JPH0425238U - - Google Patents
Info
- Publication number
- JPH0425238U JPH0425238U JP6777190U JP6777190U JPH0425238U JP H0425238 U JPH0425238 U JP H0425238U JP 6777190 U JP6777190 U JP 6777190U JP 6777190 U JP6777190 U JP 6777190U JP H0425238 U JPH0425238 U JP H0425238U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- hole
- type semiconductor
- inner lead
- tab type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6777190U JPH0425238U ( ) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6777190U JPH0425238U ( ) | 1990-06-25 | 1990-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0425238U true JPH0425238U ( ) | 1992-02-28 |
Family
ID=31601644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6777190U Pending JPH0425238U ( ) | 1990-06-25 | 1990-06-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0425238U ( ) |
-
1990
- 1990-06-25 JP JP6777190U patent/JPH0425238U/ja active Pending