JPH042600U - - Google Patents
Info
- Publication number
- JPH042600U JPH042600U JP1990042116U JP4211690U JPH042600U JP H042600 U JPH042600 U JP H042600U JP 1990042116 U JP1990042116 U JP 1990042116U JP 4211690 U JP4211690 U JP 4211690U JP H042600 U JPH042600 U JP H042600U
- Authority
- JP
- Japan
- Prior art keywords
- dividing
- belt
- substrate
- strip
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図および第２図は本考案の一実施例におけ
る短冊状割溝付基板の分割装置を示し、第１図は
全体の概略側面図、第２図はその分割動作説明用
の要部の拡大図、第３図および第４図は従来例に
おける短冊状割溝付基板の分割装置を示し、第３
図は概略側面図、第４図Ａは一素子が比較的大き
い場合の分割動作説明用の要部の拡大図、第４図
Ｂは一素子が小さい場合の分割動作説明用の要部
の拡大図、第５図Ａはセラミツクス製割溝付基板
の斜視図、第５図Ｂは上記セラミツクス製割溝付
基板から形成した短冊状割溝付基板の斜視図、第
５図Ｃは上記短冊状割溝付基板の両側長辺縁に銀
塗料を塗装した状態の斜視図、第５図Ｄは上記塗
装後の短冊状割溝付基板を一素子に分割した状態
の斜視図である。
２……受け用ローラ、３……分割用補助ローラ
、５……駆動用ローラ、７……ベルト、１０……
分割用ローラ、１２……調整ねじ、１５……テン
シヨン用ローラ、１７……調整ねじ、ａ１……短
冊状割溝付基板、ｂ２……割溝、ａ２……素子。
1 and 2 show a device for dividing a rectangular grooved substrate according to an embodiment of the present invention, FIG. 1 is a schematic side view of the whole, and FIG. 2 is a main part of the device for explaining the dividing operation. The enlarged view, FIG. 3, and FIG.
The figure is a schematic side view, Figure 4A is an enlarged view of the main part to explain the division operation when one element is relatively large, and Figure 4B is an enlarged view of the main part to explain the division operation when one element is small. Figure 5A is a perspective view of the ceramic grooved substrate, Figure 5B is a perspective view of the strip-shaped grooved substrate formed from the ceramic grooved substrate, and Figure 5C is the strip-shaped grooved substrate. FIG. 5D is a perspective view of the substrate with grooves coated with silver paint on both long edges thereof, and FIG. 2...Receiving roller, 3...Auxiliary roller for division, 5...Driving roller, 7...Belt, 10...
Division roller, 12...adjustment screw, 15...tension roller, 17...adjustment screw, a1 ...substrate with strip-shaped dividing grooves, b2 ...dividing groove, a2 ...element.
Claims (1)
ローラと、この受け用ローラに対して短冊状割溝
付基板を搬送すると共に、この短冊状割溝付基板
を割溝を沿つて分割するための可撓性を有するベ
ルトと、このベルトにより搬送される上記短冊状
割溝付基板を上記ベルトに押圧して割溝に沿つて
分割するための小径の分割用ローラと、この分割
用ローラの上記ベルトおよび受けローラに対する
押圧力を調整する調整手段と、上記短冊状割溝付
基板が上記分割用ローラの中心に対して所望の分
割可能角度範囲で沿うように上記ベルトの走行を
案内する分割用補助ローラと、上記ベルトを走行
させる走行手段とを備えた短冊状割溝付基板の分
割装置。 (2) 分割可能角度範囲が１０°〜４５°である
請求項１記載の短冊状割溝付基板の分割装置。[Claims for Utility Model Registration] (1) A receiving roller that is supported so as to be able to rotate freely, and a substrate with strip-shaped grooves is conveyed to the receiving roller, and the substrate with the strip-shaped grooves is A flexible belt for dividing the substrate along the grooves, and a small-diameter belt for pressing the strip-shaped grooved substrate conveyed by the belt against the belt and dividing it along the grooves. a dividing roller, an adjusting means for adjusting the pressing force of the dividing roller against the belt and the receiving roller, and a substrate with grooves arranged in a strip shape along the center of the dividing roller in a desired dividing angle range. A device for dividing a substrate with grooves in the form of a strip, comprising: an auxiliary dividing roller for guiding the traveling of the belt; and a traveling means for causing the belt to travel. (2) The device for dividing a strip-shaped grooved substrate according to claim 1, wherein the dividing angle range is 10° to 45°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990042116U JPH0714000Y2 (en) | 1990-04-21 | 1990-04-21 | Substrate splitting device with rectangular slits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990042116U JPH0714000Y2 (en) | 1990-04-21 | 1990-04-21 | Substrate splitting device with rectangular slits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH042600U true JPH042600U (en) | 1992-01-10 |
| JPH0714000Y2 JPH0714000Y2 (en) | 1995-04-05 |
Family
ID=31553374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990042116U Expired - Lifetime JPH0714000Y2 (en) | 1990-04-21 | 1990-04-21 | Substrate splitting device with rectangular slits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0714000Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657599U (en) * | 1993-01-14 | 1994-08-09 | 正和産業株式会社 | Substrate splitting device with rectangular slits |
| JP2000223360A (en) * | 1999-01-28 | 2000-08-11 | Tdk Corp | Manufacture of laminated ceramic chip component and device |
| JP2008085176A (en) * | 2006-09-28 | 2008-04-10 | Tdk Corp | Chip component separation apparatus |
| JP2014053518A (en) * | 2012-09-10 | 2014-03-20 | Murata Mfg Co Ltd | Small-piece shaped article peeling method and small-piece shaped article peeling device |
-
1990
- 1990-04-21 JP JP1990042116U patent/JPH0714000Y2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657599U (en) * | 1993-01-14 | 1994-08-09 | 正和産業株式会社 | Substrate splitting device with rectangular slits |
| JP2000223360A (en) * | 1999-01-28 | 2000-08-11 | Tdk Corp | Manufacture of laminated ceramic chip component and device |
| JP2008085176A (en) * | 2006-09-28 | 2008-04-10 | Tdk Corp | Chip component separation apparatus |
| JP2014053518A (en) * | 2012-09-10 | 2014-03-20 | Murata Mfg Co Ltd | Small-piece shaped article peeling method and small-piece shaped article peeling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0714000Y2 (en) | 1995-04-05 |
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