JPH04251691A - Fine particle for soldering, cream solder formed by using this fine particle and production of this cream solder - Google Patents
Fine particle for soldering, cream solder formed by using this fine particle and production of this cream solderInfo
- Publication number
- JPH04251691A JPH04251691A JP747691A JP747691A JPH04251691A JP H04251691 A JPH04251691 A JP H04251691A JP 747691 A JP747691 A JP 747691A JP 747691 A JP747691 A JP 747691A JP H04251691 A JPH04251691 A JP H04251691A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- particles
- cream solder
- flux
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 54
- 239000006071 cream Substances 0.000 title claims abstract description 22
- 239000010419 fine particle Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005476 soldering Methods 0.000 title claims description 7
- 230000004907 flux Effects 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 239000011230 binding agent Substances 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 238000004898 kneading Methods 0.000 claims abstract 2
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 2
- 238000001035 drying Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 24
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000006023 eutectic alloy Substances 0.000 abstract description 2
- 229910000743 fusible alloy Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】 本発明は、半田付け用微粒子、
その微粒子を用いたクリーム半田およびそのクリーム半
田の製造方法に関する。[Industrial Application Field] The present invention provides soldering fine particles,
The present invention relates to a cream solder using the fine particles and a method for producing the cream solder.
【０００２】0002
【従来の技術】 図２は従来のクリーム半田の構成を示
しており、１は半田粒子であり、２はフラックス、３は
粘結剤と溶剤である。BACKGROUND ART FIG. 2 shows the structure of a conventional cream solder, in which 1 is a solder particle, 2 is a flux, and 3 is a binder and a solvent.
【０００３】次にその作製について説明する。すず，鉛
の金属を共晶合金になるように配合し、これを加熱溶融
させ、窒素ガス等の不活性ガスを用い細いノズルにより
噴霧して、半田粒子１を作り、これにフラックス２とペ
ーストとしての性質を出すため粘結剤と溶剤３を加え混
練しクリーム半田を作る。これをメタル版を用いたスク
リーン印刷法や、ディスペンサーを用い、ガラスエポキ
シ基板等の実装基板の電極ランド上に塗布し、この上に
表面実装電子部品をのせ、この後リフローし、実装して
いた。[0003] Next, its production will be explained. Metals such as tin and lead are mixed to form a eutectic alloy, heated and melted, and sprayed with a thin nozzle using an inert gas such as nitrogen gas to create solder particles 1, which are then mixed with flux 2 and paste. In order to obtain the desired properties, a binder and solvent 3 are added and kneaded to make cream solder. This was applied to the electrode land of a mounting board such as a glass epoxy board using a screen printing method using a metal plate or a dispenser, and surface mount electronic components were placed on top of this, followed by reflow and mounting. .
【０００４】0004
【発明が解決しようとする課題】しかしながら上記の従
来の構成では、各半田粒子の全ての表面がフラックス２
で被覆されていないので、その被覆されていない半田粒
子表面が酸化しやすく、このためリフロー時、酸素がガ
スになって噴出し、半田粒子をはじき飛ばし、いわゆる
半田ボールを形成し、電極ランド間のショートを起こす
原因となっていた。さらに酸化が進むとリフロー時、酸
化膜が除去できず、すなわち半田が融けなくなることが
起こりクリーム半田の使用寿命が短いという欠点を有し
ていた。[Problems to be Solved by the Invention] However, in the above conventional configuration, all the surfaces of each solder particle are exposed to flux 2.
Since the surface of the solder particles is not coated, the uncovered solder particle surfaces are easily oxidized. Therefore, during reflow, oxygen is ejected as a gas, repelling the solder particles and forming so-called solder balls, which cause the gaps between the electrode lands to oxidize. This caused a short circuit. If the oxidation progresses further, the oxide film cannot be removed during reflow, ie, the solder cannot be melted, resulting in a disadvantage that the service life of the cream solder is short.
【０００５】本発明は上記課題を解決するもので、リフ
ロー時の半田ボールの発生を防ぎ、酸化防止による使用
寿命の増加と半田濡れ性の向上を図った半田付け用微粒
子、その微粒子を用いたクリーム半田およびそのクリー
ム半田の製造方法を提供することを目的としている。[0005] The present invention solves the above-mentioned problems, and uses fine particles for soldering which prevents the generation of solder balls during reflow, increases service life by preventing oxidation, and improves solder wettability. The object of the present invention is to provide cream solder and a method for producing the cream solder.
【０００６】[0006]
【課題を解決するための手段】本発明は上記目的を達成
するために、易融金属微粒子からなる各半田粒子の全表
面に均一にフラックスをコートしたものである。[Means for Solving the Problems] In order to achieve the above object, the present invention is such that the entire surface of each solder particle made of fine particles of easily meltable metal is uniformly coated with flux.
【０００７】[0007]
【作用】この構成によって、各半田粒子の全表面にフラ
ックスをコートしているので、各半田粒子の酸化が防止
される。[Operation] With this structure, the entire surface of each solder particle is coated with flux, so that oxidation of each solder particle is prevented.
【０００８】[0008]
【実施例】図１は本発明の一実施例のクリーム半田の構
成を示すものであり、１１は半田粒子、１２はフラック
ス、１３は粘結剤と溶剤である。次に上記のような構成
にするための作製法について説明する。すずと鉛からな
る金属を共晶半田成分になるように配合し加熱溶融し、
アトマイザー法等で半田粒子１１を作製し、これをロジ
ンやコハク酸等の有機酸系のフラックス１２を薄めた液
中に浸し、これを取り出し乾燥する。この後クリーム半
田としての適性を持たすための粘結剤と溶剤１３を加え
、混練し、クリーム半田を作る。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the composition of a cream solder according to an embodiment of the present invention, in which 11 is a solder particle, 12 is a flux, and 13 is a binder and a solvent. Next, a manufacturing method for obtaining the above structure will be explained. Metals consisting of tin and lead are mixed together to form a eutectic solder component and heated and melted.
Solder particles 11 are produced by an atomizer method or the like, immersed in a diluted organic acid flux 12 such as rosin or succinic acid, and taken out and dried. Thereafter, a binder and solvent 13 are added to make the solder suitable for cream solder, and the mixture is kneaded to form cream solder.
【０００９】このように上記実施例によれば、各半田粒
子１１の全表面に薄く均一なフラックス１２をコートす
ることにより半田粒子１１の表面の酸化が防止でき、リ
フロー時の酸素ガス噴出による半田ボール発生防止と、
酸化防止によるクリーム半田の使用寿命の増加ができる
効果がある。As described above, according to the above embodiment, by coating the entire surface of each solder particle 11 with a thin and uniform flux 12, oxidation of the surface of the solder particle 11 can be prevented, and the soldering caused by the oxygen gas jet during reflow can be prevented. Prevention of ball occurrence,
It has the effect of increasing the service life of cream solder by preventing oxidation.
【００１０】0010
【発明の効果】以上の実施例より明らかなように本発明
によれば、半田粒子のそれぞれの全表面に均一にフラッ
クスをコートすることにより半田粒子表面の酸化を防止
することができ、リフロー時の半田ボール発生を防ぎ、
酸化防止によりクリーム半田の使用寿命の増加ができ、
半田の濡れ性の向上を図った半田付け用微粒子、その微
粒子を用いたクリーム半田およびそのクリーム半田の製
造方法を提供できる。Effects of the Invention As is clear from the above examples, according to the present invention, oxidation of the solder particle surface can be prevented by uniformly coating the entire surface of each solder particle. Prevents the generation of solder balls,
By preventing oxidation, the service life of cream solder can be increased.
It is possible to provide soldering fine particles with improved solder wettability, cream solder using the fine particles, and a method for producing the cream solder.
【図１】本発明の一実施例の半田付け用微粒子およびそ
の微粒子を用いたクリーム半田の拡大断面図FIG. 1 is an enlarged cross-sectional view of soldering fine particles according to one embodiment of the present invention and cream solder using the fine particles.
【図２】従
来のクリーム半田の拡大断面図[Figure 2] Enlarged cross-sectional view of conventional cream solder
１１ 半田粒子（易融金属微粒子） １２ フラックス １３ 粘結剤と溶剤 11 Solder particles (easily melted metal particles) 12 Flux 13. Binder and solvent
Claims (3)
覆してなる半田付け用微粒子。1. Fine particles for soldering comprising easily meltable metal particles coated with an organic acid flux.
融金属微粒子を粘結剤と溶剤で混練したクリーム半田。2. A cream solder in which fine melting metal particles whose entire surface is coated with an organic acid flux are kneaded with a binder and a solvent.
に浸漬する工程と、そのフラックスの液を表面に被覆し
た前記易融金属微粒子を乾燥する工程と、その乾燥した
易融金属微粒子に粘結剤と溶剤を加えて混練する工程と
を少なくとも有するクリーム半田の製造方法。3. A step of immersing the easily meltable metal fine particles in an organic acid flux liquid, a step of drying the easily meltable metal fine particles whose surfaces are coated with the flux liquid, and a step of immersing the easily meltable metal fine particles on the surface thereof. A method for producing cream solder, comprising at least a step of adding and kneading a binder and a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP747691A JPH04251691A (en) | 1991-01-25 | 1991-01-25 | Fine particle for soldering, cream solder formed by using this fine particle and production of this cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP747691A JPH04251691A (en) | 1991-01-25 | 1991-01-25 | Fine particle for soldering, cream solder formed by using this fine particle and production of this cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04251691A true JPH04251691A (en) | 1992-09-08 |
Family
ID=11666831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP747691A Pending JPH04251691A (en) | 1991-01-25 | 1991-01-25 | Fine particle for soldering, cream solder formed by using this fine particle and production of this cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04251691A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0901863A2 (en) * | 1997-09-09 | 1999-03-17 | BG Metallwek Goslar GmbH & Co. KG | Braze |
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
| JP5943136B1 (en) * | 2015-12-28 | 2016-06-29 | 千住金属工業株式会社 | Flux-coated ball, solder joint, and method for producing flux-coated ball |
-
1991
- 1991-01-25 JP JP747691A patent/JPH04251691A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0901863A2 (en) * | 1997-09-09 | 1999-03-17 | BG Metallwek Goslar GmbH & Co. KG | Braze |
| EP0901863A3 (en) * | 1997-09-09 | 1999-07-21 | BG Metallwek Goslar GmbH & Co. KG | Braze |
| US6881278B2 (en) | 1998-06-10 | 2005-04-19 | Showa Denko K.K. | Flux for solder paste |
| JP5943136B1 (en) * | 2015-12-28 | 2016-06-29 | 千住金属工業株式会社 | Flux-coated ball, solder joint, and method for producing flux-coated ball |
| JP2017119291A (en) * | 2015-12-28 | 2017-07-06 | 千住金属工業株式会社 | Flux coat ball, solder joint and manufacturing method for flux coat ball |
| TWI615231B (en) * | 2015-12-28 | 2018-02-21 | 千住金屬工業股份有限公司 | Flux coated ball and flux coated ball manufacturing method |
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