JPH0424616B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an improvement in a heat pump device, and is intended to achieve capacity adjustment quickly and with energy savings.

Conventional structure and its problems Conventionally, as one of the methods for adjusting the capacity of a heat pump device, the concentration of the refrigerant circulating in the mixed refrigerant sealed in the heat pump device is varied, mainly by changing the gas specific volume of the refrigerant. A capacity adjustment method using the difference in circulation volume was proposed. However, the conventionally proposed method uses a rectifier using an electric heater as a means of varying the concentration of the mixed refrigerant, which not only increases energy costs but also has disadvantages in other aspects such as contracted power. It has not yet become what was realized.

Purpose of the Invention The present invention utilizes an auxiliary refrigerant circuit using an auxiliary compressor as a means for varying the refrigerant concentration of the main refrigerant circuit filled with a non-azeotropic mixed refrigerant, thereby achieving energy saving and rapid performance. The purpose is to achieve coordination.

Structure of the Invention The heat pump device according to the present invention has a main refrigerant circuit in which a non-azeotropic mixed refrigerant is sealed, a gas component at the top of the rectifier is suctioned and compressed, and a liquid component at the bottom of the rectifier is heated and condensed and then depressurized. The refrigerant circuit is composed of a sub-refrigerant circuit that returns to the top of the rectifier, and is configured to control the exchange of refrigerant in the main refrigerant circuit and the sub-refrigerant circuit.

DESCRIPTION OF EMBODIMENTS An embodiment of a heat pump device according to the present invention will be described with reference to the drawings. In the figure, 1 is the main compressor, 2 is the condenser, 3 and 4 are the first and second throttle devices, respectively, and 5 is the evaporator, which are connected by a series of refrigerant pipes and filled with a non-azeotropic mixed refrigerant. It constitutes the main refrigerant circuit. Further, 6 is a rectifier, 7 is a filling material filled inside the rectifier 6, 8 is a sub-compressor that sucks and compresses the gas component at the top of the rectifier 6, and 9 is a sub-compressor that sucks and compresses the gas component at the bottom of the rectifier 6. The heating heat exchanger 10 is a sub-diaphragm device, and the gas component at the top of the rectifier 6 forms a sub-refrigerant circuit in which the gas component at the top of the rectifier 6 is returned to the top of the rectifier 6. Furthermore, 11 is the first and second throttle devices 3 and 4 of the main refrigerant circuit.
A first flow rate control valve 12 is arranged in a pipe leading out from the rectifier 6 to the rectifier 6, and a second flow control valve 12 is arranged in a pipe leading the liquid component at the bottom of the rectifier 6 to the evaporator 5 of the main refrigerant circuit. The control valve 13 is a third flow rate control valve disposed in a pipe that introduces the condensate exiting the heat exchanger 9 into the evaporator 5 of the main refrigerant circuit.

Regarding the heat pump device having such a configuration, in particular, a method of varying the refrigerant concentration will be described below. Since the refrigerant in a gas-liquid coexistence state led from the main refrigerant circuit to the rectifier 6 via the first flow control valve 11 is a non-azeotropic mixed refrigerant, gas components containing many low-boiling point components are directed upward and The liquid component containing many boiling point components flows downward. Here, the gas components containing many low-boiling components accumulated at the top of the rectifier 6 are suction-compressed by the sub-compressor 8, flow into the heat exchanger 9, and the high-boiling components accumulated at the bottom of the rectifier 6 are removed. After the liquid component containing a large amount is heated and condensed, the pressure is reduced by the sub-throttle device 10, and the liquid component is returned to the top of the rectifier 6 in a gas-liquid coexistence state. That is, at the bottom of the rectifier 6, particularly low-boiling components contained in the liquid components are heated to boiling, rise inside the rectifier 6, and rise in the rectifier 6.
At the top of the refrigerant, a liquid component containing a large amount of high boiling point components among the refrigerant in a gas-liquid coexistence state condenses and drips inside the rectifier 6. Therefore, in the rectifier 6, the low boiling point component that boils up via the filler 7 and the high boiling point component that condenses and drops come into gas-liquid contact, and on both sides of the heat exchanger 9, the high boiling point component and the low boiling point component are separated. will be done. Therefore, it is possible to selectively introduce high boiling point components from the second flow control valve 12 side and low boiling point components from the third flow control valve 13 side into the main refrigerant circuit, and the second flow rate control is performed in the main refrigerant circuit. When the valve 12 is opened, the capacity can be reduced, and when the third flow control valve 13 is opened, the capacity can be increased.
Further, when the connecting pipe is connected at the bottom of the rectifier 6, if the second flow control valve 12 is omitted, high boiling point components will be concentrated in the main refrigerant circuit, so only the third flow control valve 13 is used. The refrigerant concentration can be varied by introducing low boiling point components.

Furthermore, when the connecting pipe is connected at the top of the rectifier 6, if the third flow control valve 13 is omitted, the low boiling point components in the main refrigerant circuit will be concentrated. The refrigerant concentration may be made variable by introducing the refrigerant.

Effects of the Invention The pump device according to the present invention constitutes a sub-refrigerant circuit using the sub-compressor 8 as a means for varying the refrigerant concentration, so that the liquid at the bottom of the rectifier 6 is The ingredients are heated to boiling point, resulting in energy savings compared to conventional methods using electric heaters. Therefore, the output of the auxiliary compressor 8 is small, which is not only advantageous in terms of contract power, but also reduces the risk of refrigerant decomposition due to local heating due to refrigerant-to-refrigerant heat exchange in the heat exchanger 9. It also has the effect of preventing damage.

[Brief explanation of drawings]

The figure shows a heat pump device according to an embodiment of the present invention. 1... Main compressor, 2... Condenser, 5... Evaporator, 6... Rectifier, 8... Sub-compressor, 9... Heat exchanger.

Claims (1)

[Claims] 1 A main refrigerant circuit in which a non-azeotropic mixed refrigerant is sealed and the main refrigerant circuit includes a main compressor 1, a condenser 2, a throttle device 3, 4, and an evaporator 5, and a gas component at the top of a rectifier 6 is suctioned and compressed. The auxiliary refrigerant circuit includes a sub-compressor 8 for heating and a heat exchanger 9 for heating the liquid component at the bottom of the rectifier 6 and returns to the top of the rectifier 6, and is connected to the main refrigerant circuit and the Between the auxiliary refrigerant circuits, piping is connected between the main refrigerant circuit at the outlet of the condenser 2 and the rectifier 6 in the auxiliary refrigerant circuit. Both the connecting pipe from the heat exchanger 9 connected to the top and the connecting pipe from the bottom of the rectifier 6 are connected to the inlet of the evaporator 5 of the main refrigerant circuit, and arranged in both the connecting pipes. A heat pump device characterized in that a refrigerant is exchanged and controlled by opening and closing control of a flow rate control valve.