JPH04300257A - Method of joining ceramics - Google Patents
Method of joining ceramicsInfo
- Publication number
- JPH04300257A JPH04300257A JP8985191A JP8985191A JPH04300257A JP H04300257 A JPH04300257 A JP H04300257A JP 8985191 A JP8985191 A JP 8985191A JP 8985191 A JP8985191 A JP 8985191A JP H04300257 A JPH04300257 A JP H04300257A
- Authority
- JP
- Japan
- Prior art keywords
- joined
- members
- joining
- ceramic
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052681 coesite Inorganic materials 0.000 abstract description 6
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 6
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 6
- 229910052682 stishovite Inorganic materials 0.000 abstract description 6
- 229910052905 tridymite Inorganic materials 0.000 abstract description 6
- 239000011148 porous material Substances 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract description 2
- 239000007789 gas Substances 0.000 abstract description 2
- 239000001301 oxygen Substances 0.000 abstract description 2
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 abstract 1
- 229910001882 dioxygen Inorganic materials 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 10
- 239000005388 borosilicate glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910007277 Si3 N4 Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910005091 Si3N Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052575 non-oxide ceramic Inorganic materials 0.000 description 1
- 239000011225 non-oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明はセラミックスにより構成
されるセラミック部材の接合方法に関する。更に詳しく
は、接合強度が強く、且つ接合部の気密性の高いセラミ
ック接合部を形成するセラミック接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining ceramic members made of ceramics. More specifically, the present invention relates to a ceramic bonding method for forming a ceramic bonded portion with strong bonding strength and high airtightness at the bonded portion.
【0002】0002
【従来の技術】セラミックスは、その成分組成が酸化物
、非酸化物に拘らず、高度の耐熱・断熱性が有り、絶縁
性、導電性、磁気的・誘電的性質等の電気的・電子的機
能を有し、また耐摩耗性等の機械的性質も優れ、各種構
造物の材料として既に使用され、研究開発されている。
セラミックスを機械部品材料や構造物材料として使用す
る場合、種々の形状の機械部品や構造部材が要求され、
また各部品や部材の組み合わせも求められることになり
、一体成形により製造されるものは別として、セラミッ
クスを接合固定する必要が生じる。[Prior Art] Ceramics, regardless of whether they are oxides or non-oxides, have a high degree of heat resistance and heat insulation, and have electrical and electronic properties such as insulation, conductivity, and magnetic and dielectric properties. It has excellent mechanical properties such as wear resistance and is already used as a material for various structures and is being researched and developed. When ceramics are used as a material for mechanical parts or structures, mechanical parts and structural members of various shapes are required.
In addition, combinations of various parts and members are required, and apart from those manufactured by integral molding, it is necessary to bond and fix ceramics.
【0003】各種のセラミック部材を組み合わたセラミ
ック接合体は、機械部品や構造部材として多く使用され
、例えば、出願人が特開昭60−62592号公報に提
案した工業用炉のセラミック熱交換器には多数の管状体
を板状体に固定した部材が使用されている。この方法は
、圧縮スプリングを利用してセラミック部材を機械的に
球面で接合するものであり、図4は前記同公報で示され
るシェルアンドチューブ型の熱交換器の接合部断面説明
図であり、板状体A及びA’の通孔X及びX’のそれぞ
れ内端に設けられた球面部と管状体B球面部とが機械的
な押圧により球面接合部Yにより固定されている。しか
し、この場合、使用時の熱応力により管状体が破損する
おそれがあり、また膨張や収縮により球面接合部に間隙
が生じ、流通ガス中のダスト等が漏洩し、接合部に付着
して十分なシール性を得ることができなかった。[0003] Ceramic bonded bodies made by combining various ceramic members are often used as mechanical parts and structural members. In this method, a member in which a number of tubular bodies are fixed to a plate-like body is used. This method uses compression springs to mechanically join ceramic members on spherical surfaces, and FIG. 4 is an explanatory cross-sectional view of the joint part of the shell-and-tube heat exchanger shown in the publication, The spherical parts provided at the inner ends of the through holes X and X' of the plate-like bodies A and A', respectively, and the spherical part of the tubular body B are fixed by a spherical joint part Y by mechanical pressure. However, in this case, the tubular body may be damaged due to thermal stress during use, and gaps may be created in the spherical joint due to expansion and contraction, allowing dust, etc. in the circulating gas to leak, adhere to the joint, and cause damage to the tubular body. It was not possible to obtain good sealing performance.
【0004】また、各セラミック部材を接合材により接
合する方法も提案されている。従来セラミック部材の接
合に用いられる接合材としては、いわゆる耐熱ガラスの
パイレックスガラス(登録商標)として知られる酸化硼
素(B2 O3 )成分を含むホウケイ酸ガラスが一般
に用いられ、その粉末やスラリーを接合部に塗布し、大
気や真空中で加熱して接合していた。しかし、この方法
によるセラミック接合においては、接合部に気孔及びク
ラック等の接合欠陥が生じ易く、接合強度やシール性が
劣る等の問題があった。[0004] Furthermore, a method has been proposed in which ceramic members are bonded using a bonding material. Conventionally, borosilicate glass containing a boron oxide (B2O3) component, known as Pyrex glass (registered trademark), a heat-resistant glass, is generally used as a bonding material for bonding ceramic members, and its powder or slurry is applied to the bonding part. It was applied to the surface and then heated in the air or in a vacuum for bonding. However, in ceramic bonding by this method, bonding defects such as pores and cracks are likely to occur in the bonded portion, and there are problems such as poor bonding strength and sealing performance.
【0005】[0005]
【発明が解決しようとする課題】本発明は、セラミック
部材を接合する方法において、上記従来のセラミック接
合技術に鑑み、機械的な接合よりシール性が高く、且つ
、装置的、操作的に簡便である接合材を用いるセラミッ
ク接合において、シール性及び接合強度の向上したセラ
ミック接合を得るべく、均質な接合部を形成させること
を目的に鋭意検討した結果、本発明を完成した。[Problems to be Solved by the Invention] In view of the above-mentioned conventional ceramic bonding technology, the present invention provides a method for bonding ceramic members that has higher sealing performance than mechanical bonding and is simpler in terms of equipment and operation. In ceramic bonding using a certain bonding material, the present invention was completed as a result of intensive studies aimed at forming a homogeneous bonded portion in order to obtain a ceramic bond with improved sealing performance and bonding strength.
【0006】[0006]
【課題を解決するための手段】本発明によれば、セラミ
ック接合体を構成する少なくとも2のセラミック被接合
部材を酸化処理した後、SiO2を主成分とする無機接
合材を用いて真空中加熱処理して接合することを特徴と
するセラミック接合方法が提供される。[Means for Solving the Problems] According to the present invention, at least two ceramic members to be joined constituting a ceramic joined body are oxidized and then subjected to heat treatment in vacuum using an inorganic joining material containing SiO2 as a main component. A ceramic bonding method is provided, which is characterized in that the ceramic bonding method is characterized in that the ceramic bonding method is performed by bonding.
【0007】[0007]
【作 用】本発明は、上記のように構成され、セラミ
ック被接合部材を接合に先立ち酸化処理することにより
、被接合部材の、例えば、接合材に対するぬれ性等の表
面性状が変化して、真空加熱処理と共に、接合材の固化
性状が向上し、気孔が少なく欠陥のない接合部が形成さ
れるものと推定される。[Function] The present invention is constructed as described above, and by oxidizing the ceramic members to be joined prior to joining, the surface properties of the members to be joined, such as wettability with the joining material, are changed, It is presumed that, along with the vacuum heat treatment, the solidification properties of the bonding material are improved, and a defect-free bonded portion with fewer pores is formed.
【0008】以下、本発明について更に詳細に説明する
。本発明に使用されるセラミックスは、酸化物及び非酸
化物等いずれのセラミックスを用いてもよく、接合体が
使用される構造部材の種類、機械的強度等必要な使用条
件に応じ適宜選択すればよい。例えば、産業機械及び熱
交換器等に使用する場合は、高強度・高耐熱性の窒化珪
素や炭化珪素が用いられる。また、各々同種または異種
のセラミックスで構成されていてもよい。本発明におい
て、接合するセラミック部材の形状、厚み及び大きさは
、特に限定されるものでない。例えば、単なる平面同士
の接合でもよく、また、平板状体に多数の孔を形成した
多孔板の各孔に管状体を挿入して平板表面と孔部とに連
続的接合層を形成する接合でもよい。この場合、管状体
は、円形、楕円、矩形、多角形、星形等のいずれでもよ
く、また、平板の孔をテーパー状、段形状やネジ構造等
に形成し、管状体の端部を孔の形状にあわせて形成する
こともできる。The present invention will be explained in more detail below. The ceramics used in the present invention may be either oxide or non-oxide ceramics, and may be selected as appropriate depending on the type of structural member in which the joined body is used, mechanical strength, etc. good. For example, when used in industrial machinery, heat exchangers, etc., silicon nitride and silicon carbide, which have high strength and high heat resistance, are used. Further, each may be made of the same type of ceramic or different types of ceramics. In the present invention, the shape, thickness, and size of the ceramic members to be joined are not particularly limited. For example, it may be a simple joining between two flat surfaces, or a joining in which a tubular body is inserted into each hole of a perforated plate with many holes formed in the flat plate to form a continuous bonding layer between the flat plate surface and the hole. good. In this case, the tubular body may be circular, elliptical, rectangular, polygonal, star-shaped, etc., and the holes in the flat plate may be formed into a tapered shape, a stepped shape, a threaded structure, etc., and the end of the tubular body may be formed into a hole. It can also be formed to match the shape of.
【0009】本発明の酸化処理は、接合部材を酸素含有
ガス雰囲気中、例えば空気や酸素ガス中、約800〜1
000℃で、約1〜2時間静置して処理することができ
る。この場合、被接合材の各セラミック部材の全体を酸
化処理してもよく、また、接合部分のみ酸化処理しても
よい。本発明で用いる接合材は、各セラミック被接合部
材に使用するセラミックスの種類の機能的性質に応じて
、また得られる接合体の使用条件等に応じて選択すれば
よい。好ましくは、被接合体を構成する同種のセラミッ
クスや加熱により溶融流動化するSiO2を主成分とす
る無機接合材を使用するのがよい。SiO2を主成分と
する無機接合材としては、SiO2を50重量%以上含
有する接合材で、例えば、セラミックス接合に一般に使
用されている上記のホウケイ酸ガラスや、アルミノホウ
ケイ酸ガラス、アルミノケイ酸ガラス、ケイ酸ガラス等
のガラス接合材を挙げることができる。上記の無機接合
材は、通常、その粉末を、例えば、水、アルコール等の
溶媒を用い、要すればバインダーを添加してスラリー状
またはペースト状で用いる。この場合、均質な接合部を
得るためには、ガラス接合材の粉末平均粒度をできるだ
け微粉末とするのがよく、好ましくは1μm以下とする
のが望ましい。In the oxidation treatment of the present invention, the bonding member is exposed to about 800 to 1
The treatment can be carried out by standing at 000° C. for about 1 to 2 hours. In this case, the entirety of each ceramic member of the materials to be joined may be oxidized, or only the joint portion may be oxidized. The bonding material used in the present invention may be selected depending on the functional properties of the type of ceramic used for each ceramic member to be bonded, and the usage conditions of the resulting bonded body. Preferably, an inorganic bonding material mainly composed of ceramics of the same type as those forming the objects to be bonded or SiO2, which is melted and fluidized by heating, is preferably used. Inorganic bonding materials containing SiO2 as a main component include bonding materials containing 50% by weight or more of SiO2, such as the above-mentioned borosilicate glass commonly used for ceramic bonding, aluminoborosilicate glass, aluminosilicate glass, Examples include glass bonding materials such as silicate glass. The above-mentioned inorganic bonding material is usually used as a powder in the form of a slurry or paste, using a solvent such as water or alcohol, and adding a binder if necessary. In this case, in order to obtain a homogeneous joint, the average particle size of the glass bonding material should be as fine as possible, preferably 1 μm or less.
【0010】本発明における通常の接合手順は、セラミ
ック接合体の接合部を構成する上記酸化処理した2以上
の被接合部材の接合面の少なくとも一方の表面に接合材
ペーストを塗布し、各被接合部材の接合面を合わせた後
、大気中で約100〜150℃で約1〜2時間乾燥し、
更に約400〜500℃で約0.5〜3時間仮焼した後
、減圧して真空中において加熱処理して接合材を溶融さ
せ、その後冷却固化することにより行うことができる。
この場合の加熱処理温度及び時間は、使用する接合材の
種類や接合部の形状や厚さにより適宜選択することがで
きる。通常は、1150〜1400℃で約1〜5時間加
熱処理すればよく、加熱処理温度が1150℃未満の場
合は、接合部を形成する塗布した接合材全体が均一に溶
融されないため、均質な接合部を得ることができない。
また、1400℃を越えた場合は、接合材及び被接合部
材の構成成分の一部が著しく蒸発するため、接合部及び
被接合部材の接合界面がポーラスになり易く、気密性が
劣り、強度も低下するため好ましくない。塗布する接合
材の厚さは特に限定されるものでない。通常は、約0.
05〜5mmの厚さにすればよい。接合部材の形状、材
質、接合部の構造、接合部に求められる強度等により適
宜選択することができる。[0010] The normal joining procedure in the present invention is to apply a bonding material paste to at least one of the joining surfaces of the two or more oxidized members to be joined, which constitute the joining part of the ceramic joined body, and to After joining the joint surfaces of the parts together, dry in the atmosphere at about 100 to 150°C for about 1 to 2 hours,
This can be carried out by further calcining at about 400 to 500[deg.] C. for about 0.5 to 3 hours, followed by heat treatment in vacuum under reduced pressure to melt the bonding material, and then cooling and solidifying. The heat treatment temperature and time in this case can be appropriately selected depending on the type of bonding material used and the shape and thickness of the bonded portion. Normally, heat treatment at 1150 to 1400°C for about 1 to 5 hours is sufficient. If the heat treatment temperature is lower than 1150°C, the entire applied bonding material forming the joint will not be melted uniformly, resulting in a homogeneous bond. can't get the part. In addition, if the temperature exceeds 1400°C, some of the components of the joining material and the parts to be joined will evaporate significantly, so the joint interface between the joint part and the parts to be joined will likely become porous, resulting in poor airtightness and reduced strength. This is not preferable because it lowers the temperature. The thickness of the bonding material to be applied is not particularly limited. Usually about 0.
The thickness may be 0.05 to 5 mm. It can be selected as appropriate depending on the shape and material of the joining member, the structure of the joining part, the strength required for the joining part, etc.
【0011】[0011]
【実施例】以下に、本発明の実施例について図面を参照
にして詳しく説明する。但し、本発明は、本実施例に限
定されるものでない。
実施例1
(接合材の調製)
市販の粉末状ホウケイ酸ガラスの粉末に約60重量%の
水を添加して、アルミナ製玉石を用い振動ミルにて約3
時間混合粉砕し、平均粒度0.5μmのホウケイ酸ガラ
ス微粉末を得た。得られた微粉末ホウケイ酸ガラスと水
を、1:1に混合してペースト状とした。更に得られた
ペースト状ホウケイ酸ガラス100重量部に対し、バイ
ンダー4重量部を添加して混合して接合材ペーストを調
製した。Embodiments Below, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to this example. Example 1 (Preparation of bonding material) Approximately 60% by weight of water was added to commercially available powdered borosilicate glass powder, and the mixture was heated in a vibration mill using an alumina cobblestone for approximately 30% by weight.
The mixture was mixed and ground for a period of time to obtain fine borosilicate glass powder with an average particle size of 0.5 μm. The obtained finely powdered borosilicate glass and water were mixed at a ratio of 1:1 to form a paste. Further, 4 parts by weight of a binder was added to 100 parts by weight of the obtained paste-like borosilicate glass and mixed to prepare a bonding material paste.
【0012】(被接合部材の酸化処理)被接合部材のS
i3 N4 製の直径20mmφで高さ20mmの円柱
2体を、酸素雰囲気中の電気炉内で約1000℃に1時
間放置して酸化処理して、酸化処理Si3 N4 製被
接合部材を得た。(Oxidation treatment of members to be joined) S of members to be joined
Two i3 N4 cylinders with a diameter of 20 mmφ and a height of 20 mm were oxidized by being left at about 1000° C. for 1 hour in an electric furnace in an oxygen atmosphere to obtain oxidized Si3 N4 members to be joined.
【0013】(接合)得られた酸化処理Si3 N4
製被接合部材2体を図1の断面説明図に示したように、
接合部Aとなる各被接合部材1の底面部に調製したペー
スト状接合材を約100μm塗布して各板状体を押しつ
けて合わせた。その後、120℃の電気炉内で約1時間
乾燥し、更に温度を上昇し、約500℃で約1時間仮焼
した後、電気炉内を真空とし、温度を更約1150℃に
上昇させて1時間加熱処理した後、そのまま放置して冷
却して接合体を得た。冷却後、接合体を取り出しJIS
R−1601に従って、接合部の室温での接合強度
を測定した。その結果を表1に示した。(Joining) Obtained oxidized Si3 N4
As shown in the cross-sectional diagram of FIG. 1, the two manufactured members to be joined are
Approximately 100 μm of the prepared paste-like bonding material was applied to the bottom surface of each member 1 to be bonded to form the bonded portion A, and the plate-like bodies were pressed together. After that, it was dried in an electric furnace at 120°C for about 1 hour, the temperature was further raised, and after calcining at about 500°C for about 1 hour, the inside of the electric furnace was evacuated and the temperature was further raised to about 1150°C. After being heat-treated for 1 hour, it was left to stand and cooled to obtain a bonded body. After cooling, take out the joined body and JIS
The bonding strength of the bonded portion at room temperature was measured according to R-1601. The results are shown in Table 1.
【0014】[0014]
【表1】[Table 1]
【0015】比較例1
接合部材を酸化処理せずにそのまま用い、加熱処理を大
気中で行った以外は、実施例1と全く同様にして接合体
を得た。得られた接合体を実施例1と同様に、接合部の
接合強度を測定した。その結果を表1に示した。Comparative Example 1 A bonded body was obtained in exactly the same manner as in Example 1, except that the bonded members were used as they were without being oxidized and the heat treatment was performed in the atmosphere. The bonding strength of the bonded portion of the obtained bonded body was measured in the same manner as in Example 1. The results are shown in Table 1.
【0016】比較例2
接合部材を酸化処理せずにそのまま用いた以外は、実施
例1と全く同様にして接合体を得た。得られた接合体を
実施例1と同様に、接合部の接合強度を測定した。その
結果を表1に示した。Comparative Example 2 A bonded body was obtained in exactly the same manner as in Example 1, except that the bonding members were used as they were without being oxidized. The bonding strength of the bonded portion of the obtained bonded body was measured in the same manner as in Example 1. The results are shown in Table 1.
【0017】実施例2〜4
被接合部材のSi3 N4 製の直径6.5mmφで高
さ50 mm の円柱と、直径18mmφで高さ10
mm で底部中央に一方の被接合部材の円柱が挿入でき
る孔を有する底付円筒のそれぞれを、酸化処理温度を8
00℃とした以外は実施例1と同様にして、酸化処理S
i3 N4 製の各被接合部材をそれぞれ3体ずつ得た
。得られた酸化処理Si3 N4 製被接合部材を図2
の断面説明図に示したように、被接合部材円柱2を接合
部材底付円筒3の底部の孔に埋め込み、底付円筒3の底
面とその底面に直交する円柱2の周囲に、実施例1と同
様の接合材ペーストを塗布した。接合材の塗布厚さは約
5mmであった。その後、実施例1と同様に乾燥、仮焼
し、その後、各接合体を表1に示した温度で加熱処理し
た以外は、実施例1と同様に処理して、接合体を得た。
得られた各接合体の接合部の接合強度を片持ち曲げ試験
にて測定した。また、図4に示したリーク試験機におい
て、接合体10を所定の接合体支持治具11にセットし
て水中に浸漬し、8kg/cm2の圧力でパイプ12内
を加圧したときに、発生した気泡の秒当たりの体積(ミ
リリットル/秒)を測定する方法でリーク試験を行い、
シール性を測定した。それらの結果をそれぞれ表1に示
した。Examples 2 to 4 A cylinder made of Si3N4 with a diameter of 6.5 mmφ and a height of 50 mm and a cylinder with a diameter of 18 mmφ and a height of 10 mm.
Each of the cylinders with a bottom, which has a hole in the center of the bottom into which the cylinder of one of the members to be joined can be inserted, was oxidized at a temperature of 8 mm.
Oxidation treatment S was performed in the same manner as in Example 1 except that the temperature was 00°C.
Three pieces of each member to be joined made of i3 N4 were obtained. The resulting oxidized Si3N4 member to be joined is shown in Figure 2.
As shown in the cross-sectional explanatory diagram, the cylinder 2 of the welded member is embedded in the hole at the bottom of the cylinder 3 with the bottom of the joining member, and around the bottom of the cylinder 3 with the bottom and the cylinder 2 orthogonal to the bottom, the cylinder 2 of Example 1 is embedded. The same bonding material paste was applied. The coating thickness of the bonding material was approximately 5 mm. Thereafter, the bonded bodies were dried and calcined in the same manner as in Example 1, and then processed in the same manner as in Example 1, except that each bonded body was heat-treated at the temperatures shown in Table 1 to obtain bonded bodies. The joint strength of the joints of each of the obtained joined bodies was measured by a cantilever bending test. In addition, in the leak test machine shown in FIG. 4, when the bonded body 10 was set in a predetermined bonded body support jig 11 and immersed in water, and the inside of the pipe 12 was pressurized at a pressure of 8 kg/cm2, the leakage occurred. A leak test was conducted by measuring the volume of bubbles per second (milliliter/second).
Sealing performance was measured. The results are shown in Table 1.
【0018】実施例5
実施例1において、酸化処理温度を800℃とし、真空
加熱処理温度を1400℃とした以外は全く同様にして
接合体を得た。得られた接合体を実施例1と同様に、接
合部の接合強度を測定した。その結果を表1に示した。Example 5 A bonded body was obtained in exactly the same manner as in Example 1 except that the oxidation treatment temperature was 800°C and the vacuum heat treatment temperature was 1400°C. The bonding strength of the bonded portion of the obtained bonded body was measured in the same manner as in Example 1. The results are shown in Table 1.
【0019】実施例6
被接合部材のSi3 N4 製の外径6.5mmφ、内
径4.5mmφで高さ100mmの円管3本と、直径4
0mmφで高さ10 mm で底部に前記の被接合部材
の円管が挿入できる孔を3個有する底付円筒3体のそれ
ぞれを、酸化処理を温度800℃で2時間とした以外は
実施例1と同様にして酸化処理Si3 N4 製の各被
接合部材をそれぞれ得た。得られた酸化処理Si3 N
4 製被接合部材を図3の断面説明図に示したように、
3本の被接合部材円管4の片端を接合部材底付円筒5の
底部の各孔に埋め込み、底付円筒5の底面とその底面に
直交する各円管4の周囲に、実施例1と同様の接合材ペ
ーストを塗布した。接合材の塗布厚さは約5mmであっ
た。その後、実施例1と同様に乾燥、仮焼し、その後、
接合体を表1に示した温度で加熱処理した以外は、実施
例1と同様に処理して、接合体を得た。得られた各接合
体を実施例2と同様にしてシール性を測定した。その結
果を表1に示した。Example 6 Three circular pipes made of Si3N4 with an outer diameter of 6.5 mmφ, an inner diameter of 4.5 mmφ and a height of 100 mm were used as members to be joined, and
Example 1 except that each of three bottomed cylinders with a diameter of 0 mm and a height of 10 mm and having three holes in the bottom into which the circular pipes of the members to be joined were inserted was oxidized at a temperature of 800° C. for 2 hours. Each member to be joined made of oxidized Si3N4 was obtained in the same manner as above. The obtained oxidized Si3N
As shown in the cross-sectional diagram of FIG.
One end of the three circular tubes 4 of the members to be joined is embedded in each hole in the bottom of the cylinder 5 with the bottom of the joining member, and the cylindrical tubes 4 of Example 1 are placed around the bottom of the cylinder 5 with the bottom and each circular tube 4 perpendicular to the bottom A similar bonding material paste was applied. The coating thickness of the bonding material was approximately 5 mm. Thereafter, it was dried and calcined in the same manner as in Example 1, and then
A bonded body was obtained in the same manner as in Example 1, except that the bonded body was heat-treated at the temperature shown in Table 1. The sealing properties of each of the obtained joined bodies were measured in the same manner as in Example 2. The results are shown in Table 1.
【0020】比較例3
実施例6において、接合部材を酸化処理せずにそのまま
用い、表1に示した温度で大気中で加熱処理を行った以
外は、全く同様にして接合体を得た。得られた接合体を
実施例6と同様に、接合部のシール性を測定した。その
結果を表1に示した。Comparative Example 3 A bonded body was obtained in exactly the same manner as in Example 6, except that the bonded members were used as they were without being oxidized and heat treated in the atmosphere at the temperatures shown in Table 1. The sealing performance of the joint portion of the obtained joined body was measured in the same manner as in Example 6. The results are shown in Table 1.
【0021】上記の実施例及び比較例より、本発明のセ
ラミック接合が強度的にも優れ、埋め込み等の接合部に
おいてはリークも無く、極めてシール性が高いことが分
かる。なお、実施例2〜4及び実施例6において、被接
合部材に用いた円筒3の筒部は真空加熱処理において、
接合材が溶融流動化した場合でも、溶融した接合材が外
部に流出しないという利点を有し、多数の円柱や円管を
板状体の孔部に接合固定するセラミック接合において本
発明を適用するのに好適である。From the above Examples and Comparative Examples, it can be seen that the ceramic bonding of the present invention is excellent in strength, has no leakage at the bonded joints, etc., and has extremely high sealing performance. In addition, in Examples 2 to 4 and Example 6, the cylindrical portion of the cylinder 3 used as the member to be joined was subjected to vacuum heat treatment.
Even if the bonding material melts and fluidizes, the present invention has the advantage that the molten bonding material does not flow out to the outside, and the present invention is applied to ceramic bonding in which a large number of cylinders and pipes are bonded and fixed in the holes of a plate-shaped body. It is suitable for
【0022】[0022]
【発明の効果】本発明のセラミック接合法は、接合部に
気孔が極めて少なく且つ接合部全体が均質で、接合強度
が大きく、シール性も高いセラミック接合体を得ること
ができ、工業上極めて有用である。[Effects of the Invention] The ceramic bonding method of the present invention can produce a ceramic bonded body that has extremely few pores in the bonded area, is homogeneous throughout the bonded area, has high bonding strength, and has high sealing performance, and is extremely useful industrially. It is.
【図1】本発明の一実施例のセラミック接合体を示す断
面説明図FIG. 1 is an explanatory cross-sectional diagram showing a ceramic bonded body according to an embodiment of the present invention.
【図2】本発明の一実施例のセラミック接合体を示す断
面説明図[Fig. 2] A cross-sectional explanatory diagram showing a ceramic bonded body according to an embodiment of the present invention.
【図3】本発明の一実施例のセラミック接合体を示す断
面説明図FIG. 3 is an explanatory cross-sectional view showing a ceramic bonded body according to an embodiment of the present invention.
【図4】本発明における接合体のシール性を評価するた
めのリーク試験機[Figure 4] Leak tester for evaluating the sealing performance of the joined body in the present invention
【図5】従来の機械的なセラミック接合の一例を示す断
面説明図[Fig. 5] Cross-sectional explanatory diagram showing an example of conventional mechanical ceramic bonding
A 接合部 1 円柱被接合部材 2 円柱被接合部材 3 有孔底付円筒被接合部材 4 円管被接合部材 5 有孔底付円筒被接合部材 10 接合体 11 接合体支持治具 12 パイプ A Joint part 1 Cylindrical member to be joined 2 Cylindrical member to be joined 3 Cylindrical member to be joined with perforated bottom 4 Circular pipe joined member 5 Cylindrical member to be joined with perforated bottom 10 Zygote 11 Joint body support jig 12 Pipe
Claims (1)
も2のセラミック被接合部材を酸化処理した後、SiO
2を主成分とする無機接合材を用いて真空中加熱処理し
て接合することを特徴とするセラミック接合方法。Claim 1: After oxidizing at least two ceramic members constituting a ceramic joined body, SiO
1. A ceramic bonding method characterized by bonding by heat treatment in vacuum using an inorganic bonding material containing 2 as a main component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985191A JP2801973B2 (en) | 1991-03-28 | 1991-03-28 | Ceramic joining method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985191A JP2801973B2 (en) | 1991-03-28 | 1991-03-28 | Ceramic joining method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04300257A true JPH04300257A (en) | 1992-10-23 |
JP2801973B2 JP2801973B2 (en) | 1998-09-21 |
Family
ID=13982285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8985191A Expired - Fee Related JP2801973B2 (en) | 1991-03-28 | 1991-03-28 | Ceramic joining method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2801973B2 (en) |
-
1991
- 1991-03-28 JP JP8985191A patent/JP2801973B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2801973B2 (en) | 1998-09-21 |
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