JPH0425246U - - Google Patents

Info

Publication number

JPH0425246U

JPH0425246U JP6665690U JP6665690U JPH0425246U JP H0425246 U JPH0425246 U JP H0425246U JP 6665690 U JP6665690 U JP 6665690U JP 6665690 U JP6665690 U JP 6665690U JP H0425246 U JPH0425246 U JP H0425246U

Authority

JP

Japan

Prior art keywords

resin

sealed

semiconductor device

dummy

sealing

Prior art date

1990-06-22

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 6
• 229920005989 resin Polymers 0.000 claims description 6
• 238000007789 sealing Methods 0.000 claims description 3
• 239000004065 semiconductor Substances 0.000 claims 4
• 238000005498 polishing Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 238000002347 injection Methods 0.000 description 1
• 239000007924 injection Substances 0.000 description 1