JPH0426545U - - Google Patents
Info
- Publication number
- JPH0426545U JPH0426545U JP1990067997U JP6799790U JPH0426545U JP H0426545 U JPH0426545 U JP H0426545U JP 1990067997 U JP1990067997 U JP 1990067997U JP 6799790 U JP6799790 U JP 6799790U JP H0426545 U JPH0426545 U JP H0426545U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- board
- holes
- circuit component
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/884—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067997U JPH0426545U (enExample) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067997U JPH0426545U (enExample) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426545U true JPH0426545U (enExample) | 1992-03-03 |
Family
ID=31602068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990067997U Pending JPH0426545U (enExample) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426545U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334948A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体パッケージ、半導体素子搭載用基板及びそれらの製造方法 |
| JP2002334949A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体パッケージ及び半導体素子搭載用基板の製造方法 |
| JP2002334951A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体素子搭載用基板及び半導体パッケージ |
-
1990
- 1990-06-27 JP JP1990067997U patent/JPH0426545U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002334948A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体パッケージ、半導体素子搭載用基板及びそれらの製造方法 |
| JP2002334949A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体パッケージ及び半導体素子搭載用基板の製造方法 |
| JP2002334951A (ja) * | 1994-03-18 | 2002-11-22 | Hitachi Chem Co Ltd | 半導体素子搭載用基板及び半導体パッケージ |