JPH04287398A - Electric power supplying structure - Google Patents
Electric power supplying structureInfo
- Publication number
- JPH04287398A JPH04287398A JP5226491A JP5226491A JPH04287398A JP H04287398 A JPH04287398 A JP H04287398A JP 5226491 A JP5226491 A JP 5226491A JP 5226491 A JP5226491 A JP 5226491A JP H04287398 A JPH04287398 A JP H04287398A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- board unit
- printed board
- inner chamber
- insulating container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 238000005192 partition Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 6
- 230000002411 adverse Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、各種電子機器の構成に
広く使用されるプリント板ユニットへの電源供給構造に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for supplying power to printed board units widely used in the construction of various electronic devices.
【0002】最近、スーパーコンピュータ等の大型電子
機器に装着される複数枚のプリント板ユニットは、信号
の伝送を高速化するために高集積化された各種電子部品
をプリント配線基板(以下基板と略称する)上に高密度
実装されている。これに伴ってプリント板ユニットより
発生する熱量も大きくなるとともに機器内に多数本の電
源供給用線材が配線されるようになっているため、プリ
ント板ユニットの冷却が容易になるとともに電源供給用
の配線が簡単となる新しい電源供給構造が必要とされて
いる。Recently, multiple printed circuit board units installed in large electronic devices such as supercomputers have been constructed using printed wiring boards (hereinafter abbreviated as "substrates"), which incorporate various highly integrated electronic components in order to speed up signal transmission. ) are mounted in high density. Along with this, the amount of heat generated by the printed board unit has also increased, and many power supply wires have been wired inside the equipment, making it easier to cool the printed board unit and increasing the number of power supply wires. New power supply structures are needed that simplify wiring.
【0003】0003
【従来の技術】従来広く使用されている電源供給構造は
、図4に示すように複数個の各種電子部品1−2 を実
装したプリント板ユニット1の基板1−1端縁に設けら
れたそれぞれの電源パッド1−1aに電源ケーブル3−
1を接続するとともに、各グランドパッド1−1bには
グランドケーブル3−2 を接続し、信号パッドに接合
させたコネクタ1−3 により信号ケーブル2と接続し
て、上記各種電子部品1−2 を図示していない冷却機
構により前記電子部品1−2 を冷却するように構成さ
れている。2. Description of the Related Art As shown in FIG. 4, a power supply structure that has been widely used in the past includes a power supply structure provided at the edge of a board 1-1 of a printed board unit 1 on which a plurality of various electronic components 1-2 are mounted. Connect the power cable 3- to the power pad 1-1a of
At the same time, a ground cable 3-2 is connected to each ground pad 1-1b, and connected to the signal cable 2 through the connector 1-3 connected to the signal pad, thereby connecting the various electronic components 1-2 described above. The electronic component 1-2 is configured to be cooled by a cooling mechanism (not shown).
【0004】0004
【発明が解決しようとする課題】以上説明した従来ので
問題となるのは、一枚のプリント板ユニット1に対して
複数本の電源ケーブル3−1 およびグランドケーブル
3−2 が接続されているから、機器内に複数枚のプリ
ント板ユニット1を機器内に装着すると電源供給用の電
源ケーブル3−1 およびグランドケーブル3−2 の
配線本数が多くなるとともに、電源供給用のケーブル等
から発生する電磁波によりプリント板ユニット1に実装
した電子部品1−2 に悪影響を与えたり、各プリント
板ユニット1に対する冷却機構の配設が困難になるとい
う問題が生じている。[Problems to be Solved by the Invention] The problem with the conventional method described above is that a plurality of power cables 3-1 and ground cables 3-2 are connected to one printed board unit 1. When multiple printed circuit board units 1 are installed in a device, the number of power cables 3-1 and ground cables 3-2 for power supply increases, and electromagnetic waves generated from power supply cables, etc. This poses a problem that the electronic components 1-2 mounted on the printed board unit 1 are adversely affected and that it becomes difficult to provide a cooling mechanism for each printed board unit 1.
【0005】本発明は上記のような問題点に鑑み、導電
性冷媒によりプリント板ユニットへ電源の供給を行うこ
とにより電源供給配線を少なくするとともに、有害な電
磁波を遮断することが行え、且つプリント板ユニットの
冷却が容易に行える新しい電源供給構造の提供を目的と
する。In view of the above-mentioned problems, the present invention supplies power to the printed board unit using a conductive refrigerant, thereby reducing the number of power supply wirings, blocking harmful electromagnetic waves, and improving the printed circuit board unit. The purpose is to provide a new power supply structure that allows easy cooling of the plate unit.
【0006】[0006]
【課題を解決するための手段】本発明は、図1に示すよ
うに絶縁性の優れた仕切り板14−1により分割されて
導電性液体16をそれぞれ循環させる第一と第二の内室
14−1a,14−1bを形成し、当該各内室14−1
a,14−1bに導電板14−2をそれぞれ配設した絶
縁容器14と、複数個の各種電子部品1−2 を基板1
1−1の主面に実装するとともに信号ケーブル2を引き
出して、前記基板11−1の全表面に絶縁被膜11−3
を施して該電源電極11−1aと該グランド電極11−
1bを露出させたプリント板ユニット11とを備え、上
記プリント板ユニット11の該絶縁被膜11−3から露
出した電源電極11−1aを第一内室14−1aに、グ
ランド電極11−1bを第二内室14−1bでそれぞれ
位置するように、上記仕切り板14−1を挿通させて該
プリント板ユニット11を第一と第二の内室14−1a
,14−1bに収納して導電性液体16にそれぞれ浸漬
させ、第一内室14−1aに配設した該導電板14−2
に電源ケーブル3−1 を、第二内室14−1bに配設
した該導電板14−2とグランドケーブル3−2 を接
続する。[Means for Solving the Problems] As shown in FIG. 1, the present invention provides first and second inner chambers 14 which are divided by a partition plate 14-1 having excellent insulation properties and which circulate a conductive liquid 16 respectively. -1a, 14-1b, and each inner chamber 14-1
An insulating container 14 in which a conductive plate 14-2 is arranged on each of a and 14-1b, and a plurality of various electronic components 1-2 are attached to a substrate 1.
1-1, the signal cable 2 is pulled out, and an insulating coating 11-3 is formed on the entire surface of the substrate 11-1.
The power supply electrode 11-1a and the ground electrode 11-
1b is exposed, the power supply electrode 11-1a exposed from the insulating coating 11-3 of the printed board unit 11 is placed in the first inner chamber 14-1a, and the ground electrode 11-1b is placed in the first inner chamber 14-1a. The printed board unit 11 is inserted into the first and second inner chambers 14-1a by inserting the partition plate 14-1 so that the printed board unit 11 is located in the first and second inner chambers 14-1b.
, 14-1b and immersed in the conductive liquid 16, respectively, and disposed in the first inner chamber 14-1a.
The power cable 3-1 is connected to the conductive plate 14-2 disposed in the second interior chamber 14-1b, and the ground cable 3-2 is connected to the conductive plate 14-2.
【0007】[0007]
【作用】本発明では、第一および第二の内室14−1a
,14−1bに充満させた導電性液体16は絶縁容器1
4の中央部に設けた仕切り板14−1により絶縁され、
プリント板ユニット11の露出電源電極11−1aを第
一内室14−1a, グランド電極11−1bを第二内
室14−1bでそれぞれ位置するように、当該プリント
板ユニット11を上記仕切り板14−1挿通させてそれ
ぞれ導電性液体16に浸漬させ、第一内室14−1aに
配設した該導電板14−2に電源ケーブル3−1 ,
第二内室14−1bに配設した該導電板14−2とグラ
ンドケーブル3−2 を接続することにより、仕切り板
14−1で絶縁されたそれぞれの導電性液体16を介し
てプリント板ユニット11の電源電極11−1aとグラ
ンド電極11−1bに電源が供給されるので、複数枚の
プリント板ユニット11を絶縁容器14の導電性液体1
6に浸漬させることにより電源供給用の配線が二本とな
って配線本数を削減することが可能となる。[Operation] In the present invention, the first and second inner chambers 14-1a
, 14-1b is filled with the conductive liquid 16 in the insulating container 1.
Insulated by a partition plate 14-1 provided in the center of 4,
The printed board unit 11 is connected to the partition plate 14 so that the exposed power supply electrode 11-1a of the printed board unit 11 is located in the first inner chamber 14-1a, and the ground electrode 11-1b is located in the second inner chamber 14-1b. -1 and immersed in the conductive liquid 16, respectively, and the power cables 3-1,
By connecting the conductive plate 14-2 disposed in the second inner chamber 14-1b and the ground cable 3-2, the printed board unit is connected via the conductive liquid 16 insulated by the partition plate 14-1. Since power is supplied to the power supply electrode 11-1a and the ground electrode 11-1b of 11, the plurality of printed board units 11 are connected to the conductive liquid 1 of the insulating container 14.
6, the number of wirings for power supply becomes two, making it possible to reduce the number of wirings.
【0008】また、プリント板ユニット11全体がそれ
ぞれの導電性液体16に浸漬されているからシールド遮
蔽が行われて電磁波による悪影響を受けることがなく、
且つ導電性液体16を冷却・循環させることにより容易
にプリント板ユニット11を冷却することも可能となる
。Furthermore, since the entire printed circuit board unit 11 is immersed in each conductive liquid 16, it is shielded and is not adversely affected by electromagnetic waves.
Furthermore, by cooling and circulating the conductive liquid 16, the printed board unit 11 can be easily cooled.
【0009】[0009]
【実施例】以下図1〜図3について本発明の実施例を詳
細に説明する。図1は第一実施例による電源供給構造を
示す模式的断面図、図2は第二実施例の電源供給構造を
示す模式的断面図、図3は本実施例のプリント板ユニッ
トの模式的断面図を示し、図中において、図4と同一部
材には同一記号が付してあるが、その他の11は各種電
子部品を実装したプリント板ユニット,14はプリント
板ユニットを浸漬する絶縁容器, 16はプリント板ユ
ニットに電源を供給する導電性液体である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 3. FIG. 1 is a schematic sectional view showing the power supply structure according to the first embodiment, FIG. 2 is a schematic sectional view showing the power supply structure according to the second embodiment, and FIG. 3 is a schematic sectional view of the printed board unit according to the present embodiment. In the figure, the same members as those in FIG. 4 are given the same symbols, the other 11 is a printed board unit in which various electronic components are mounted, 14 is an insulating container in which the printed board unit is immersed, and 16 is a conductive liquid that provides power to the printed circuit board unit.
【0010】プリント板ユニット11は、図3に示すよ
うに基板11−1の裏面側両端縁にそれぞれ平板状の電
源電極11−1aとグランド電極11−1bを形成して
、主面側に複数個の各種電子部品1−2 を実装すると
ともに端縁に設けられた図示していない信号パッドにコ
ネクタ1−3 を接合し、この基板11−1の前記電源
電極11−1aとグランド電極11−1bを除く全表面
と前記コネクタ1−3 と接続した信号ケーブル2に絶
縁被膜11−3を施すことにより、当該電源電極11−
1aとグランド電極11−1bを絶縁被膜11−3から
外部に露出させている。As shown in FIG. 3, the printed board unit 11 has a flat power supply electrode 11-1a and a ground electrode 11-1b formed on both edges of the back side of a substrate 11-1, and a plurality of flat ground electrodes 11-1b on the main surface side. Various electronic components 1-2 are mounted, and a connector 1-3 is connected to a signal pad (not shown) provided on the edge, and the power supply electrode 11-1a and the ground electrode 11-1 of this board 11-1 are connected. By applying an insulating coating 11-3 to the entire surface except for 1b and the signal cable 2 connected to the connector 1-3, the power supply electrode 11-
1a and ground electrode 11-1b are exposed to the outside through insulating coating 11-3.
【0011】絶縁容器14は、図1に示すように中央部
を絶縁性の優れた仕切り板14−1により分割された第
一と第二の内室14−1a,14−1bを形成して、当
該第一と第二の内室14−1a,14−1bに後述する
導電性液体16をそれぞれ別系統で循環させる図示して
いない供給口と排出口を設け、一定大きさで平板状の導
電板14−2を該第一と第二の内室14−1a,14−
1bの側壁にそれぞれ一枚づつ配設している。As shown in FIG. 1, the insulating container 14 has first and second inner chambers 14-1a and 14-1b divided at the center by a partition plate 14-1 with excellent insulation properties. The first and second inner chambers 14-1a and 14-1b are provided with a supply port and a discharge port (not shown) for circulating the conductive liquid 16, which will be described later, in separate systems, and are arranged in a flat plate shape with a constant size. The conductive plate 14-2 is connected to the first and second inner chambers 14-1a, 14-
One sheet is arranged on each side wall of 1b.
【0012】導電性液体16は、導電性が優れるととも
に冷却能力を有する液体,例えば汎用の水銀である。上
記部材を使用した第一実施例の電源供給構造は、図1に
示すように中央部の仕切り板14−1により分割されて
それぞれに導電板14−2を配設した絶縁容器14の第
一および第二内室14−1a,14−1bに、水銀等よ
りなる導電性液体16をそれぞれ別系統の循環路より供
給して充満させるとともに、第一内室14−1aに配設
した該導電板14−2に電源ケーブル3−1 を、第二
内室14−1bに配設した該導電板14−2とグランド
ケーブル3−2 を接続する。The conductive liquid 16 is a liquid having excellent conductivity and cooling ability, such as general-purpose mercury. The power supply structure of the first embodiment using the above members is, as shown in FIG. The second internal chambers 14-1a and 14-1b are each supplied with a conductive liquid 16 made of mercury or the like from separate circulation paths, and the conductive liquid 16 disposed in the first internal chamber 14-1a is filled. A power cable 3-1 is connected to the plate 14-2, and a ground cable 3-2 is connected to the conductive plate 14-2 disposed in the second interior chamber 14-1b.
【0013】そして、上記プリント板ユニット11の該
絶縁被膜11−3から露出した電源電極11−1aを上
記絶縁容器14の第一内室14−1aに位置させるとと
もに、グランド電極11−1bが第二内室14−1bに
位置するように上記仕切り板14−1を挿通させて該プ
リント板ユニット11を第一および第二の内室14−1
a,14−1bの導電性液体16にそれぞれ浸漬させる
ことにより、それぞれの導電性液体16を介して該プリ
ント板ユニット11に電源の供給が行われるように構成
する。Then, the power supply electrode 11-1a exposed from the insulating coating 11-3 of the printed board unit 11 is located in the first inner chamber 14-1a of the insulating container 14, and the ground electrode 11-1b is located in the first inner chamber 14-1a of the insulating container 14. The printed board unit 11 is inserted into the first and second inner chambers 14-1 by inserting the partition plate 14-1 so as to be located in the second inner chamber 14-1b.
By immersing them in the conductive liquids 16 of a and 14-1b, power is supplied to the printed board unit 11 via the respective conductive liquids 16.
【0014】その結果、絶縁容器14に第一および第二
内室14−1a,14−1bにそれぞれ設けた導電板1
4−2に電源ケーブル3−1 とグランドケーブル3−
2 とからそれぞれ電源を供給すると、水銀等よりなる
導電性液体16の導電性によりプリント板ユニット11
の電源電極11−1aとグランド電極11−1bに電源
が供給されるから電源供給用の配線本数が少なくなり、
導電性液体16,即ち水銀によってプリント板ユニット
11全体が覆われるために電磁波によるノイズの悪影響
を全く防止することができる。As a result, the conductive plates 1 provided in the first and second inner chambers 14-1a and 14-1b of the insulating container 14, respectively.
4-2, power cable 3-1 and ground cable 3-
When power is supplied from 2 and 2, the printed board unit 11
Since power is supplied to the power supply electrode 11-1a and the ground electrode 11-1b, the number of wiring for power supply is reduced.
Since the entire printed board unit 11 is covered with the conductive liquid 16, that is, mercury, the adverse effects of noise caused by electromagnetic waves can be completely prevented.
【0015】また、第二実施例の電源供給構造は、図2
に示すように上記プリント板ユニット11が収納できる
大きさに成形して第一内室24−1aを設けた絶縁材よ
りなる第一絶縁容器24と、当該第一内室24−1aの
下部に配設できる大きさに成形して密閉の第二内室25
−1aを設けた絶縁材よりなる第二絶縁容器25とを形
成して、第一内室24−1aと第二内室25−1aのそ
れぞれ側壁に平板状の導電板14−2を配設し、この第
一内室24−1aの下部に第二絶縁容器25を内設する
とともに第一内室24−1aと第二内室25−1aに導
電性液体16を供給する。The power supply structure of the second embodiment is shown in FIG.
As shown in FIG. 2, a first insulating container 24 made of an insulating material is formed into a size that can accommodate the printed board unit 11 and has a first inner chamber 24-1a, and a first insulating container 24 is provided with a first inner chamber 24-1a at the bottom of the first inner chamber 24-1a. A second interior chamber 25 that is molded to a size that allows for installation and is sealed.
A second insulating container 25 made of an insulating material provided with -1a is formed, and a flat conductive plate 14-2 is arranged on the side wall of each of the first inner chamber 24-1a and the second inner chamber 25-1a. A second insulating container 25 is installed in the lower part of the first inner chamber 24-1a, and a conductive liquid 16 is supplied to the first inner chamber 24-1a and the second inner chamber 25-1a.
【0016】そして、第一実施例と同様に、上記プリン
ト板ユニット11の露出電源電極11−1aを第一内室
24−1aに位置させるとともにグランド電極11−1
bが第二内室25−1aに位置するように、第二絶縁容
器25と上蓋を挿通させて該プリント板ユニット11を
第一および第二の内室24−1a,25−1aの導電性
液体16にそれぞれ浸漬させ、第一絶縁容器24の上記
導電板14−2に電源ケーブル3−1 を、第二絶縁容
器25の上記導電板14−2とグランドケーブル3−2
を接続することにより、第一実施例と同様にプリント
板ユニットへの冷却が容易となるとともに電磁波による
悪影響を防止できて、且つ電源供給用の配線本数を減少
させるように構成している。Similarly to the first embodiment, the exposed power supply electrode 11-1a of the printed board unit 11 is located in the first inner chamber 24-1a, and the ground electrode 11-1
b is located in the second inner chamber 25-1a, the printed board unit 11 is inserted into the second insulating container 25 and the upper lid so that the printed board unit 11 is located in the first and second inner chambers 24-1a and 25-1a. The power cable 3-1 is connected to the conductive plate 14-2 of the first insulating container 24, and the ground cable 3-2 is connected to the conductive plate 14-2 of the second insulating container 25 by immersing them in the liquid 16.
By connecting the two, it is possible to easily cool the printed board unit as in the first embodiment, prevent the adverse effects of electromagnetic waves, and reduce the number of wiring for power supply.
【0017】[0017]
【発明の効果】以上の説明から明らかなように本発明に
よれば極めて簡単な構成で、プリント板ユニット11の
冷却と同時に電源の供給が行えることになり、且つ、電
源供給用の配線接続が簡素化されるとともに電磁波によ
るノイズの影響を防止することができる等の利点があり
、著しい経済的及び、信頼性向上の効果が期待できる電
源供給構造を提供することができる。As is clear from the above description, according to the present invention, it is possible to supply power at the same time as cooling the printed board unit 11 with an extremely simple configuration, and the wiring connection for power supply is simple. It is possible to provide a power supply structure which has advantages such as being simplified and being able to prevent the influence of noise caused by electromagnetic waves, and which can be expected to have significant economic and reliability effects.
【図1】 第一実施例による電源供給構造を示す模式
的断面図である。FIG. 1 is a schematic cross-sectional view showing a power supply structure according to a first embodiment.
【図2】 第二実施例の電源供給構造を示す模式的断
面図である。FIG. 2 is a schematic cross-sectional view showing a power supply structure of a second embodiment.
【図3】 本実施例のプリント板ユニットを示す模式
的断面図である。FIG. 3 is a schematic cross-sectional view showing the printed board unit of this embodiment.
【図4】 従来の電源供給構造を示す模式的断面図で
ある。FIG. 4 is a schematic cross-sectional view showing a conventional power supply structure.
1−2 は電子部品、2は信号ケーブル、3−1 は電
源ケーブル、3−2 はグランドケーブル、11はプリ
ント板ユニット、11−1は基板、
11−1aは電源電極
、11−1bはグランド電極、11−3は絶縁被膜、1
4は絶縁容器、14−1は仕切り板、14−1a,24
−1a は第一内室、 14−
1b,25−1a は第二内室、14−2は導電板、1
6は導電性液体、24は第一絶縁容器、
25は第二絶縁容器、1-2 is an electronic component, 2 is a signal cable, 3-1 is a power cable, 3-2 is a ground cable, 11 is a printed board unit, 11-1 is a board,
11-1a is a power supply electrode, 11-1b is a ground electrode, 11-3 is an insulating coating, 1
4 is an insulating container, 14-1 is a partition plate, 14-1a, 24
-1a is the first inner chamber, 14-
1b, 25-1a is the second inner chamber, 14-2 is the conductive plate, 1
6 is a conductive liquid, 24 is a first insulating container,
25 is a second insulating container;
Claims (3)
4−1)により分割されてそれぞれ導電性液体(16)
を循環させる第一と第二の内室(14−1a,14−1
b) を形成して、当該内室(14−1a,14−1b
)に導電板(14−2)をそれぞれ配設した絶縁容器(
14)と、複数個の各種電子部品(1−2) を実装し
たプリント配線基板(11−1)の全表面に絶縁被膜(
11−3)を施して、電源供給用とグランド用の電極(
11−1a,11−1b) を当該絶縁被膜(11−3
)から露出させたプリント板ユニット(11)とを備え
、上記プリント板ユニット(11)の露出した該電源電
極(11−1a) を一方の該内室(14−1a) に
、該グランド電極(11−1b) を他方の内室(14
−1b) でそれぞれ位置するように、上記仕切り板(
14−1)を挿通させて該プリント板ユニット(11)
を絶縁容器(14)に収納してそれぞれ導電性液体(1
6)に浸漬させ、上記一方の該内室(14−1a) に
配設した該導電板(14−2)に電源ケーブル(3−1
) を、他方の該内室(14−1b) に配設した該導
電板(14−2)とグランドケーブル(3−2) を接
続することにより、上記導電性液体(16)を介して該
プリント板ユニット(11)に電源を供給するよう構成
したことを特徴とする電源供給構造。[Claim 1] Partition plate with excellent insulation (1
4-1) and each conductive liquid (16)
The first and second inner chambers (14-1a, 14-1
b) to form the inner chambers (14-1a, 14-1b
) and an insulating container (
14) and an insulating coating (
11-3) to connect the power supply and ground electrodes (
11-1a, 11-1b) to the insulating coating (11-3
), the exposed power supply electrode (11-1a) of the printed board unit (11) is placed in one of the internal chambers (14-1a), and the ground electrode ( 11-1b) into the other inner chamber (14
-1b) so that the partition plates (
14-1) through the printed board unit (11).
are stored in an insulating container (14) and each conductive liquid (1
6) and connect the power cable (3-1) to the conductive plate (14-2) disposed in one of the inner chambers (14-1a).
) through the conductive liquid (16) by connecting the conductive plate (14-2) disposed in the other inner chamber (14-1b) and the ground cable (3-2). A power supply structure configured to supply power to a printed board unit (11).
ト板ユニット(11)が収納できる大きさの第一内室(
24−1a) を有する第一絶縁容器(24)に密閉し
た第二内室(25−1a) を設けた第二絶縁容器(2
5)を内設し、当該第一内室(24−1a) と該第二
内室25−1a)のそれぞれに導電板(14−2)を配
設して当該導電板(14−2)に電源ケーブル(3−1
) およびグランドケーブル(3−2) をそれぞれ接
続したことを特徴とする請求項1記載の電源供給構造。2. The insulating container has a first inner chamber (
A second insulating container (24-1a) is provided with a second insulating container (24-1a) and a second insulating container (24-1a) is sealed.
5), and a conductive plate (14-2) is disposed in each of the first inner chamber (24-1a) and the second inner chamber 25-1a). Connect the power cable (3-1
) and a ground cable (3-2) are connected to the power supply structure according to claim 1.
プリント配線基板(11−1)に平板状の電源電極(1
1−1a) とグランド電極(11−1b)を互いに一
定寸法隔てた位置に形成して、複数個の各種電子部品(
1−2)を実装するとともに端縁より信号ケーブル(2
) を引き出し、上記電源電極(11−1a) とグラ
ンド電極(11−1b) を除く該プリント配線基板(
11−1)の全表面と該信号ケーブル(2) に絶縁被
膜(11−3)を施したことを特徴とする請求項1記載
の電源供給構造。Claim 3: The printed board unit comprises:
A flat power supply electrode (1) is installed on the printed wiring board (11-1).
1-1a) and a ground electrode (11-1b) are formed at positions separated by a certain distance from each other, and a plurality of various electronic components (
1-2) and connect the signal cable (2) from the edge.
), and remove the printed wiring board (11-1b) excluding the power supply electrode (11-1a) and ground electrode (11-1b).
2. The power supply structure according to claim 1, wherein an insulating coating (11-3) is applied to the entire surface of the signal cable (11-1) and the signal cable (2).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5226491A JPH04287398A (en) | 1991-03-18 | 1991-03-18 | Electric power supplying structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5226491A JPH04287398A (en) | 1991-03-18 | 1991-03-18 | Electric power supplying structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04287398A true JPH04287398A (en) | 1992-10-12 |
Family
ID=12909913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5226491A Withdrawn JPH04287398A (en) | 1991-03-18 | 1991-03-18 | Electric power supplying structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04287398A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009170262A (en) * | 2008-01-16 | 2009-07-30 | Sony Corp | Power transmission device and functional module |
JP2014505200A (en) * | 2011-01-24 | 2014-02-27 | シングル・ブイ・ムアリングス・インコーポレイテッド | Connection from rigid electrode to elastic electrode |
-
1991
- 1991-03-18 JP JP5226491A patent/JPH04287398A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009170262A (en) * | 2008-01-16 | 2009-07-30 | Sony Corp | Power transmission device and functional module |
JP2014505200A (en) * | 2011-01-24 | 2014-02-27 | シングル・ブイ・ムアリングス・インコーポレイテッド | Connection from rigid electrode to elastic electrode |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2794136B2 (en) | Multilayer printed circuit board | |
US6018125A (en) | High frequency EMI shield with air flow for electronic device enclosure | |
US4560962A (en) | Multilayered printed circuit board with controlled 100 ohm impedance | |
US6629365B2 (en) | Method of providing environmental protection to an electronic enclosure | |
US3721746A (en) | Shielding techniques for r.f. circuitry | |
US4553111A (en) | Printed circuit board maximizing areas for component utilization | |
US5353192A (en) | Circuit card assembly | |
CN101192359B (en) | Plasma display device | |
US6814582B2 (en) | Rear interconnect blade for rack mounted systems | |
KR950004509A (en) | Multichip Cooling Modules and Methods | |
JPH0267794A (en) | Connection and shielding device | |
WO2007025440A1 (en) | A chassis | |
JPH04287398A (en) | Electric power supplying structure | |
EP0214296B1 (en) | Structure for mounting electronic devices | |
US20070253170A1 (en) | Airflow guides using silicon walls/creating channels for heat control | |
EP0195789B1 (en) | An electronic apparatus or component and a method of providing such an apparatus or component | |
CN100579342C (en) | Electronic device and housing | |
JPH04207098A (en) | Method for cooling printed-circuit board unit | |
US6401805B1 (en) | Integrated venting EMI shield and heatsink component for electronic equipment enclosures | |
JPH0864984A (en) | Low emi structure | |
EP0137694B1 (en) | Printed circuit board maximizing areas for component utilization | |
JPH0770854B2 (en) | Printed circuit board housing | |
JPH1093237A (en) | Electronic substrate | |
JPH11307986A (en) | Quasi-grounding method and apparatus | |
RU2013032C1 (en) | Subassembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |