JPH0432536U - - Google Patents
Info
- Publication number
- JPH0432536U JPH0432536U JP7408290U JP7408290U JPH0432536U JP H0432536 U JPH0432536 U JP H0432536U JP 7408290 U JP7408290 U JP 7408290U JP 7408290 U JP7408290 U JP 7408290U JP H0432536 U JPH0432536 U JP H0432536U
- Authority
- JP
- Japan
- Prior art keywords
- mold resin
- integrated circuit
- grounded
- array
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7408290U JPH0432536U (sr) | 1990-07-10 | 1990-07-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7408290U JPH0432536U (sr) | 1990-07-10 | 1990-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0432536U true JPH0432536U (sr) | 1992-03-17 |
Family
ID=31613466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7408290U Pending JPH0432536U (sr) | 1990-07-10 | 1990-07-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0432536U (sr) |
-
1990
- 1990-07-10 JP JP7408290U patent/JPH0432536U/ja active Pending