JPH04309585A - Surface-protecting film - Google Patents
Surface-protecting filmInfo
- Publication number
- JPH04309585A JPH04309585A JP7307391A JP7307391A JPH04309585A JP H04309585 A JPH04309585 A JP H04309585A JP 7307391 A JP7307391 A JP 7307391A JP 7307391 A JP7307391 A JP 7307391A JP H04309585 A JPH04309585 A JP H04309585A
- Authority
- JP
- Japan
- Prior art keywords
- width
- adhesive strength
- heat treatment
- film
- antistatic agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002216 antistatic agent Substances 0.000 claims abstract description 22
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 5
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 abstract description 20
- 239000000057 synthetic resin Substances 0.000 abstract description 20
- 239000010410 layer Substances 0.000 abstract description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 53
- 230000001070 adhesive effect Effects 0.000 description 53
- 238000010438 heat treatment Methods 0.000 description 28
- 239000002736 nonionic surfactant Substances 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- KHYNLKWLPONHOE-UHFFFAOYSA-N 2-[2-hydroxyethyl(octadecyl)amino]ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCN(CCO)CCOC(=O)CCCCCCCCCCCCCCCCC KHYNLKWLPONHOE-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002280 amphoteric surfactant Substances 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、表面保護フィルムに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface protection film.
【0002】0002
【従来の技術】従来、合成樹脂板、化粧板、金属板等の
加工時、輸送時の損傷、汚染防止に熱可塑性樹脂フィル
ムの片面に粘着剤層を形成した表面保護フィルムが使用
されている。[Prior Art] Conventionally, a surface protection film with an adhesive layer formed on one side of a thermoplastic resin film has been used to prevent damage and contamination during processing and transportation of synthetic resin boards, decorative boards, metal boards, etc. .
【0003】0003
【発明が解決しようとする課題】しかしながら、このよ
うな表面保護フィルムを合成樹脂板等に貼着後剥離する
場合、表面保護フィルムと合成樹脂板の何れもが高い絶
縁性を有している為、特に冬季等の乾燥雰囲気下に於い
ては、静電気を帯び易い。合成樹脂板が帯電すると、電
撃や塵埃の吸着が発生するのみならず、合成樹脂板同士
の吸引や反発により作業性が低下するという問題があっ
た。[Problem to be Solved by the Invention] However, when such a surface protection film is peeled off after being attached to a synthetic resin board, etc., since both the surface protection film and the synthetic resin board have high insulation properties, , especially in a dry atmosphere such as winter, it is easy to be charged with static electricity. When synthetic resin plates are charged, there is a problem in that not only electric shock and dust adsorption occur, but also workability is reduced due to mutual attraction and repulsion between the synthetic resin plates.
【0004】帯電を防止する方法としては、一般に帯電
防止剤をフィルムの表面に塗布する方法が知られている
が、この方法では、表面保護フィルムを合成樹脂板に貼
着した状態では有効でも、表面保護フィルムを合成樹脂
板から剥離する際及びその後すぐに、合成樹脂板に静電
気が帯電するのは防止出来ない。又、帯電防止剤をフィ
ルムに練込む方法では、帯電防止効果が不十分である。[0004] As a method for preventing static electricity, it is generally known to apply an antistatic agent to the surface of the film, but although this method is effective when the surface protection film is attached to the synthetic resin plate, It is impossible to prevent the synthetic resin board from being charged with static electricity when the surface protection film is peeled off from the synthetic resin board and immediately thereafter. Furthermore, the method of kneading an antistatic agent into a film does not provide sufficient antistatic effect.
【0005】本発明は、上記従来の問題点を解消し、効
果的に合成樹脂板の帯電を防止出来る表面保護フィルム
を提供することを目的とする。An object of the present invention is to solve the above-mentioned conventional problems and to provide a surface protection film that can effectively prevent static electricity on a synthetic resin plate.
【0006】[0006]
【課題を解決するための手段】本発明は、第1には、熱
可塑性樹脂フィルムの一面に粘着層が形成されてなる表
面保護フィルムに於いて、粘着層に帯電防止剤が添加さ
れていること、第2には、前記帯電防止剤が常温で液状
であることをその要旨とするものである。[Means for Solving the Problems] The present invention provides, firstly, a surface protection film comprising an adhesive layer formed on one surface of a thermoplastic resin film, in which an antistatic agent is added to the adhesive layer. Secondly, the antistatic agent is liquid at room temperature.
【0007】本発明に於いて基材となるフィルムに使用
される熱可塑性樹脂としては、特に限定されないが、ポ
リエチレン、ポリプロピレン等のオレフィン系樹脂が好
適に使用される。[0007] The thermoplastic resin used for the base film in the present invention is not particularly limited, but olefin resins such as polyethylene and polypropylene are preferably used.
【0008】本発明に於いて粘着層を構成する樹脂とし
ては、特に限定されないが、エチレン−酢酸ビニル共重
合体、低密度ポリエチレン、直鎖状低密度ポリエチレン
、エチレン−エチルアクリレート共重合体、エチレン−
メチルメタクリレート共重合体、エチレン−αオレフィ
ン共重合体等及びこれらの混合物が挙げられる。In the present invention, the resin constituting the adhesive layer is not particularly limited, but includes ethylene-vinyl acetate copolymer, low-density polyethylene, linear low-density polyethylene, ethylene-ethyl acrylate copolymer, and ethylene. −
Examples include methyl methacrylate copolymers, ethylene-α olefin copolymers, and mixtures thereof.
【0009】本発明に於いて使用される帯電防止剤とし
ては、特に限定されないが、その添加量は、粘着剤 1
00重量部に対して0.05〜 6.0重量部とするの
が好ましく、更に好ましくは、0.1 〜 4.0重量
部である。0.05重量部未満であると帯電防止効果が
不十分であり、 6.0重量部を超えると粘着剤層表面
にブリードした帯電防止剤が剥離後も合成樹脂板の表面
に残留し、印刷不良等の原因となる。[0009] The antistatic agent used in the present invention is not particularly limited, but the amount added is as low as 1 for the adhesive.
It is preferably 0.05 to 6.0 parts by weight, more preferably 0.1 to 4.0 parts by weight. If it is less than 0.05 parts by weight, the antistatic effect will be insufficient, and if it exceeds 6.0 parts by weight, the antistatic agent that has bled onto the surface of the adhesive layer will remain on the surface of the synthetic resin plate even after peeling off, causing printing problems. This may cause defects, etc.
【0010】又、第2の発明に於いて使用される常温で
液状の帯電防止剤としては、特に限定されず、カチオン
系界面活性剤、アニオン系界面活性剤、両性系界面活性
剤、非イオン系界面活性剤の何れでもよい。そして、そ
の添加量は、粘着剤 100重量部に対して 0.1〜
6.0重量部とするのが好ましく、更に好ましくは、
0.2 〜 4.0重量部である。 0.1重量部未満
であると加熱による接着力昂進防止効果が不十分であり
、加熱処理後の剥離が困難となる。又、 6.0重量部
を超えると常温に於いて、合成樹脂板への接着が困難と
なる。[0010] Furthermore, the antistatic agent that is liquid at room temperature and is used in the second invention is not particularly limited, and may include cationic surfactants, anionic surfactants, amphoteric surfactants, and nonionic surfactants. Any surfactant may be used. The amount added is 0.1 to 100 parts by weight of the adhesive.
Preferably, the amount is 6.0 parts by weight, and more preferably,
It is 0.2 to 4.0 parts by weight. If the amount is less than 0.1 part by weight, the effect of preventing increase in adhesive strength due to heating will be insufficient, and peeling after heat treatment will become difficult. Moreover, if it exceeds 6.0 parts by weight, it becomes difficult to adhere to a synthetic resin board at room temperature.
【0011】[0011]
【作用】本発明表面保護フィルムは、粘着剤層に帯電防
止剤が添加されているので、貼付時は完全に電気的に中
和し、貼付される板との界面に帯電防止剤が適度に存在
しているから、表面保護フィルムと合成樹脂板との接着
界面に於ける分極が起らず、剥離に際して合成樹脂板の
表面に静電気が帯電し難い。[Function] The surface protection film of the present invention has an antistatic agent added to the adhesive layer, so it is completely electrically neutralized when applied, and the antistatic agent is appropriately applied to the interface with the board to which it is applied. Because of its presence, polarization does not occur at the adhesive interface between the surface protection film and the synthetic resin plate, and static electricity is less likely to be charged on the surface of the synthetic resin plate when peeled off.
【0012】又、粘着剤層に常温で液状の帯電防止剤が
添加されているときには、印刷加工や真空成形加工のよ
うな加熱処理の際、液状帯電防止剤が粘着剤層と非接着
物の合成樹脂板との接着界面に移行して表面保護フィル
ムと合成樹脂板との物理化学的親和力を適度に抑える。
その為、加熱処理に伴う粘着剤層の接着力昂進を防止す
る。[0012] Furthermore, when an antistatic agent that is liquid at room temperature is added to the adhesive layer, during heat treatment such as printing or vacuum forming, the liquid antistatic agent may be mixed with the adhesive layer and the non-adhesive material. It migrates to the adhesive interface with the synthetic resin board and moderately suppresses the physicochemical affinity between the surface protection film and the synthetic resin board. Therefore, the adhesive strength of the adhesive layer is prevented from increasing due to heat treatment.
【0013】[0013]
【実施例】以下本発明の実施例を具体的に説明するが、
本発明は実施例に限定されるものではない。[Examples] Examples of the present invention will be specifically explained below.
The invention is not limited to the examples.
【0014】実施例1
基材層を形成する低密度ポリエチレン(三井石油化学工
業社製「ミラソン12」)と、粘着層を形成するエチレ
ン−酢酸ビニル共重合体(三菱油化社製「EVA25K
」酢酸ビニル含有量11重量%) 100重量部と粉状
の非イオン系界面活性剤(花王社製「エレクトロストリ
ッパーTS−3」) 0.1重量部との混合物を、前
者が厚み40μm、後者が厚み20μmとなるように、
2層共押出法により押出成形して、表面保護フィルムを
得た。Example 1 Low-density polyethylene ("Mirason 12" manufactured by Mitsui Petrochemical Industries, Ltd.) forming the base material layer and ethylene-vinyl acetate copolymer ("EVA25K" manufactured by Mitsubishi Yuka Co., Ltd.) forming the adhesive layer.
A mixture of 100 parts by weight of ``vinyl acetate content 11% by weight'' and 0.1 parts by weight of a powdered nonionic surfactant (``Electro Stripper TS-3'' manufactured by Kao Corporation) was prepared, with the former having a thickness of 40 μm and the latter having a thickness of 40 μm. so that the thickness is 20 μm,
A surface protection film was obtained by extrusion molding using a two-layer coextrusion method.
【0015】得られた表面保護フィルムを厚み2mmの
ポリカーボネート板(以下PC板と略記する)にラミネ
ーターを用いて貼着し、23℃で30分放置後、剥離幅
25mmで引剥して初期粘着力を測定した。[0015] The obtained surface protection film was attached to a 2 mm thick polycarbonate plate (hereinafter abbreviated as PC board) using a laminator, left at 23°C for 30 minutes, and then peeled off with a peel width of 25 mm to determine the initial adhesive strength. was measured.
【0016】同様に、PC板に貼着した後、90℃及び
160℃に予熱しておいた熱風循環式オーブン中に3
0分放置後、取出して常温に冷却して剥離幅25mmで
引剥して加熱処理後粘着力1及び2を測定した。Similarly, after pasting on a PC board, it was placed in a hot air circulation oven preheated to 90°C and 160°C.
After being left for 0 minutes, it was taken out, cooled to room temperature, and peeled off with a peeling width of 25 mm to measure adhesive strength 1 and 2 after heat treatment.
【0017】同様に、PC板に貼着した後、室温23℃
、湿度30%RHの雰囲気下に於いて60分放置後、手
で剥離し(剥離速度約20m/分) 、PC板から10
cm離れた地点に於ける剥離5秒後の帯電圧を測定した
。Similarly, after pasting it on a PC board, the room temperature was 23°C.
After leaving it for 60 minutes in an atmosphere with a humidity of 30% RH, it was peeled off by hand (peeling speed of about 20 m/min) and 10 minutes from the PC board.
The electrostatic voltage was measured 5 seconds after peeling off at a point separated by cm.
【0018】初期粘着力は 5.0g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+ 500Vであった。
実施例2
粘着層に添加する帯電防止剤を粉状の非イオン系界面活
性剤(丸菱油化工業社製「デノン 331P」)に代え
たこと以外は実施例1の通りにして、表面保護フィルム
を得、粘着力及び帯電圧を測定した。[0018] Initial adhesive strength is 5.0 g/25 mm width, adhesive strength 1 after heat treatment is 300.0 g/25 mm width, adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and electrostatic voltage after peeling is +500 V. Met. Example 2 Surface protection was carried out as in Example 1 except that the antistatic agent added to the adhesive layer was replaced with a powdered nonionic surfactant (“Denon 331P” manufactured by Marubishi Yuka Kogyo Co., Ltd.). A film was obtained, and its adhesive strength and charging voltage were measured.
【0019】初期粘着力は 4.5g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+ 950Vであった。
実施例3
粘着層に添加する帯電防止剤を粉状の非イオン系界面活
性剤(丸菱油化工業社製「デノン 331P」) 6.
0重量部に代えたこと以外は実施例1の通りにして、表
面保護フィルムを得、粘着力及び帯電圧を測定した。[0019] Initial adhesive strength is 4.5 g/25 mm width, adhesive strength 1 after heat treatment is 300.0 g/25 mm width, adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and electrostatic voltage after peeling is +950 V. Met. Example 3 The antistatic agent added to the adhesive layer was a powdered nonionic surfactant (“Denon 331P” manufactured by Marubishi Yuka Kogyo Co., Ltd.) 6.
A surface protective film was obtained in the same manner as in Example 1 except that the amount was changed to 0 parts by weight, and the adhesive force and charging voltage were measured.
【0020】初期粘着力は 4.0g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+ 800Vであった。
実施例4
粘着層に添加する帯電防止剤を常温で液状の非イオン系
界面活性剤(丸菱油化工業社製「デノン 331L」)
に代えたこと以外は実施例1の通りにして、表面保護フ
ィルムを得、粘着力及び帯電圧を測定した。[0020] Initial adhesive strength is 4.0 g/25 mm width, adhesive strength 1 after heat treatment is 300.0 g/25 mm width, adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and electrostatic voltage after peeling is +800 V. Met. Example 4 The antistatic agent added to the adhesive layer was a nonionic surfactant that is liquid at room temperature (“Denon 331L” manufactured by Marubishi Yuka Kogyo Co., Ltd.)
A surface protection film was obtained in the same manner as in Example 1 except that the adhesive force and charging voltage were measured.
【0021】初期粘着力は 3.0g/25mm幅、加
熱処理後粘着力1は12.5g/25mm幅、加熱処理
後粘着力2は35.0g/25mm幅、剥離後帯電圧は
+ 250Vであった。
実施例5
実施例4の非イオン系界面活性剤(「デノン 331L
」)の添加量を 6.0重量部としたこと以外は実施例
4の通りにして、表面保護フィルムを得、粘着力及び帯
電圧を測定した。[0021] The initial adhesive strength is 3.0 g/25 mm width, the adhesive strength 1 after heat treatment is 12.5 g/25 mm width, the adhesive strength 2 after heat treatment is 35.0 g/25 mm width, and the electrostatic voltage after peeling is +250 V. there were. Example 5 Nonionic surfactant of Example 4 (“Denon 331L”)
A surface protective film was obtained in the same manner as in Example 4, except that the amount of 6.0 parts by weight was added, and the adhesive strength and charging voltage were measured.
【0022】初期粘着力は 1.0g/25mm幅、加
熱処理後粘着力1は 6.5g/25mm幅、加熱処理
後粘着力2は14.0g/25mm幅、剥離後帯電圧は
+ 100Vであった。
実施例6
粘着層を形成するエチレン−酢酸ビニル共重合体を直鎖
状低密度ポリエチレン(三井石油化学工業社製「ウルト
ゼックス2080C」)に代えたこと以外は実施例4の
通りにして、表面保護フィルムを得、粘着力及び帯電圧
を測定した。[0022] The initial adhesive strength is 1.0 g/25 mm width, the adhesive strength 1 after heat treatment is 6.5 g/25 mm width, the adhesive strength 2 after heat treatment is 14.0 g/25 mm width, and the electrostatic voltage after peeling is + 100 V. there were. Example 6 The same procedure as Example 4 was carried out, except that the ethylene-vinyl acetate copolymer forming the adhesive layer was replaced with linear low-density polyethylene ("Urtzex 2080C" manufactured by Mitsui Petrochemical Industries, Ltd.), and the surface was A protective film was obtained, and its adhesive strength and charging voltage were measured.
【0023】初期粘着力は 1.0g/25mm幅、加
熱処理後粘着力1は 4.0g/25mm幅、加熱処理
後粘着力2は 9.0g/25mm幅、剥離後帯電圧は
+ 250Vであった。
実施例7
粘着層を形成するエチレン−酢酸ビニル共重合体をエチ
レン−エチルアクリレート共重合体(三井デュポンポリ
ケミカル社製「EVAFLEX−FEAA−703 」
エチルアクリレート含有量25重量%) に代えたこと
以外は実施例4の通りにして、表面保護フィルムを得、
粘着力及び帯電圧を測定した。[0023] The initial adhesive strength is 1.0 g/25 mm width, the adhesive strength 1 after heat treatment is 4.0 g/25 mm width, the adhesive strength 2 after heat treatment is 9.0 g/25 mm width, and the electrostatic voltage after peeling is +250 V. there were. Example 7 The ethylene-vinyl acetate copolymer forming the adhesive layer was replaced with an ethylene-ethyl acrylate copolymer (“EVAFLEX-FEAA-703” manufactured by DuPont Mitsui Polychemicals Co., Ltd.)
A surface protection film was obtained in the same manner as in Example 4 except that the content of ethyl acrylate was 25% by weight).
Adhesive force and charging voltage were measured.
【0024】初期粘着力は 4.0g/25mm幅、加
熱処理後粘着力1は11.0g/25mm幅、加熱処理
後粘着力2は22.0g/25mm幅、剥離後帯電圧は
+ 200Vであった。
実施例8
粘着層を形成するエチレン−酢酸ビニル共重合体をエチ
レン−メチルメタクリレート共重合体(住友化学工業社
製「アクリフトWH303 」メチルメタクリレート含
有量18重量%) に代えたこと以外は実施例4の通り
にして、表面保護フィルムを得、粘着力及び帯電圧を測
定した。[0024] The initial adhesive force is 4.0 g/25 mm width, the adhesive force 1 after heat treatment is 11.0 g/25 mm width, the adhesive force 2 after heat treatment is 22.0 g/25 mm width, and the electrostatic voltage after peeling is +200 V. there were. Example 8 Example 4 except that the ethylene-vinyl acetate copolymer forming the adhesive layer was replaced with an ethylene-methyl methacrylate copolymer ("Acrift WH303" manufactured by Sumitomo Chemical Co., Ltd. Methyl methacrylate content: 18% by weight) A surface protective film was obtained as described above, and its adhesive strength and charging voltage were measured.
【0025】初期粘着力は 3.5g/25mm幅、加
熱処理後粘着力1は10.5g/25mm幅、加熱処理
後粘着力2は19.0g/25mm幅、剥離後帯電圧は
+ 300Vであった。
比較例1
粘着層に帯電防止剤を添加しなかったこと以外は実施例
1の通りにして、表面保護フィルムを得、粘着力及び帯
電圧を測定した。[0025] The initial adhesive strength is 3.5 g/25 mm width, the adhesive strength 1 after heat treatment is 10.5 g/25 mm width, the adhesive strength 2 after heat treatment is 19.0 g/25 mm width, and the charged voltage after peeling is +300 V. there were. Comparative Example 1 A surface protective film was obtained in the same manner as in Example 1, except that no antistatic agent was added to the adhesive layer, and the adhesive strength and charging voltage were measured.
【0026】初期粘着力は 5.0g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+ 10000Vであった。
比較例2
粘着層に帯電防止剤を添加せず、基材層を形成する低密
度ポリエチレン 100重量部に、常温で液状の非イオ
ン系界面活性剤(丸菱油化工業社製「デノン 331L
」) 0.1重量部を添加したこと以外は実施例1の通
りにして、表面保護フィルムを得、粘着力及び帯電圧を
測定した。[0026] Initial adhesive strength is 5.0 g/25 mm width, adhesive strength 1 after heat treatment is 300.0 g/25 mm width, adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and electrostatic voltage after peeling is +10000 V. Met. Comparative Example 2 No antistatic agent was added to the adhesive layer, and 100 parts by weight of low-density polyethylene to form the base layer was added with a nonionic surfactant (“Denon 331L” manufactured by Marubishi Yuka Kogyo Co., Ltd.) that is liquid at room temperature.
'') A surface protective film was obtained in the same manner as in Example 1 except that 0.1 part by weight was added, and the adhesive force and charging voltage were measured.
【0027】初期粘着力は 4.5g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+7000Vであった。
比較例3
粘着層に帯電防止剤を添加せず、基材層を形成する低密
度ポリエチレン 100重量部に、常温で液状の非イオ
ン系界面活性剤(丸菱油化工業社製「デノン 331L
」) 6.0重量部を添加したこと以外は実施例1の通
りにして、表面保護フィルムを得、粘着力及び帯電圧を
測定した。[0027] The initial adhesive strength is 4.5 g/25 mm width, the adhesive strength 1 after heat treatment is 300.0 g/25 mm width, the adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and the charged voltage after peeling is +7000 V. there were. Comparative Example 3 No antistatic agent was added to the adhesive layer, and 100 parts by weight of low-density polyethylene to form the base layer was added with a nonionic surfactant (“Denon 331L” manufactured by Marubishi Yuka Kogyo Co., Ltd.) that is liquid at room temperature.
A surface protective film was obtained in the same manner as in Example 1, except that 6.0 parts by weight was added, and the adhesive force and charging voltage were measured.
【0028】初期粘着力は 4.0g/25mm幅、加
熱処理後粘着力1は 300.0g/25mm幅、加熱
処理後粘着力2は1000.0g/25mm幅以上、剥
離後帯電圧は+5000Vであった。上記実施例及び比
較例の配合及び物性を表1に纏めて記載する。[0028] Initial adhesive strength is 4.0 g/25 mm width, adhesive strength 1 after heat treatment is 300.0 g/25 mm width, adhesive strength 2 after heat treatment is 1000.0 g/25 mm width or more, and electrostatic voltage after peeling is +5000 V. there were. The formulations and physical properties of the above Examples and Comparative Examples are summarized in Table 1.
【0029】[0029]
【表1】[Table 1]
【0030】上記の通り、実施例1乃至8は、夫々比較
例1乃至3に比較して静電気の発生が小さく、特に常温
で液状の帯電防止剤を添加した実施例1乃至5に於いて
は、合成樹脂板に貼着後加熱処理を施しても、粘着力が
大きく上昇することがなかった。As mentioned above, in Examples 1 to 8, the generation of static electricity was smaller than in Comparative Examples 1 to 3, respectively, especially in Examples 1 to 5 in which an antistatic agent that was liquid at room temperature was added. Even when heat treatment was applied to the synthetic resin plate after adhesion, the adhesive strength did not increase significantly.
【0031】[0031]
【発明の効果】本発明の表面保護フィルムは、叙上の通
り構成されているので、絶縁性の高い合成樹脂板に貼着
後剥離する際にも、帯電圧を低く抑えることが出来るの
で、合成樹脂板の表面保護用に好適である。[Effects of the Invention] Since the surface protection film of the present invention is constructed as described above, even when it is peeled off after being attached to a highly insulating synthetic resin board, the electrostatic voltage can be kept low. Suitable for surface protection of synthetic resin plates.
【0032】特に常温で液状の帯電防止剤を添加した場
合には、合成樹脂板に高温で真空成形等の二次加工を施
しても、接着昴進の傾向が小さく容易に剥離することが
出来る。[0032] Especially when an antistatic agent that is liquid at room temperature is added, even if the synthetic resin plate is subjected to secondary processing such as vacuum forming at high temperatures, the tendency of adhesion is small and it can be easily peeled off. .
Claims (2)
が形成されてなる表面保護フィルムに於いて、粘着層に
帯電防止剤が添加されていることを特徴とする表面保護
フィルム。1. A surface protection film comprising an adhesive layer formed on one side of a thermoplastic resin film, characterized in that an antistatic agent is added to the adhesive layer.
特徴とする請求項1に記載の表面保護フィルム。2. The surface protection film according to claim 1, wherein the antistatic agent is liquid at room temperature.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7307391A JPH04309585A (en) | 1991-04-05 | 1991-04-05 | Surface-protecting film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7307391A JPH04309585A (en) | 1991-04-05 | 1991-04-05 | Surface-protecting film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04309585A true JPH04309585A (en) | 1992-11-02 |
Family
ID=13507790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7307391A Pending JPH04309585A (en) | 1991-04-05 | 1991-04-05 | Surface-protecting film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04309585A (en) |
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US7691925B2 (en) | 2004-03-08 | 2010-04-06 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film |
US7799853B2 (en) | 2005-09-05 | 2010-09-21 | Nitto Denko Corporation | Adhesive composition, adhesive sheet, and surface protective film |
US7842742B2 (en) | 2004-07-26 | 2010-11-30 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets, and surface protecting film |
JP2011191768A (en) * | 2011-04-05 | 2011-09-29 | Nitto Denko Corp | Surface protective film for optical film |
JP5061898B2 (en) * | 2005-06-24 | 2012-10-31 | 東洋インキScホールディングス株式会社 | Antistatic acrylic adhesive |
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-
1991
- 1991-04-05 JP JP7307391A patent/JPH04309585A/en active Pending
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JP2010001497A (en) * | 2004-03-08 | 2010-01-07 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protective film |
US7691925B2 (en) | 2004-03-08 | 2010-04-06 | Nitto Denko Corporation | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film |
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JP2006282738A (en) * | 2005-03-31 | 2006-10-19 | Sumitomo Chemical Co Ltd | Adhesive film or adhesive sheet, method for producing the same and adhesive product comprising the same |
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JP2009208320A (en) * | 2008-03-04 | 2009-09-17 | Ekushiiru Corporation:Kk | Sheet for footprint identification |
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