JPH04327392A - Monitoring method for laser cutting - Google Patents
Monitoring method for laser cuttingInfo
- Publication number
- JPH04327392A JPH04327392A JP3095357A JP9535791A JPH04327392A JP H04327392 A JPH04327392 A JP H04327392A JP 3095357 A JP3095357 A JP 3095357A JP 9535791 A JP9535791 A JP 9535791A JP H04327392 A JPH04327392 A JP H04327392A
- Authority
- JP
- Japan
- Prior art keywords
- cut
- wavelength
- cutting
- light
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 23
- 238000012544 monitoring process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 230000007423 decrease Effects 0.000 claims description 5
- 230000005469 synchrotron radiation Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 23
- 230000005855 radiation Effects 0.000 abstract description 17
- 239000013307 optical fiber Substances 0.000 abstract description 11
- 239000000155 melt Substances 0.000 abstract description 3
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 101100008046 Caenorhabditis elegans cut-2 gene Proteins 0.000 description 1
- 229910019589 Cr—Fe Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、切断状況を直接目視で
観察できない場合などに適用するレーザ切断のモニタリ
ング方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for monitoring laser cutting, which is applicable when the cutting situation cannot be directly observed visually.
【0002】0002
【従来の技術】レーザ切断法は、例えば、伝熱管の機械
構造部材から検査用試験片を採取するときなどに適用さ
れるが、切断状況を直接目視で観察できる場合には、マ
スク等を使用して、被切断材が完全に切断され、分離さ
れているかどうか等の切断の良否を判断している。[Prior Art] Laser cutting is applied, for example, when collecting test specimens from mechanical structural members of heat exchanger tubes, but when the cutting situation can be directly observed visually, a mask or the like is used. Then, the quality of the cutting is determined, such as whether the material to be cut is completely cut and separated.
【0003】0003
【発明が解決しようとする課題】しかしながら、直接目
視できないところを遠隔操作でレーザ切断することも考
えられるが、この場合には切断の良否を監視できないと
いう問題がある。[Problems to be Solved by the Invention] However, although it is conceivable to perform laser cutting by remote control in areas that cannot be directly visually observed, in this case there is a problem in that it is not possible to monitor the quality of the cutting.
【0004】本発明はこのような事情に鑑み、切断状況
を直接目視で観察できない遠隔操作のレーザ切断におい
て、切断の良否を判断できるレーザ切断のモニタリング
方法を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above circumstances, it is an object of the present invention to provide a method for monitoring laser cutting that can determine the quality of cutting in remote-controlled laser cutting in which the cutting situation cannot be directly observed visually.
【0005】[0005]
【課題を解決するための手段】前記目的を達成する本発
明に係るレーザ切断のモニタリング方法は、レーザ光を
用いたレーザ切断をモニタリングする方法において、レ
ーザ光と同一波長の切断部からの放射光と、これとは別
の波長の切断部からの放射光とを並行して観察し、両放
射光の光強度が同時に低下したことを検知して切断が完
了していると判断することを特徴とする。[Means for Solving the Problems] A method for monitoring laser cutting according to the present invention that achieves the above-mentioned object is a method for monitoring laser cutting using a laser beam, in which emitted light from a cutting section having the same wavelength as the laser beam is emitted. and the emitted light from the cutting section with a different wavelength are observed in parallel, and it is determined that the cutting is complete by detecting that the light intensity of both emitted lights has decreased at the same time. shall be.
【0006】[0006]
【作用】レーザ切断の場合、被切断材からの放射光が存
在するが、この中には、照射レーザの波長と同じ波長の
成分の反射光と、被切断材が溶融時に放射する該被切断
材特有の波長の成分の溶融放射光とが主に存在し、これ
らの経時変化が切断状況と密着な関係がある。レーザを
被切断材に照射すると反射光が放射されるが、被切断材
が加熱されるにつれて、反射光が減少すると共に溶融放
射光が増大する。そして、照射点の被切断材が完全に切
断されると、反射光及び溶融放射光が共に減少すると考
えられる。したがって、反射光及び溶融放射光の両者を
モニタリングして両者が同時に低下したことにより切断
され、分離されたと判断することができる。[Operation] In the case of laser cutting, there is emitted light from the material to be cut, but this includes reflected light with the same wavelength as the wavelength of the irradiated laser, and reflected light emitted by the material to be cut when it melts. There is mainly melting radiation with wavelengths specific to the material, and changes in these components over time are closely related to cutting conditions. When a material to be cut is irradiated with a laser, reflected light is emitted, but as the material to be cut is heated, the reflected light decreases and the melting radiation increases. It is considered that when the material to be cut at the irradiation point is completely cut, both the reflected light and the melting radiation light decrease. Therefore, by monitoring both the reflected light and the melting radiation, it can be determined that the beam has been cut and separated when both have decreased at the same time.
【0007】[0007]
【実施例】以下、本発明を実施例に基づいて説明する。EXAMPLES The present invention will be explained below based on examples.
【0008】図1は、本発明方法を実施するレーザ切断
を示す説明図である。同図に示すように、管状の被切断
材1内にレーザ切断先端工具2が挿入されており、この
レーザ切断工具2には、YAGレーザを伝送する光ファ
イバ3と、放射光を伝送する細径の複数本のモニタリン
グ用光ファイバ4とが連結されている。ここで、光ファ
イバ3は、図示しないYAGレーザ発振器に連結されて
おり、モニタリング用光ファイバ4は、図示しない放射
光検出器に連結されている。また、レーザ切断工具2は
、工具本体5内に光ファイバ3により伝送されたYAG
レーザを集光する集光光学系6と、この集光光学系6で
集光されたレーザ光を反射して変向する反射ミラー7と
を具えている。そして、反射ミラー7により変向された
YAGレーザは工具本体5の側面に形成された出射孔8
を介して出射光9として被切断材1に照射されるように
なっている。FIG. 1 is an explanatory diagram showing laser cutting for carrying out the method of the present invention. As shown in the figure, a laser cutting tip tool 2 is inserted into a tubular material to be cut 1, and this laser cutting tool 2 includes an optical fiber 3 that transmits a YAG laser and a thin fiber that transmits synchrotron radiation. A plurality of monitoring optical fibers 4 having different diameters are connected to each other. Here, the optical fiber 3 is connected to a YAG laser oscillator (not shown), and the monitoring optical fiber 4 is connected to a radiation light detector (not shown). The laser cutting tool 2 also includes YAG, which is transmitted through the optical fiber 3 into the tool body 5
It includes a condensing optical system 6 that condenses the laser beam, and a reflecting mirror 7 that reflects and changes the direction of the laser beam condensed by the condensing optical system 6. Then, the YAG laser whose direction is changed by the reflection mirror 7 is emitted through an emission hole 8 formed on the side surface of the tool body 5.
The material to be cut 1 is irradiated with the emitted light 9 through the emitted light 9 .
【0009】このようなレーザ切断先端工具2を用いて
被切断材1をレーザ切断する場合は、出射光9を照射し
ながら、その照射部から放射される放射光をモニタリン
グ用光ファイバ4により受光をモニタリング用光ファイ
バ4により受光し出射光9と同波長λ1 の反射光と、
被切断材1が溶融時に放射する特有の波長λ2 の溶融
放射光とを図示しない放射光検出器でモニタリングする
と、被切断1が完全切断分離されていることが判断でき
る。[0009] When cutting the workpiece 1 by laser using such a laser cutting tip tool 2, while emitting the emitted light 9, the monitoring optical fiber 4 receives the emitted light from the emitting part. is received by the monitoring optical fiber 4 and reflected light having the same wavelength λ1 as the emitted light 9,
By monitoring the melting radiation with a unique wavelength λ2 emitted by the material 1 to be cut when it melts, using a radiation detector (not shown), it can be determined that the material 1 to be cut has been completely cut and separated.
【0010】この手法を図2に基づいて詳細に説明する
。図2に示すように、被切断材1に出射光9を照射し始
めると、同時に波長λ1 の反射光が放射され始める。
そして、照射をつづけていくと時間とともに被切断材1
が加熱されていき、貫通孔が形成されていく(図2の領
域A)が、この領域では反射光の変化は少ないが、波長
λ2 の溶融放射光の強度が徐々に増加する。しかし、
照射点の被切断材が完全に切断され照射点の被切断材1
がなくなると、波長λ1 の反射光及び波長λ2 の溶
融放射光の両者の強度が共に低下する(図2の領域B)
。したがって、この状態を維持しながら照射点をずらし
ていけば切断できる。もし、この切断過程で被切断材1
が完全に切断されて分離されていない部分が生じると、
波長λ1 の反射光及び波長λ2 の溶融放射光の両者
の強度が共に再び増加する(図2の領域C)ので、この
場合には再度出射光9を照射して再び波長λ1 の反射
光と波長λ2 の溶融放射光とが低下する状態(図2の
領域D)とする必要がある。This method will be explained in detail based on FIG. As shown in FIG. 2, when the material to be cut 1 is irradiated with the emitted light 9, at the same time, reflected light with a wavelength λ1 begins to be emitted. As the irradiation continues, as time passes, the material to be cut 1
is heated, and a through hole is formed (region A in FIG. 2). In this region, there is little change in the reflected light, but the intensity of the melting radiation at wavelength λ2 gradually increases. but,
The material to be cut at the irradiation point is completely cut and the material to be cut at the irradiation point 1
When the wavelength λ1 disappears, the intensity of both the reflected light with the wavelength λ1 and the melting radiation light with the wavelength λ2 decreases (region B in Fig. 2).
. Therefore, cutting can be achieved by shifting the irradiation point while maintaining this state. If the workpiece 1 is cut during this cutting process,
If it is completely cut and there is a part that is not separated,
The intensity of both the reflected light with the wavelength λ1 and the melted radiation light with the wavelength λ2 increases again (region C in FIG. 2), so in this case, the output light 9 is irradiated again and the reflected light with the wavelength λ1 and the wavelength It is necessary to create a state in which the melting radiation of λ2 decreases (region D in FIG. 2).
【0011】このように波長λ1 の反射光と波長λ2
の溶融放射光とを並行してモニタリングすることによ
り、レーザ切断において被切断材1が完全に切断され、
分離されているかどうかを判断することができる。In this way, the reflected light of wavelength λ1 and the reflected light of wavelength λ2
By monitoring the melting radiation light in parallel, the material to be cut 1 is completely cut during laser cutting,
It is possible to determine whether they are separated.
【0012】被切断材1をN1 −Cr−Fe合金で板
厚が1.3mm,外径22mmの管とし、出射光9とし
て波長1.06μm,出力約250WのYAGレーザを
用いて、切断速度約0.7m/min でレーザ切断を
実施した。このとき、波長λ1 =1.06μmの反射
光と波長λ2 =0.94μmの溶融放射光をモニタリ
ングしたところ、図2の領域Aの状況が維持でき、結果
として被切断材1は完全に切断,分離された。The material to be cut 1 is a tube made of N1-Cr-Fe alloy with a plate thickness of 1.3 mm and an outer diameter of 22 mm, and a YAG laser with a wavelength of 1.06 μm and an output of about 250 W is used as the emitted light 9, and the cutting speed is adjusted. Laser cutting was performed at approximately 0.7 m/min. At this time, when the reflected light with a wavelength λ1 = 1.06 μm and the melting radiation light with a wavelength λ2 = 0.94 μm were monitored, the situation in area A in FIG. 2 could be maintained, and as a result, the workpiece 1 was completely cut. Separated.
【0013】[0013]
【発明の効果】以上説明したように、本発明方法による
と、被切断材からの2波長の放射光をモニタリングする
ので、切断状況を直接目視で観察できない遠隔操作のレ
ーザ切断においても、切断過程で被切断材が完全に切断
,分離されているかどうかを判断することができるとい
う効果を奏する。As explained above, according to the method of the present invention, since the emitted light of two wavelengths from the material to be cut is monitored, the cutting process can be easily monitored even in remote-controlled laser cutting where the cutting situation cannot be directly observed visually. This has the effect that it can be determined whether the material to be cut has been completely cut and separated.
【図1】実施例に用いたレーザ切断先端工具を示す説明
図である。FIG. 1 is an explanatory diagram showing a laser cutting tip tool used in an example.
【図2】本発明によるモニタリング状況を示す説明図で
ある。FIG. 2 is an explanatory diagram showing a monitoring situation according to the present invention.
1 被切断材 2 レーザ切断先端工具 3 光ファイバ 4 モニタリング用光ファイバ 5 工具本体 6 集光光学系 7 反射ミラー 8 出射孔 9 出射光 1 Material to be cut 2 Laser cutting tip tool 3 Optical fiber 4 Optical fiber for monitoring 5 Tool body 6 Condensing optical system 7 Reflection mirror 8 Output hole 9 Emitted light
Claims (1)
リングする方法において、レーザ光と同一波長の切断部
からの放射光と、これとは別の波長の切断部からの放射
光とを並行して観察し、両放射光の光強度が同時に低下
したことを検知して切断が完了していると判断すること
を特徴とするレーザ切断のモニタリング方法。[Claim 1] A method for monitoring laser cutting using a laser beam, in which light emitted from a cutting section having the same wavelength as the laser beam and emitted light from a cutting section having a different wavelength are emitted in parallel. A monitoring method for laser cutting, characterized in that the laser cutting is determined to have been completed by observing and detecting a simultaneous decrease in the light intensity of both synchrotron radiation beams.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3095357A JP2766742B2 (en) | 1991-04-25 | 1991-04-25 | How to monitor laser cutting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3095357A JP2766742B2 (en) | 1991-04-25 | 1991-04-25 | How to monitor laser cutting |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04327392A true JPH04327392A (en) | 1992-11-16 |
JP2766742B2 JP2766742B2 (en) | 1998-06-18 |
Family
ID=14135398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3095357A Expired - Lifetime JP2766742B2 (en) | 1991-04-25 | 1991-04-25 | How to monitor laser cutting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2766742B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484981A (en) * | 1994-08-24 | 1996-01-16 | Honda Giken Kogyo Kabushiki Kaisha | Method of cutting a hollow metallic material |
JP2016155140A (en) * | 2015-02-24 | 2016-09-01 | 株式会社アマダホールディングス | Laser processing discrimination method and apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56119689A (en) * | 1980-02-28 | 1981-09-19 | Toshiba Corp | Method for ovservation of laser working |
-
1991
- 1991-04-25 JP JP3095357A patent/JP2766742B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56119689A (en) * | 1980-02-28 | 1981-09-19 | Toshiba Corp | Method for ovservation of laser working |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484981A (en) * | 1994-08-24 | 1996-01-16 | Honda Giken Kogyo Kabushiki Kaisha | Method of cutting a hollow metallic material |
JP2016155140A (en) * | 2015-02-24 | 2016-09-01 | 株式会社アマダホールディングス | Laser processing discrimination method and apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2766742B2 (en) | 1998-06-18 |
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