JPH0430732U - - Google Patents
Info
- Publication number
- JPH0430732U JPH0430732U JP1990069905U JP6990590U JPH0430732U JP H0430732 U JPH0430732 U JP H0430732U JP 1990069905 U JP1990069905 U JP 1990069905U JP 6990590 U JP6990590 U JP 6990590U JP H0430732 U JPH0430732 U JP H0430732U
- Authority
- JP
- Japan
- Prior art keywords
- heat block
- atmospheric gas
- supply section
- sectional area
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000013021 overheating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069905U JPH0810189Y2 (ja) | 1990-06-30 | 1990-06-30 | ワイヤボンディング装置のヒートブロック構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069905U JPH0810189Y2 (ja) | 1990-06-30 | 1990-06-30 | ワイヤボンディング装置のヒートブロック構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0430732U true JPH0430732U (th) | 1992-03-12 |
| JPH0810189Y2 JPH0810189Y2 (ja) | 1996-03-27 |
Family
ID=31605614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069905U Expired - Fee Related JPH0810189Y2 (ja) | 1990-06-30 | 1990-06-30 | ワイヤボンディング装置のヒートブロック構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810189Y2 (th) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546032U (ja) * | 1991-11-21 | 1993-06-18 | ソニー株式会社 | ワイヤボンデイング装置 |
-
1990
- 1990-06-30 JP JP1990069905U patent/JPH0810189Y2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546032U (ja) * | 1991-11-21 | 1993-06-18 | ソニー株式会社 | ワイヤボンデイング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0810189Y2 (ja) | 1996-03-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |