JPH04261419A - Heat-resistant resin composition - Google Patents

Abstract

PURPOSE:To obtain a composition excellent in heat resistance, melt fluidity and mechanical strength by blending a polyamide-imide resin with a polyphenylene sulfide resin and an isocyanate group-containing organic compound. CONSTITUTION:(A) A polyamide-imide resin having a main constituent unit shown by the formula (Ar is trifunctional aromatic group containing at least 6-membered ring of carbon; R is bifunctional aromatic group and/or aliphatic group; R1 is H, alkyl or phenyl) is blended in a molten state with (B) a polyphenylene sulfide resin and (C) an organic compound containing two or more isocyanate groups in the molecule.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention particularly relates to a resin composition having excellent heat resistance, melt flowability, and mechanical strength.

0002

[Prior Art] Polyamide-imide resin is a plastic material with excellent heat resistance, mechanical strength, electrical properties, and chemical resistance, but it has poor melt flowability and is difficult to injection mold, making it difficult to injection mold. Currently, molding is carried out using the method. On the other hand, polyphenylene sulfide resin is characterized by excellent heat resistance, electrical properties, and solvent resistance, and particularly excellent melt flowability, but it also has the drawback of being brittle. As a technique for improving the melt flowability of polyamide-imide resin, a technique of blending polyphenylene sulfide resin has already been proposed (Japanese Patent Publication No. 57-975
4). However, although this technique maintains the high heat resistance of the polyamide-imide resin, the mechanical strength is lost due to the brittleness of the polyphenylene sulfide resin. This tendency is observed regardless of the amount of polyphenylene sulfide resin used, but it becomes particularly noticeable when the amount exceeds 30% by weight, and the mechanical strength as a plastic material cannot be maintained. The above is the conventional technology, and for this reason, heat resistance, mechanical properties,
At present, a material with well-balanced fluidity has not yet been obtained.

0003

[Problems to be Solved by the Invention] The problem to be solved by the present invention is to improve the decrease in mechanical strength that occurs when polyphenylene sulfide resin is blended for the purpose of improving the melt flowability of polyamideimide resin. be. This is particularly an improvement in mechanical strength when 30% by weight or more of polyphenylene sulfide resin is mixed, which was not possible with conventional techniques. The present invention has made it possible to create a new material with a composition containing a large amount of polyphenylene sulfide resin, that is, a composition with excellent fluidity.

0004

[Means for Solving the Problems] That is, the object of the present invention is to (A) general formula (1),

[0005]

[Case 2]

(In the formula, Ar is a trivalent aromatic group containing at least one 6-membered carbon ring, R is a divalent aromatic and/or aliphatic group, and R1 is hydrogen, an alkyl group, or a phenyl group. ) A polyamideimide resin having a unit represented by (B) a polyphenylene sulfide resin as a main structural unit, and (C) a polyphenylene sulfide resin having two isocyanate groups in the molecule.
This was achieved using a resin composition obtained by melt-kneading organic compounds having at least 100% of organic compounds. The polyamide-imide resin that is the component (A) used in the resin composition of the present invention is:
It has 50 to 100 mol%, preferably 70 to 100 mol%, most preferably 100 mol% of the repeating unit represented by general formula (1) as the main structural unit, and less than 50 mol%, preferably as other structural units. is less than 30 mol%,
Most preferably, the polyamide having the general formula (2) and/or the polyimide precursor having the general formula (3) and/or the polyimide unit having the general formula (4) in an amount of 0 mol % below. It is a polymer that can be used as a polymer. [In the formula, Ar1 is a divalent aromatic group or aliphatic group containing at least one carbon 6-membered ring, Ar2 is a tetravalent aromatic group containing at least one carbon 6-membered ring, and R is a general It has the same meaning as formula (1). ]

[0007]

[Chemical formula 3]

[0008] Also included are structures in which a part of the imide bonds, preferably less than 50 mol%, more preferably less than 30 mol%, remain as amic acid bonds in the structure of general formula (1). . Specific examples of Ar in general formula (1) include the following.

[0009]

[C4]

Among these, the following are preferred.

[0011]

[C5]

Further, R is a divalent aromatic and/or aliphatic group, and specific examples thereof include the following.

[0013]

[C6]

[0014] Among these, the following are preferable:

[0015]

[C7]

[0016] Particularly preferred are the following.

[0017]

[Chemical formula 8]

The most preferred are the following.

[0019]

[Chemical formula 9]

Next, specific examples of Ar1 in general formula (2) include the following.

[0021]

[Chemical formula 10]

Further, specific examples of Ar2 in general formulas (3) and (4) include the following.

[0023]

[Chemical formula 11]

[0024] Each of the structural units represented by the general formulas (1), (2), (3), and (4) has at least one type corresponding to different Ar, Ar1, Ar2, and R in the polyamideimide resin. You can leave it there. That is, the polyamide-imide resin of the present invention can take the form of various copolymers. Polyamide-imide resin can be prepared by various known methods (Japanese Patent Publication No. 40-8910, Japanese Patent Publication No. 44-19274, Japanese Patent Publication No. 42-15637, Japanese Patent Publication No. 46-15513, Japanese Patent Publication No. 49-4077, Japanese Patent Publication No. 1973).
8-180532, Special Publication No. 50-33120, Special Publication No. 4
The polyamide-imide resin of the present invention may be produced by any method. For example, one or more aromatic tricarboxylic acid anhydride monochlorides,

[0025]

[Chemical formula 12]

and one or more diamines,

00
27]

[Chemical formula 13]

and optionally dicarboxylic acid dichloride,

[0029]

[Chemical formula 14]

Aromatic tetracarboxylic acid anhydride,

003
1]

[Chemical formula 15]

may be reacted in a polar solvent such as N-methylpyrrolidone, dimethylformamide, dimethylacetamide, or cresol in the presence or absence of a hydrogen chloride acceptor such as triethylamine, or similarly with triethylamine, sodium hydroxide. It can be obtained by reacting a non-basic organic solvent that is partially miscible with water, such as acetone, methyl ethyl ketone, tetrahydrofuran, dioxane, etc., in a mixed solvent of water in the presence of a hydrogen chloride acceptor such as , aromatic tricarboxylic acid anhydride,

[0033]

[Chemical formula 16]

and one or more diisocyanates,

[0035]

[Chemical formula 17]

[0036] and optionally dicarboxylic acid,

00
37]

[Chemical formula 18]

[0038] The aromatic tetracarboxylic acid anhydride can also be obtained by reacting in the above polar solvent such as N-methylpyrrolidone or in the absence of a solvent. In this method, diamine is used as a dehydration catalyst instead of diisocyanate. It can also be obtained by so-called direct polymerization methods, used in the presence or absence. Further, if necessary, heat treatment can be applied to these in order to convert the amic acid structure into an imide ring. Next, the polyphenylene sulfide resin which is the component (B) used in the resin composition of the present invention is:
general formula,

[0039]

[Chemical formula 19]

It is a polymer containing 79 mol % or more, more preferably 90 mol % or more of the repeating unit represented by the following formula. If the repeating unit is less than 70 mol %, it is difficult to obtain a composition having specific properties. Various known methods can be used to obtain this polymer, but sodium sulfide and p
A preferred method is to react with -dichlorobenzene in an amide solvent such as N-methylpyrrolidone or dimethylacetamide or a sulfone solvent such as sulfolane. At this time, it is a preferable method to add an alkali metal carboxylate such as sodium acetate or lithium acetate in order to adjust the degree of polymerization. Meta bonds, within the range of less than 30 mol% as a copolymerization component and do not significantly affect the crystallinity of the polymer.

[0041]

[C20]

[0042] Ether bond,

[0043]

[C21]

[0044] Sulfone bond,

[0045]

[C22]

Biphenyl bond,

[0047]

[C23]

[0048] Amino group-substituted phenyl sulfide bond,

[
0049

[C24]

Carboxyl group-substituted phenyl sulfide bond,

[0051]

[C25]

[0052]Although it may contain other alkyl, nitro, phenyl, alkoxy group-substituted phenyl sulfide bonds, trifunctional phenyl sulfide bonds, etc., the copolymerization component is preferably less than 10 mol%. Furthermore, polyphenylene sulfide resins in which the SH terminal group concentration is adjusted are also included in the present invention. Depending on the composition of the composition, kneading conditions, etc., a polyphenylene sulfide resin having an SH terminal group concentration of 10 mg equivalent or more per 1 kg of resin may give preferable results, and a polyphenylene sulfide resin having an SH terminal group concentration of 10 mg equivalent or more may give more preferable results. Various methods can be used to introduce the SH group, but there are no particular limitations.For example, the final step of polyphenylene sulfide resin production may be treated with hydrochloric acid or acetic acid, or the purified polyphenylene sulfide resin is treated with hydrochloric acid or acetic acid. SH groups can be easily introduced at the terminals by treatment with a solution such as acetone or the like.

Furthermore, the organic compound having at least two or more isocyanate groups in the molecule, which is component (C) used in the resin composition of the present invention, refers to a compound in which two or more isocyanate groups are bonded to an aromatic or aliphatic group. A general term for compounds that Specific examples of these compounds include:
2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,4-naphthalene diisocyanate, 1,5-naphthalene diisocyanate, 2,6-naphthalene diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate ,4
, 4'-diphenylmethane diisocyanate, 2,2'
-dimethyldiphenylmethane-4,4'-diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'
-diisocyanate, 4,4'-biphenyl diisocyanate, 2,4'-biphenyl diisocyanate, 3,
3'-dimethylbiphenyl-4,4'-diisocyanate, 4,4'-diphenyl ether diisocyanate,
Aromatic polyisocyanates such as 4,4'-diphenylsulfone diisocyanate and triphenylmethane triisocyanate; hexamethylene diisocyanate, 2
, 4,4-trimethylhexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, xylylene diisocyanate, bis(isocyanatemethyl)cyclohexane, 3-isocyanatemethyl-3,5 , aliphatic polyisocyanates such as 5-trimethylcyclohexyl isocyanate; the above-mentioned thioisocyanates; polyhydric alcohol adducts, water adducts, amine adducts, and isocyanurate modified products of the above-mentioned aromatic or aliphatic polyisocyanates. Can be done. Among these, aromatic diisocyanates are preferred, including 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate.
-tolylene diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate,
4,4'-diphenylmethane diisocyanate, 4,4
'-Biphenyl diisocyanate and 4,4'-diphenyl ether diisocyanate, and more preferred are 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, and 4,4'-diphenylmethane diisocyanate. Furthermore, in the present invention, one or more of the organic compounds of component (C) may be used in combination.

Next, components (A), (
The blending amounts of B) and (C) are 5 to 95% by weight of the polyamideimide resin as the component (A), preferably 20 to 70% by weight, more preferably 20 to 65% by weight, and the polyphenylene sulfide as the component (B). Component (C) is an organic compound having at least two isocyanate groups in its molecule, based on 100 parts by weight of the composition containing 5 to 95% by weight of resin, preferably 30 to 80% by weight, more preferably 35 to 80% by weight. 0.01 to 20 parts by weight of the compound, preferably 0.01
~10 parts by weight, more preferably 0.01 to 5 parts by weight. If the amount of component (A) is more than this amount, the fluidity will be decreased, and if it is less than this amount, the mechanical properties will be decreased. If the amount of component (C) is more than this amount, the fluidity will decrease, and if it is less than this amount, the effect of improving mechanical properties will be small.

[0055] The method of blending each component constituting the resin composition of the present invention is not particularly limited, but for example, a method of blending each component at once and melt-kneading. A method in which polyamide-imide resin and polyphenylene sulfide resin are melt-kneaded in advance, and then component (C) is added and kneaded again. Examples include a method in which polyphenylene sulfide resin and component (C) are melt-kneaded, then a polyamide-imide resin is blended and kneaded again. The resin composition of the present invention is produced by melt-kneading each component, and the temperature of melt-kneading is 250-400 ml.
The kneading process can be carried out at 00°C, preferably from 300 to 380°C, using an extruder, kneader, Banbury mixer, roll or the like.

The resin composition of the present invention may optionally contain other resins; elastomers; various additives such as flame retardants, flame retardant aids, stabilizers, ultraviolet absorbers, and plasticizers; pigments, and fillers. Other ingredients may be added as appropriate. Examples of other resins mentioned above include aliphatic and aromatic polyamides, aliphatic and aromatic polyesters, liquid crystal polymers, polycarbonates,
Examples include polysulfone, polyethersulfone, polyetherimide, polyetherketone, and polyetheretherketone.

Examples of elastomers include polysulfide rubber, polyester elastomer, polyamide elastomer, polyesteramide elastomer, and silicone rubber.

Examples of various additives include flame retardants such as phosphoric acid esters such as triphenyl phosphate and tricresyl phosphate; decabromo biphenyl, pentabromotoluene, decabromo biphenyl ether, Examples include brominated compounds such as hexabromobenzene and brominated polystyrene; nitrogen-containing compounds such as melamine derivatives; nitrogen-containing phosphorus compounds such as cyclic phosphazene compounds and phosphazene polymers. Flame retardant aids may be used, examples include antimony, boron, zinc or iron compounds. Further, other additives include stabilizers such as sterically hindered phenols and phosphite compounds; ultraviolet absorbers such as oxalate diamide compounds and sterically hindered amine compounds.

Furthermore, pigments such as titanium oxide, zinc sulfide, and zinc oxide; glass beads, wollastonite, mica, talc, clay, asbestos, charcoal, magnesium hydroxide, silica, diatomaceous earth, graphite, Carborundum, mineral filler represented by molybdenum disulfide; glass fiber, milled fiber, boron fiber,
Examples include inorganic fibers such as silicon carbide fibers, metal fibers such as brass, aluminum, and zinc; organic fibers such as carbon fibers and aramid fibers; and aluminum and zinc flakes. The filler is preferably used in an amount of 1 to 50% by weight of the total composition.

[0060] The preferred filler has an average particle size of 4.5 to 50μ.
m glass beads; average length 1.5-50 mm, average diameter 6-20 μm glass fibers; average length 30-300 μm
For example, milled fibers may be used, and a mixture of these fillers may also be used.

[0061]

[Effects of the Invention] The resin composition of the present invention has excellent heat resistance, melt flowability, and mechanical strength. This is thought to be because the sulfide resin was copolymerized by the chemical action of the compound (C).

[0062]

[Examples] The resin composition of the present invention will be explained in more detail with reference to Examples, Reference Examples, and Comparative Examples.

Reference Example 1 (Manufacture of polyamideimide resin) 432.6 g of metaphenylene diamine and 445.3 g of tritylamine were dissolved in a mixed solvent of 12.8 liters of acetone and 5.4 liters of water, and this was poured into a 50 liter agitator. A solution prepared by dissolving 842.0 g of trimellitic anhydride monochloride in 5.2 liters of acetone was added at once to the reactor with vigorous stirring, and stirring was continued for 20 minutes to carry out polymerization. After completion of the polymerization, the precipitated polymer was filtered off under suction, further dispersed in methanol, thoroughly washed, separated, and dried under reduced pressure at 50° C. to obtain a polyamide-imide resin precursor. The reduced viscosity of this product at 30°C was measured with a dimethylformamide solution (concentration 1.0 g/dl) and found to be 0.3.
It was 2 dl/g. Furthermore, this precursor was heated at 150°C for 1
A polyamide-imide resin was produced by heat-treating for 5 hours. The proportion of amide bonds and imide bonds was determined by infrared method using the absorption of imide groups at 1780 (1/cm) and amide groups at 1525 (1/cm) and found to be approximately 50 mol%.
was an imide ring structure.

Reference Example 2 (Production of polyamideimide resin) Reference Example 1 was repeated except that 432.6 g of metaphenylene diamine was replaced with 793.1 g of 4,4'-diaminodiphenylmethane. The reduced viscosity of the obtained precursor was 0.39 dl/g, and the proportion of imide ring structure measured by infrared method after heat treatment was about 5.
It was 0 mol%.

Reference Example 3 (Manufacture of polyamideimide resin) 750.8 g of 4,4'-diphenylmethane diisocyanate and 2.5 liters of dimethylacetamide were mixed in a stirrer, a nitrogen gas introduction pipe,
The mixture was charged into a reactor equipped with a thermometer and a condenser, and 576.4 g of trimellitic anhydride dissolved in 2 liters of dimethylacetamide was added thereto. The mixture was reacted at 125-135°C for 3 hours, and acetone was used as a non-solvent to form polyamide-imide. The resin was prepared through precipitation, filtration, and drying steps. The reduced viscosity was 0.42 dl/g.

Reference Example 4 (Production of polyamideimide resin) 432.6 g of meta-phenylene diamine was mixed with 488.7 g of meta-tolylene diamine.
Reference Example 1 was repeated except for changing. The reduced viscosity of the obtained precursor was 0.34 dl/g, and the proportion of imide ring structure measured by an infrared method after heat treatment was about 50 mol%.

Reference Example 5 (Manufacture of polyamideimide resin) Reference Example 3 was repeated except that 750.8 g of 4,4'-diphenylmethane diisocyanate was replaced with 522.5 g of tolylene diisocyanate. The reduced viscosity was 0.32 dl/g.

Reference Example 6 (Production of polyamideimide resin) 432.6 g of meta-phenylene diamine was mixed with 216.3 g of meta-phenylene diamine.
Reference Example 1 was repeated except that the mixture was changed to a mixture of and 396.5 g of diaminodiphenylmethane. The reduced viscosity of the obtained precursor was 0.36 dl/g, and the proportion of imide ring structure was about 50 mol % as measured by an infrared method after heat treatment.

Reference Example 7 (Production of polyamideimide resin) 108.1 g of metaphenylene diamine and 384.3 g of trimellitic anhydride
2.5 liters of dimethylacetamide stirrer,
The mixture was charged into a reactor equipped with a nitrogen inlet tube, a thermometer, and a condenser, and reacted under reflux for 3 hours. After cooling 4,4'-
250.3 g of diphenylmethane diisocyanate was added and reacted at 135°C for 3 hours. A polyamideimide resin was produced by processing in the same manner as in the reference example. Reduced viscosity is 0.45
It was dl/g.

Reference Example 8 (Manufacture of polyamideimide resin) Using a mixture of 480.6 g of 4,4'-diaminodiphenyl ether and 173.0 g of metaphenylene diamine as the diamine component, 505.2 g of trimellitic anhydride monochloride and isophthalic acid Reference Example 1 was repeated using a mixture of 324.8 g of dichloride as the acid component. The reduced viscosity of the obtained precursor was 0.35 dl/g, and the proportion of imide ring structure measured by an infrared method after heat treatment was about 30 mol%.

Reference Example 9 (Manufacture of polyamide-imide resin) 480.6 g of 4,4'-diaminodiphenyl ether, 173.0 g of metaphenylenediamine and 5 liters of dimethylacetamide were placed in a reactor equipped with a stirrer, a nitrogen inlet tube and a thermometer. 842g of trimellitic anhydride mochloride
was gradually added, and the reaction was then allowed to stand for about 15 hours to complete the reaction. A polymer was produced in the same manner as in Reference Example 1 using acetone as a nonsolvent. The reduced viscosity of the obtained precursor was 0.30 d.
It was l/g. After the heat treatment, the proportion of imide ring structure measured by an infrared method was about 50 mol%.

Examples 1 to 3 Polyamideimide resin and polyphenylene sulfide resin produced in Reference Example 1 (manufactured by Topren Co., Ltd., trade name T)
-4) were blended with the composition shown in Table 1, and then melted and kneaded at 360°C using a twin-screw extruder to form pellets. 4,4'-diphenylmethane diisocyanate was blended into the pellets in the amount shown in Table 1, and again using a twin-screw extruder,
A resin composition was prepared by melt-kneading and pelletizing at 0°C. This pellet was injection molded to obtain a 1/8 inch thick dumbbell test piece and a 1/8 inch thick bending test piece. The tensile strength and elastic modulus were determined from the dumbbell test piece, the heat distortion temperature (18.6Kg) was determined from the bending test piece, and the 350
Melt flow values were measured at 60 Kg stress at °C. These results are shown in Table 1.

Comparative Examples 1 to 3 Example 1 except that 4,4'-diphenylmethane diisocyanate was not used during re-extrusion in Examples 1 to 3.
- Repeated steps 3. The results are shown in Tables 1 and 2.

Examples 4 to 6 Examples 1 to 3 were repeated except that the polyamideimide resin of Reference Example 1 was changed to the polyamideimide resin of Reference Example 2. The results are shown in Table 2.

Comparative Examples 4 to 6 Comparative Examples 1 to 3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 2. The results are shown in Tables 2 and 3.

Example 7 Examples 1 to 3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 3. The results are shown in Table 4.

Comparative Example 7 Comparative Examples 1 to 3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 3. The results are shown in Table 4.

Examples 8-9 Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 4. The results are shown in Table 4.

Example 10 Example 1 except that the polyamideimide resin of Reference Example 1 was changed to the polyamideimide resin of Reference Example 4, and diphenylmethane diisocyanate was changed to toluylene diisocyanate.
- Repeated steps 3. The results are shown in Table 4.

Comparative Examples 8-9 Comparative Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 4. The results are shown in Table 5.

Example 11 Examples 1 to 3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 5. The results are shown in Table 5.

Example 12 Example 1 except that the polyamideimide resin of Reference Example 1 was changed to the polyamideimide resin of Reference Example 5, and diphenylmethane diisocyanate was changed to toluylene diisocyanate.
- Repeated steps 3. The results are shown in Table 5.

Comparative Example 10 Comparative Examples 1 to 3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 5. The results are shown in Table 5.

Examples 13-14 Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 6. The results are shown in Table 6.

Comparative Examples 11-12 Comparative Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin precursor of Reference Example 6. The results are shown in Table 6.

Examples 15-16 Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 7. The results are shown in Table 7.

Comparative Examples 13-14 Comparative Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 7. The results are shown in Table 7.

Examples 17-18 Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 8. The results are shown in Table 8.

Comparative Examples 15-16 Comparative Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 8. The results are shown in Table 8.

Examples 19-20 Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 9. The results are shown in Table 9.

Comparative Examples 17-18 Comparative Examples 1-3 were repeated except that the polyamide-imide resin of Reference Example 1 was changed to the polyamide-imide resin of Reference Example 9. The results are shown in Table 9.

[0092]

[Table 1]

[0093]

[Table 2]

[0094]

[Table 3]

[0095]

[Table 4]

[0096]

[Table 5]

[0097]

[Table 6]

[0098]

[Table 7]

0099

[Table 8]

[0100]

[Table 9]

Claims (1)

[Claims] Claim 1: (A) General formula (1), [Formula 1] (wherein Ar is a trivalent aromatic group containing at least one carbon 6-membered ring, R is a divalent aromatic and/or aliphatic group) family group,
R1 represents hydrogen, an alkyl group or a phenyl group. ) obtained by melt-kneading each component of a polyamideimide resin having the unit represented by (B) as a main structural unit, (B) a polyphenylene sulfide resin, and (C) an organic compound having two or more isocyanate groups in the molecule. Resin composition.