JPH04322489A - Laminated board for electric use - Google Patents

Abstract

PURPOSE:To make the high-frequency characteristic, the heat-resistant property and the drill working property of the title board good and to manufacture the board at low costs by a method wherein a metal foil, a thermoset resin layer and/or a glass-based material for a surface layer coming into contact with the foil and for an inner layer are arranged and installed, a thermoplastic resin is arranged and installed for an intermediate layer other than them and they are laminated, united and molded. CONSTITUTION:A metal-clad laminated board 1 is constituted of the following: an internal layer 2; surface layers 3; intermediate layers 4; and metal foils 5 which are arranged and installed at the outside of the surface layers 3. The inner layer 2 and the surface layers 3 are formed of a thermoset resin and/or a glassbased material. For example, a polyphenylene oxide-based resin can be used as a thermoplastic resin for the intermediate layers 4. For example, an epoxy resin, a phenol resin and the like can be used as the thermoset resin which constitutes the inner layer 2 and the surface layers 3. Alternatively, a composite material formed of the resin and the glass-based material may be used after the glass-based material has been impregnated with the resin. The glass-based material may singly be used.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to electrical laminates. More specifically, the present invention relates to a new electrical laminate that has excellent high frequency properties, heat resistance, and drilling machinability.

0002

[Prior Art] Conventionally, electrical/electronic equipment, communication equipment,
Printed wiring boards of various configurations have been used in various fields such as computers. For these printed wiring boards, there is a growing tendency to use electrical laminates with excellent high frequency properties (permittivity, dielectric loss tangent) and processability as the base material. It has become an important issue to provide electrical laminates with excellent properties at low cost.

[0003] In response to this trend, a laminated board has been generally used that is made of a thermoplastic resin board with good high frequency characteristics and integrally molded with metal foil such as copper foil. It's coming. Furthermore, some thermosetting resins are known that have relatively good high frequency characteristics, and attempts have been made to put some of them into practical use.

0004

[Problems to be Solved by the Invention] However, despite various efforts and improvements, many of the conventional laminates using thermoplastic resins have good high-frequency characteristics; Since it uses a plastic resin, it inevitably has poor heat resistance, is easily deformed when soldered, and has the disadvantage of inevitably melting.

[0005] Furthermore, in the case of electrical laminates using this conventional thermoplastic resin, there is a problem in that cutting defects occur due to frictional heat during drilling. For this reason, there was a limit to the improvement in workability and processing accuracy. On the other hand, when using a thermosetting resin with good high frequency properties,
The drawback was that it was inevitably expensive.

[0006] Therefore, there has been a need for a new electrical laminate that has excellent high-frequency characteristics (permittivity, dielectric loss tangent), good drilling workability, is easy to manufacture, and is inexpensive. . This invention was made in view of the above circumstances, and aims to improve the drawbacks of conventional laminates,
The object of the present invention is to provide an inexpensive electrical laminate that has excellent high frequency properties, heat resistance, and drilling workability as described above.

[0007]

[Means for Solving the Problems] The present invention solves the above-mentioned problems by disposing a thermosetting resin layer and/or a glass substrate on a metal foil and a surface layer and an inner layer in contact with the metal foil. The present invention provides an electrical laminate characterized in that the intermediate layer other than this is formed by disposing a thermoplastic resin and integrally molding the lamination.

That is, the present invention is characterized in that a thermosetting resin and/or a glass substrate is used in combination for the surface layer and the inner layer, and a thermoplastic resin is used for the other intermediate layer. In a preferred embodiment, a polyphenyleoxide resin is used as the thermoplastic resin for the intermediate layer.

[0009]

[Operation] In the present invention, since the electrical laminate is constructed by the specific combination as described above, it has good high frequency characteristics, improved heat resistance, and good drilling workability. Moreover, its manufacturing cost is low.

0010

EXAMPLES The present invention will be explained in more detail by way of examples. FIG. 1 of the attached drawings illustrates the structure of the electrical laminate of the present invention. For example, as shown in FIG. 1, the metal-clad laminate (1) of the present invention has an inner layer (2), a surface layer (3), an intermediate layer (4), and an outer layer of the surface layer (3). The inner layer (2) and the surface layer (3) are made of a thermosetting resin and/or a glass base material.

As the thermoplastic resin for the intermediate layer (4), for example, a polyphenyleoxide resin can be used, and an aromatic polyether resin having ether bonds similar to polyacetal can be used as appropriate. ,
A modified resin sheet can also be used. This polyphenylene oxide resin (PPO) has the following formula, for example:

0012

[Chemical formula 1]

0013], and its properties as a sheet material are: Specific gravity (ASTM D-792)
1.00~1.20 ・Hardness (ASTM
D-785) R-109/R-121
・Tensile strength (ASTM D-638)
400-580kg/cm2 ・Bending strength (ASTM D-790)
600-1000kg/cm2 ・Heat distortion temperature (ASTM D-648)
100-120℃ ・Dielectric breakdown voltage (ASTM D-149)
15.5-19.0KV/mm ・Dielectric constant
60Hz 2.40-2.75
(ASTM D-150) 1K
Hz 2.40-2.75

It is characterized as having good heat resistance, high frequency characteristics, moldability, etc., such as 2 MHz 2.40 to 2.75.

[0014] These polyphenylene oxide resins can be provided by any means such as a resin sheet or resin coating when forming the intermediate layer (4). In particular, it is preferable to use a resin sheet. Its thickness can also generally range from about 0.5 to 10 mm. Therefore, when using resin sheets, it is possible to easily manufacture the laminate (1) from thin ones (about 0.5 mm) to thick ones (about 10 mm), so the manufacturing cost is also lower. becomes. Of course, the thermoplastic resin is not limited to this, and may be of various other types.

Furthermore, various conventionally known thermosetting resins can be used as the thermosetting resin constituting the inner layer (2) and the surface layer (3), such as epoxy resin, phenol resin, polyimide resin, etc. Illustrated. Alternatively, a glass substrate may be impregnated with these resins and used as a composite material of the resin and the substrate. A glass substrate alone may be used.

[0016]The thickness of these is generally 0.0
It can be about 3 to 1.0 mm, and the resin sheet,
It can be formed using various means such as prepreg or coating. These resin layers may be surface-treated before being molded. Various physical or chemical means can be employed, such as physical buffing and chemical etching. A more preferred embodiment is a method in which a thin resin-impregnated base metal-clad single-sided board is used as the surface layer, and the surface of the base material layer is subjected to buffing or scrubber polishing, or a single-sided board is used in which one side of the double-sided board is etched. etc.

It is also effective to treat the surface of the inner layer (2) in a similar manner. There is no particular limitation on the type of metal foil (5) as the outermost layer. copper, aluminum,
Any metal or alloy such as iron or stainless steel may be used. Among them, copper is preferred. The thickness of this metal foil (5) is preferably about 5 to 70 μm.

[0018] Note that these inner layers (2) and surface layers (3)
), the intermediate layer (4), and the metal foil (5) can be laminated and integrated by means such as normal heating and pressing.
2 conditions such as pressure can be adopted. Depending on the type of material used, the conditions may be no pressure or lower pressure and low temperature.

In this case, as described above, the surface layer and the metal foil may be laminated and surface-treated in advance. In this lamination molding, an epoxy adhesive, a rubber adhesive, or the like may be used to increase the adhesive force between layers. In fact, the above-mentioned polyphenylene oxide resin sheet (nonyl sheet PN7120) (thickness 2 mm) was used as the intermediate layer, and the glass base layer impregnated with epoxy resin (thickness 0.3 mm) was used as the intermediate layer.
mm) was used as the surface layer and inner layer, and the thickness was 10
A double-sided metal-clad laminate was manufactured by laminating and integrally molding with μm copper foil. As a result, the heat resistance is determined by the coefficient of linear expansion (ASTM D-6
90) 5.0 × 10-5/℃, heat distortion temperature (ASTM
D-648) It is good at about 110℃, and the high frequency characteristics are also good with dielectric constant of about 2.67 (60Hz) and 2.66 (1
An electrical laminate with a good frequency of 2.60 KHz) and 2.60 (1 MHz) was obtained. It was easy to manufacture and had very good drillability. The cost was also low.

[0020]

As described in detail above, the present invention provides an electrical metal-clad laminate with good heat resistance and drillability, and excellent high frequency characteristics, at low manufacturing cost and simple manufacturing.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view illustrating an electrical metal-clad laminate of the present invention.

[Explanation of symbols]

1 Metal-clad laminate 2 Inner layer 3 Surface layer 4 Middle class 5 Metal foil

Claims (2)

[Claims] Claim 1: A laminated metal foil, a thermosetting resin layer and/or a glass substrate provided on the surface layer and inner layer in contact with the metal foil, and a thermoplastic resin provided on the other intermediate layer. An electrical laminate characterized by being integrally molded. 2. The electrical laminate according to claim 1, wherein the thermoplastic resin of the intermediate layer is a polyphenyleoxide resin.