積層２とした
。次いで、その混合積層２の表面に絶縁に充分な厚さの
ＺｒＯ２−ＭｇＯ，Ｚｒ−ＣａＯ，ＺｒＯ２−Ｙ２Ｏ３
等の無機硬質絶縁材料からなる絶縁皮膜３をプラズマ溶
射法により形成させてコイル用の素線を作成した。[Embodiments] Hereinafter, embodiments of the present invention will be explained with reference to FIGS. 1 to 6. Example 1 In this example, copper wire was used as the conductive material 1, and ZrO2-M was used as the inorganic hard insulating material constituting the insulating film 3.
gO, Zr-CaO, ZrO2-Y2O3, etc. were used. As shown in Figure 2, copper and ZrO2-MgO, Zr-CaO
, ZrO2-Y2O3, etc., were used as raw materials to form a mixed laminated layer 2 on the surface of the copper wire of the conductive material 1 by plasma spraying. At this time, the layer closer to the copper wire side had a higher mixing ratio of copper powder, and the farther the layer was, the lower the mixing ratio of copper powder was thermal sprayed, resulting in a mixed laminate 2 in which the ratio of both components changed continuously. . Next, ZrO2-MgO, Zr-CaO, ZrO2-Y2O3 with a sufficient thickness for insulation is deposited on the surface of the mixed laminated layer 2.
An insulating film 3 made of an inorganic hard insulating material such as the following was formed by plasma spraying to create a wire for a coil.
【００１７】この素線４を図３に示すダブルパンケ−キ
巻きによりコイルに成形した。図４に示すように、この
コイル素線４表面の混合積層２及び絶縁皮膜３内には溶
射時に生じた空隙５、コイル成形時に生じた亀裂６があ
る。このコイルを容器にいれ、容器内を真空ポンプで減
圧したのち、該容器にＴＥＯＳ（Ｔｅｔｒａ Ｅｉｔｘ
ｌ ＯｒｔｈｏＳｉｌｉｃａｔｅ：Ｓｉ（ＯＣ２Ｈ５）
４）溶液を注入し、該溶液中に前記コイルを浸漬して混
合積層２及び絶縁皮膜３内の空隙５及び亀裂６にＴＥＯ
Ｓ溶液を含浸させた。次いで、電気炉内で４００℃に加
熱して加水分解反応によりＴＥＯＳをＳｉＯ２に転換さ
せた。この真空中でのＴＥＯＳ含浸⇒焼成（ゾル・ゲル
法によるＴＥＯＳ処理）を数回繰り返して空隙５及び亀
裂６をＳｉＯ２で充填した。このゾル・ゲル法によるＴ
ＥＯＳ処理で、少なくとも絶縁皮膜の表面層の粒子間の
空隙や亀裂がＳｉＯ２で充填されるまで、処理を繰り返
した。絶縁皮膜の表面層の粒子間の空隙がＳｉＯ２で充
填されることにより絶縁性能が向上し、かつ、前記亀裂
がＳｉＯ２で充填されることにより、亀裂部分への応力
の集中が緩和され、絶縁皮膜３や混合積層２の剥離が防
止される。図１は、空隙５及び亀裂６がＳｉＯ２９で充
填された状態を示す。This wire 4 was formed into a coil by double pancake winding as shown in FIG. As shown in FIG. 4, in the mixed laminated layer 2 and the insulating film 3 on the surface of the coil wire 4, there are voids 5 created during thermal spraying and cracks 6 created during coil forming. This coil is placed in a container, the pressure inside the container is reduced using a vacuum pump, and then TEOS (Tetra Eitx) is placed in the container.
l OrthoSilicate:Si(OC2H5)
4) Inject a solution and immerse the coil in the solution to fill the voids 5 and cracks 6 in the mixed laminated layer 2 and insulating film 3 with TEO.
Impregnated with S solution. Next, it was heated to 400° C. in an electric furnace to convert TEOS to SiO2 by a hydrolysis reaction. This TEOS impregnation and firing in vacuum (TEOS treatment by sol-gel method) was repeated several times to fill the voids 5 and cracks 6 with SiO2. T by this sol-gel method
The EOS treatment was repeated until at least the gaps and cracks between particles in the surface layer of the insulating film were filled with SiO2. By filling the gaps between particles in the surface layer of the insulating film with SiO2, the insulation performance is improved, and by filling the cracks with SiO2, the concentration of stress on the cracked portion is alleviated, and the insulating film 3 and the mixed laminated layer 2 are prevented from peeling off. FIG. 1 shows a state in which the voids 5 and cracks 6 are filled with SiO29.
【００１８】次に、図５に示すように、コイル周囲にＺ
ｒＯ２−ＭｇＯ，Ｚｒ−ＣａＯ，ＺｒＯ２−Ｙ２Ｏ３等
からなる対地絶縁皮膜７をプラズマ溶射法により形成し
た後に、ＴＥＯＳ処理をさらに数回繰り返して空隙を完
全にＳｉＯ２で充填した。
この空隙の充填により、対地絶縁皮膜７の絶縁性能が向
上した。Next, as shown in FIG. 5, Z is placed around the coil.
After forming the ground insulating film 7 made of rO2-MgO, Zr-CaO, ZrO2-Y2O3, etc. by plasma spraying, the TEOS treatment was repeated several times to completely fill the voids with SiO2. By filling this void, the insulation performance of the ground insulation film 7 was improved.
【００１９】また、対地絶縁皮膜７に繊維強化セラミッ
クス（ＦＲＣ）を使用することにより更に強度を向上さ
せることができる。Further, by using fiber reinforced ceramics (FRC) for the ground insulating film 7, the strength can be further improved.
【００２０】上記絶縁処理を行うことにより、約６００
℃の高温においても絶縁材料に亀裂、剥離が発生しない
耐熱性に優れた高温コイルとすることができ、かつ亀裂
、剥離に伴う絶縁性能低下がない高温コイルとすること
ができた。By performing the above insulation treatment, approximately 600
A high-temperature coil with excellent heat resistance that does not cause cracking or peeling of the insulating material even at high temperatures of 0.degree.
【００２１】なお、上記実施例においては、ゾル・ゲル
法によるＴＥＯＳ処理をコイル形成後に実施したが、コ
イルの曲率半径が大きく、曲げた場合の亀裂発生の恐れ
を無視できる場合は、絶縁皮膜形成後の素線に対してゾ
ル・ゲル法によるＴＥＯＳ処理を行った方が、素線の全
周の空隙に対して無機硬質絶縁材料を充填できる。In the above example, the TEOS treatment using the sol-gel method was performed after the coil was formed, but if the radius of curvature of the coil is large and the risk of cracking when bent can be ignored, the insulation coating may be formed. If the strands are subsequently subjected to TEOS treatment using the sol-gel method, the voids around the entire periphery of the strands can be filled with the inorganic hard insulating material.
【００２２】実施例２
本実施例においては図６に示すように、銅線１表面上に
銅粉のみを原料としてプラズマ溶射行い、銅線１表面に
微小空隙のある銅層８を形成した。この微小空隙のある
銅層８の上に、前記実施例１と同様な混合積層２及び絶
縁皮膜３を形成した。このような構造とすることにより
高温における銅の熱膨張を空隙５で吸収して絶縁皮膜３
に働く熱応力をさらに低減することができた。Example 2 In this example, as shown in FIG. 6, plasma spraying was carried out on the surface of a copper wire 1 using only copper powder as a raw material to form a copper layer 8 having minute voids on the surface of the copper wire 1. A mixed laminated layer 2 and an insulating film 3 similar to those in Example 1 were formed on the copper layer 8 having minute voids. With this structure, the thermal expansion of copper at high temperatures is absorbed by the voids 5 and the insulation film 3
We were able to further reduce the thermal stress acting on the
【００２３】上記各実施例における空隙５の大きさは、
原料粉末粒子径の大小，プラズマ出力，溶射ガンとの距
離，雰囲気圧力により調節することが可能である。また
、上記各実施例における絶縁皮膜及びまたは混合積層を
、無機硬質絶縁材料のかわりに、繊維強化セラミックス
（ＦＲＣ）を使用して形成することによっても同様の効
果が得られる。The size of the void 5 in each of the above embodiments is as follows:
It can be adjusted by the size of the raw material powder particles, plasma output, distance to the thermal spray gun, and atmospheric pressure. Further, the same effect can be obtained by forming the insulating film and/or the mixed laminate in each of the above embodiments using fiber reinforced ceramics (FRC) instead of the inorganic hard insulating material.
【００２４】[0024]
【発明の効果】本発明によれば、無機硬質絶縁材料から
なる絶縁皮膜と導電材の間に、両者の混合物である混合
積層が形成され、さらに前記絶縁皮膜の少なくとも表面
層の空隙が無機硬質絶縁材料で充填されるので、高温時
に絶縁皮膜に加わる熱応力が低減されるとともに、絶縁
性能が向上し、高温においても亀裂の発生や剥離がなく
、電気絶縁が破損しない耐熱電気絶縁導体が得られ、高
温でも使用可能な高温コイルが提供できる。また、絶縁
皮膜の空隙への無機硬質絶縁材料の充填をコイル形成後
に行うことにより、コイル形成時に絶縁皮膜及び混合積
層に発生する亀裂が充填され、絶縁皮膜の剥離や絶縁性
能の低下が防止される。According to the present invention, a mixed laminate, which is a mixture of the two, is formed between an insulating film made of an inorganic hard insulating material and a conductive material, and furthermore, the voids in at least the surface layer of the insulating film are made of an inorganic hard insulating material. Since it is filled with an insulating material, the thermal stress applied to the insulating film at high temperatures is reduced, the insulation performance is improved, and a heat-resistant electrically insulated conductor that does not crack or peel even at high temperatures and does not damage the electrical insulation can be obtained. It is possible to provide a high-temperature coil that can be used even at high temperatures. Furthermore, by filling the voids in the insulating film with an inorganic hard insulating material after forming the coil, cracks that occur in the insulating film and mixed laminated layers during coil formation are filled, preventing peeling of the insulating film and deterioration of insulation performance. Ru.
【図１】本発明の実施例１の空隙及び亀裂が充填された
状態を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing a state in which voids and cracks are filled in Example 1 of the present invention.
【図２】本発明の実施例１の素線横断面図である。FIG. 2 is a cross-sectional view of a wire in Example 1 of the present invention.
【図３】本発明の実施例１のコイル成形状態を示す斜視
図である。FIG. 3 is a perspective view showing a coil forming state in Example 1 of the present invention.
【図４】本発明の実施例１の空隙及び亀裂の状態を模式
的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing the state of voids and cracks in Example 1 of the present invention.
【図５】本発明の実施例１のコイルの部分を示す横断面
図である。FIG. 5 is a cross-sectional view showing a portion of a coil according to Example 1 of the present invention.
【図６】本発明の実施例２の素線の横断面図である。FIG. 6 is a cross-sectional view of a wire according to Example 2 of the present invention.
１ 導電材 ２ 混合積層 ３ 絶縁皮膜 ４ 素線 ５ 空隙 ６ 亀裂 ７ 対地絶縁 ８ 空隙のある導電材層 ９ ＳｉＯ２ 1 Conductive material 2 Mixed lamination 3 Insulating film 4 Element wire 5 Voids 6 Crack 7 Ground insulation 8 Conductive material layer with voids 9 SiO2
Claims (9)
た導電材と無機硬質絶縁材料の混合積層と、該混合積層
表面に形成された無機硬質絶縁材料からなる絶縁皮膜と
を含んでなり、少なくとも絶縁皮膜の表面層の粒子間の
空隙が無機硬質絶縁材料により充填されている耐熱電気
絶縁導体。1. A conductive material comprising a conductive material, a mixed laminated layer of a conductive material and an inorganic hard insulating material formed on the surface of the conductive material, and an insulating film made of the inorganic hard insulating material formed on the surface of the mixed laminated layer. A heat-resistant electrically insulated conductor in which at least the voids between particles in the surface layer of the insulating film are filled with an inorganic hard insulating material.
と同材質からなる無数の微小空隙を設けた層が設けられ
ていることを特徴とする請求項１に記載の耐熱電気絶縁
導体。2. The heat-resistant electrically insulated conductor according to claim 1, further comprising a layer made of the same material as the conductive material and provided with numerous microgaps between the conductive material and the mixed laminated layer. .
の混合比が、該混合積層の厚さ方向に変化していること
を特徴とする請求項１または２に記載の耐熱電気絶縁導
体。3. The heat-resistant electrically insulated conductor according to claim 1, wherein the mixing ratio of the conductive material and the inorganic hard insulating material in the mixed laminate varies in the thickness direction of the mixed laminate.
強化セラミックス（ＦＲＣ）からなることを特徴とする
請求項１乃至３のいずれかに記載の耐熱電気絶縁導体。4. The heat-resistant electrically insulated conductor according to claim 1, wherein the insulating film and/or the mixed laminate are made of fiber reinforced ceramics (FRC).
高温コイルにおいて、前記耐熱電気絶縁導体が請求項１
乃至４のいずれかに記載の耐熱電気絶縁導体であること
を特徴とする高温コイル。5. A high temperature coil formed using a heat resistant electrically insulated conductor, wherein the heat resistant electrically insulated conductor is a heat resistant electrically insulated conductor.
5. A high-temperature coil characterized by being the heat-resistant electrically insulated conductor according to any one of items 4 to 4.
されていることを特徴とする請求項５に記載の高温コイ
ル。6. The high-temperature coil according to claim 5, wherein the coil surface is filled with an inorganic hard insulating material.
高温コイルにおいて、前記耐熱電気絶縁導体が導電材と
、該導電材の表面に形成された導電材と無機硬質絶縁材
料の混合積層と、該混合積層表面に形成された無機硬質
絶縁材料からなる絶縁皮膜とを含んでなり、該耐熱電気
絶縁導体を用いて形成された高温コイル表面に無機硬質
絶縁材料が充填されていることを特徴とする高温コイル
。7. A high-temperature coil formed using a heat-resistant electrically insulated conductor, wherein the heat-resistant electrically insulated conductor comprises a conductive material, a mixed laminate of a conductive material and an inorganic hard insulating material formed on the surface of the conductive material; an insulating film made of an inorganic hard insulating material formed on the surface of the mixed laminated layer, and the surface of the high-temperature coil formed using the heat-resistant electrically insulated conductor is filled with the inorganic hard insulating material. high temperature coil.
の溶射皮膜で形成され、該溶射皮膜の粒子間の空隙の一
部あるいは全てが無機硬質絶縁材料により充填されてい
ることを特徴とする請求項５乃至７のいずれかに記載の
高温コイル。8. A claim characterized in that the ground insulation of the coil is formed by a thermally sprayed coating of an inorganic hard insulating material, and some or all of the gaps between particles of the thermally sprayed coating are filled with the inorganic hard insulating material. The high temperature coil according to any one of items 5 to 7.
クスで形成されていることを特徴とする請求項５乃至７
のいずれかに記載の高温コイル。9. Claims 5 to 7, wherein the ground insulation of the coil is made of fiber-reinforced ceramics.
A high temperature coil as described in any of the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102535A JPH04332405A (en) | 1991-05-08 | 1991-05-08 | Heat-resisting electric insulating conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3102535A JPH04332405A (en) | 1991-05-08 | 1991-05-08 | Heat-resisting electric insulating conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04332405A true JPH04332405A (en) | 1992-11-19 |
Family
ID=14329981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3102535A Pending JPH04332405A (en) | 1991-05-08 | 1991-05-08 | Heat-resisting electric insulating conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04332405A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996025750A1 (en) * | 1995-02-14 | 1996-08-22 | Sundstrand Corporation | High temperature electrical insulation system |
| JP2013530313A (en) * | 2010-07-08 | 2013-07-25 | シーメンス エナジー インコーポレイテッド | Method for forming a material layer on the surface of a non-metallic substrate |
| JP2013530312A (en) * | 2010-07-08 | 2013-07-25 | シーメンス エナジー インコーポレイテッド | Method for applying an electrically insulating material layer to the surface of a conductor |
| JP2018073903A (en) * | 2016-10-26 | 2018-05-10 | 株式会社村田製作所 | Electronic component and method of manufacturing the same |
| EP3696833A1 (en) * | 2019-02-13 | 2020-08-19 | Siemens Aktiengesellschaft | Method for producing a coil |
-
1991
- 1991-05-08 JP JP3102535A patent/JPH04332405A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996025750A1 (en) * | 1995-02-14 | 1996-08-22 | Sundstrand Corporation | High temperature electrical insulation system |
| JP2013530313A (en) * | 2010-07-08 | 2013-07-25 | シーメンス エナジー インコーポレイテッド | Method for forming a material layer on the surface of a non-metallic substrate |
| JP2013530312A (en) * | 2010-07-08 | 2013-07-25 | シーメンス エナジー インコーポレイテッド | Method for applying an electrically insulating material layer to the surface of a conductor |
| JP2018073903A (en) * | 2016-10-26 | 2018-05-10 | 株式会社村田製作所 | Electronic component and method of manufacturing the same |
| EP3696833A1 (en) * | 2019-02-13 | 2020-08-19 | Siemens Aktiengesellschaft | Method for producing a coil |
| WO2020164899A1 (en) * | 2019-02-13 | 2020-08-20 | Siemens Aktiengesellschaft | Method for producing a coil |
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