JPH0428434U - - Google Patents
Info
- Publication number
- JPH0428434U JPH0428434U JP7031890U JP7031890U JPH0428434U JP H0428434 U JPH0428434 U JP H0428434U JP 7031890 U JP7031890 U JP 7031890U JP 7031890 U JP7031890 U JP 7031890U JP H0428434 U JPH0428434 U JP H0428434U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- tie bars
- leads
- lead
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031890U JPH0428434U (cs) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031890U JPH0428434U (cs) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428434U true JPH0428434U (cs) | 1992-03-06 |
Family
ID=31606378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7031890U Pending JPH0428434U (cs) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428434U (cs) |
-
1990
- 1990-06-29 JP JP7031890U patent/JPH0428434U/ja active Pending