JPH0426582U - - Google Patents
Info
- Publication number
- JPH0426582U JPH0426582U JP6728490U JP6728490U JPH0426582U JP H0426582 U JPH0426582 U JP H0426582U JP 6728490 U JP6728490 U JP 6728490U JP 6728490 U JP6728490 U JP 6728490U JP H0426582 U JPH0426582 U JP H0426582U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- heat dissipation
- heat dissipating
- soldering
- thinner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示した斜視図、第
２図は足の断面を示し、第３図は従来例を示す斜
視図。 １，３……放熱シヤーシ、２，４……足、５…
…穴。
２図は足の断面を示し、第３図は従来例を示す斜
視図。 １，３……放熱シヤーシ、２，４……足、５…
…穴。
Claims (1)
- 基板に搭載する放熱シヤーシにおいて、放熱シ
ヤーシと一体で構成された複数の半田付け足を、
前期放熱シヤーシの板厚より薄くしたことを特徴
とする放熱シヤーシ半田付け構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6728490U JPH0426582U (ja) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6728490U JPH0426582U (ja) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426582U true JPH0426582U (ja) | 1992-03-03 |
Family
ID=31600726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6728490U Pending JPH0426582U (ja) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426582U (ja) |
-
1990
- 1990-06-27 JP JP6728490U patent/JPH0426582U/ja active Pending