JPH04240742A - Bonding device - Google Patents

Abstract

PURPOSE:To uniform a temperature distribution on the upper surface of an IC pellet 4 of a semiconductor component with easy temperature control. CONSTITUTION:A device for fixing one side face of an IC pellet 4 placed on the placing surface of a bearer 3 at an IC pellet securing unit 3b and pressing the other end by an IC pellet pressing mechanism, is so composed that the mechanism includes a retaining pawl 21 and heating means for heating the pawl 21 and only the end of the pawl 21 is substantially heated by the means.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to semiconductor integrated circuits (ICs).
) and large-scale integrated circuits (LSI), and particularly relates to improvements in heating mechanisms for semiconductor components.

0002

2. Description of the Related Art Conventionally, a tape bonding device as shown in FIG. 5 has been known as this type of device. A bonding mechanism including a bonding stage that performs tape bonding is mounted on an XY table 1 shown in FIG. 5 that is movable in the X and Y directions.

[0003] The heat insulating board 2 is composed of a heat insulating member, etc.
It is mounted and fixed on the table 1. A pedestal 3 serving as a bonding stage is placed on this heat insulating plate 2. A mounting surface 3a on which an IC pellet 4 as a semiconductor component is mounted is formed on the upper surface of this pedestal 3. IC pellet fixing part 3 formed at the end of this mounting surface 3a
b is formed integrally (or may be a separate body) so as to protrude above the mounting surface 3a so that the side surface of the IC pellet 4 can be positioned and fixed. Further, a pellet suction hole 3c is formed for sucking the IC pellet 4 in a substantially L-shaped path from the center of the mounting surface 3a toward the bottom of the pedestal 3. A vacuum port 3d is provided on the side surface of the pedestal 3 of the pellet suction hole 3c, which is connected to a suction means (not shown) and is suctioned by a vacuum. The IC pellet 4 transferred and placed on the mounting surface 3a of the pedestal 3 is vacuum-suctioned and positioned and fixed through the vacuum port 3d.

Further, cartridge heaters (heating means) 5 are mounted on both sides of the pellet suction hole 3c of the pedestal 3. The cartridge heater 5 heats the pedestal 3 and heats the IC pellet 4 placed on the mounting surface 3a from below, and the lead 7 and the IC pellet 4 placed on the tape 6 formed in a longitudinal shape are heated. Thermocompression bonding is performed with bumps (not shown) that serve as electrodes. The tape 6 on which the lead 7 is disposed is held at both ends in the tape width direction by tape clamps 8a and 8b. The tape clamps 8a and 8b are configured to be movable up and down in the direction of arrow Z by a moving mechanism (not shown). The lead 7 of the tape 6 and the IC held by the tape clamps 8a and 8b
The bumps on the pellet 4 are pressed by a bonding tool (not shown) that is movable upwards to perform thermocompression bonding, and after a series of bonding operations, a transfer mechanism (not shown) moves the tape in the longitudinal direction. 6 and IC pellet 4 are intermittently fed to the next frame to perform the next bonding.

Furthermore, in this device, the mounting surface 3a of the pedestal 3
As a positioning mechanism for the IC pellet 4 placed on the top,
An IC pellet 4 is placed on the side facing the IC pellet fixing part 3b.
It has an IC pellet holding mechanism 9 that pinches the IC pellet and presses it from the side to position it. This IC pellet holding mechanism 9 is placed on the XY table 1 close to the bonding stage.

The IC pellet holding mechanism 9 includes a presser claw 10 as a presser member, a claw position adjustment section 11 to which the presser claw 10 is attached and fixed, and which adjusts the position of the tip of the presser claw 10, and a presser claw slide mechanism. It consists of 12.

As shown in FIG. 6, the presser claw 10 is composed of a thick, approximately U-shaped presser piece 10a, and a fixing portion 10b that is integrally formed with the presser piece 10a and supports and fixes the presser piece 10a. There is. Adjustment of the contact between the holding piece 10a of the holding claw 10 and the side surface of the IC pellet 4 is performed by adjusting the height and inclination by the claw position adjustment section 11. Further, the presser claw slide mechanism 12 is connected to a bed 12 fixed on the XY table 1.
a and a movable part 12b. this bed 1
2a and the movable portion 12b are constituted by a linear guide that is slidable in the direction of the arrow via rolling elements such as balls (not shown).

In the device configured as described above, the IC pellet 4 is inserted into the pellet suction hole 3c provided in the pedestal 3 and the IC pellet 4.
The pellet is positioned by the pellet holding mechanism 9, heated by the cartridge heater 5 of the pedestal 3, and pressed by a bonding tool (not shown) to perform thermocompression bonding.

[0009]

However, in the conventional tape bonding apparatus, the IC pellet 4 placed on the bonding stage is heated by the cartridge heater 5 to perform thermocompression bonding. As semiconductor components such as semiconductor integrated circuits (ICs) become larger, the number of leads and the bonding area increase during tape bonding. This method has disadvantages in that control becomes difficult, and the bumps and leads are not properly bonded by thermocompression, resulting in defective bonding. In addition, in the conventional device, when the IC pellet 4 is fixed with the presser claw 10, heat flows from the IC pellet fixing part 3b through the IC pellet 4 to the presser claw 10 side, which is the movable part on the opposite side. There is a drawback that the temperature difference between the two sides of 4 becomes large and the temperature distribution is not made uniform.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and provides a bonding device that can easily control temperature and can even out the temperature distribution on the upper surface of an IC pellet, which is a semiconductor component. The purpose is to

[0011]

[Means for Solving the Problems] The present invention provides a semiconductor component, a mounting means having a mounting surface on which the semiconductor component is mounted, and a mounting means mounted on the mounting means that heats the semiconductor component. a first heating means; a fixing part provided on the mounting means for fixedly positioning one side of the semiconductor component to be placed on the mounting surface of the mounting means; and a fixing part for positioning the semiconductor component on the fixing part. a movable presser mechanism that presses and fixes the semiconductor component from the other end; the presser mechanism includes a presser member that presses the semiconductor component from one side; a second heating means that heats the presser member; It is composed of a position adjustment section that adjusts the height and tilt position of the presser member.

0012

[Embodiment] Next, an embodiment of the bonding apparatus according to the present invention will be described. 1 is a diagram showing a first embodiment of a tape bonding apparatus according to the present invention, FIG. 2 is a diagram showing a second embodiment of a tape bonding apparatus according to the present invention, and FIG. 3 is a diagram showing an IC of FIG.
FIG. 4, which shows details of the pellet holding mechanism, is a block diagram of the circuit of the temperature control section shown in FIGS. 2 and 3. Note that the same reference numerals are used for those having substantially the same configuration and functions as the conventional tape bonding apparatus, and the following description focuses on the differences.

``First Embodiment'' In FIG. 1, the differences from FIGS. 5 and 6 showing a conventional tape bonding apparatus are as follows.
The difference is in the configuration of the IC pellet holding mechanism 9.

That is, the IC pellet holding mechanism 1 shown in FIG.
Reference numeral 5 indicates a presser claw 10, a heater block 17 to which the presser claw 10 is attached and fixed, a heater block 17 for heating the presser claw 10, a heat insulating plate 16 for cutting off heat from the heater block 17, and a heat insulating plate 16 at the bottom of the heat insulating plate 16. It is comprised of a claw position adjustment section 11 that adjusts the position of the tip of the presser claw 10, and a presser claw slide mechanism 12.

The presser claw 10 is composed of a thick, approximately U-shaped presser piece 10a as shown in FIG. 6, and a fixing portion 10b that is integrally formed with the presser piece 10a and supports and fixes the presser piece 10a. There is. Adjustment of the contact between the holding piece 10a of the holding claw 10 and the side surface of the IC pellet 4 is performed by adjusting the height and inclination by the claw position adjustment section 11. Fixing part 1 of presser claw 10
A cartridge heater (heating means) 17a that heats from the lower part of the cartridge heater 17a is mounted on the heater block 17, and the heat heated by the cartridge heater 17a is not transmitted to the lower claw position adjustment part 11 etc. by the heat insulating plate 16. The structure is as follows. In addition, the presser claw slide mechanism 12
is composed of a bed 12a fixed on the XY table 1 and a movable part 12b. The bed 12a and the movable portion 12b are constituted by a linear guide that can slide in the direction of the arrow via rolling elements such as balls (not shown).

In the device configured as described above, the IC pellet 4 is positioned by the pellet suction hole 3c provided in the pedestal 3, and the IC pellet 4 is further positioned from the side by the IC pellet holding mechanism 15. The IC pellet 4 is heated by the cartridge heater 5 of the pedestal 3 and the cartridge heater 17a of the heater block 17 so that the temperature distribution on the upper surface of the IC pellet 4 is uniform, and is pressed by a bonding tool (not shown) to perform thermocompression bonding.

"Second Embodiment" This embodiment shown in FIGS. 2 to 4 and the embodiment shown in FIG.
The configuration is different.

That is, the IC pellet holding mechanism 1 shown in FIG.
5, in order to heat the tip of the presser claw 10, a general cartridge heater 17a is mounted on the heater block 17 to heat the entire presser claw 10, but in this configuration, due to space constraints, the cartridge heater 17a Heater 17
a cannot be incorporated near the tip of the presser claw 10, and the tip of the presser claw 10 may be displaced due to thermal deformation, and the ratio of the surface area to the volume of the tip is large, resulting in large heat loss and temperature control using a thermocouple. There are problems such as difficulty.

Therefore, the second embodiment shown in FIGS. 2 to 4 is a further improvement of the first embodiment shown in FIG.

The IC pellet holding mechanism 20 in this second embodiment includes a holding claw 21 as a holding member, a claw position adjustment section 11 to which the holding claw 21 is attached and fixed via an insulating plate 22, and a holding claw slide. With this configuration, the claw tip 21c of the presser claw 21 is controlled to become the maximum heat generating part.

The presser claw 21 is made of an electric heating material, and as shown in FIG. 3, is formed integrally with a thick, approximately U-shaped presser piece 21a, and supports and fixes the presser piece 21a. It is composed of a fixed part 21b. The claw tip 21c of the holding piece 21a is a movable part that fixes the IC pellet 4, and is hardened or coated with a hard material to reduce wear. A terminal 24 of a lead wire 23 connected to the temperature control section is attached and fixed to the rear end surface of the fixing section 21b of the presser claw 21 by a terminal fixing screw 25. Furthermore, the claw tip 21c of the presser claw 21 and the I
Adjustment of the contact with the side surface of the C pellet 4 is performed using the claw position adjustment section 11.
The structure is such that the inclination and height of the presser claw 21 can be adjusted by using the presser claw 21. The presser claw slide mechanism 12 includes a bed 12a fixed on the XY table 1 and a movable part 12b. The bed 12a and the movable portion 12b are constituted by a linear guide that can slide in the direction of the arrow via rolling elements such as balls (not shown). A spring hook 27 is provided on the side surface of the movable portion 12b, and a pressing spring 26 is stretched around the spring hook 27 to bias it in the direction of arrow A'. Conversely, when the movable portion 12b is urged in the direction of the arrow A, it is urged in the direction of the arrow A against the urging force of the pressing spring 26 by an air cylinder (not shown).

FIG. 4 is a block diagram showing a circuit of the temperature control section, and the heating element 32 corresponds to the presser claw 21 made of an electric heating material. This heating element 32 is connected to a power source 35, a controller 30, and a switching circuit 31. This heating element 32 turns on/off the switching circuit 31 at an appropriate timing under the temperature control of the controller 30.
By turning off, the temperature of the heating element 32 is controlled at a desired temperature. This heating element 32 is further connected to a resistance value measuring circuit 33 and a voltage conversion circuit 34, and this feedback signal is applied to the controller 30 for feedback. Since the configuration is such that the signal is input as a signal, the resistance value of the heating element 32 itself (although not shown, the claw tip 21 of the presser claw 21
(the resistance value near c is measured) is the resistance value measurement circuit 33
is constantly sampled and measured by controller 3.
The voltage conversion circuit 34 converts the voltage into a voltage corresponding to the electromotive force of the thermocouple corresponding to 0, which can be obtained as a feedback signal.

Therefore, with such a configuration, the terminal 24 acts as a power supply terminal, and since the presser claw 21 is thick and formed in a substantially U-shape, the current path is narrowed and the current flow is reduced. It is controlled so that the maximum resistance part due to the current exists near the claw tip 21c and becomes the maximum heat generating part, so that the heating element 32 can always be controlled to a desired temperature.

In this embodiment, the present invention is applied to a tape bonding apparatus, but it goes without saying that the present invention may be applied to other bonding apparatuses.

[0025]

[Effects of the Invention] As explained above, according to the present invention,
Since the semiconductor component is heated by the heating means from the side surface, it is possible to eliminate the temperature difference between both ends of the semiconductor component, resulting in a uniform temperature distribution. Further, according to the present invention, since the heat generating portion is located almost at the tip of the holding member, the effect of thermal deformation on the holding mechanism can be reduced and the temperature distribution on the upper surface of the semiconductor component can be efficiently equalized. Further, according to the present invention, there is no need for a sensor such as a thermocouple for temperature control, so there is an effect that there is no need to secure an attachment space at the tip of the presser member for attaching the sensor.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of a tape bonding apparatus according to the present invention.

FIG. 2 is a diagram showing a second embodiment of the tape bonding apparatus according to the present invention.

FIG. 3 is a diagram showing details of the IC pellet holding mechanism of FIG. 2;

FIG. 4 is a block diagram of a circuit of the temperature control section of FIGS. 2 and 3. FIG.

FIG. 5 is a diagram showing the configuration of a conventional tape bonding device.

FIG. 6 is a diagram showing details of the IC pellet holding mechanism shown in FIG. 5;

[Explanation of sign]

1 XY table 2 Heat insulating board 3 Holder 3a Placement surface 3b IC pellet fixing part 3c Pellet suction hole 3d Vacuum port 4 IC pellet 5 Cartridge heater 6 Tape 7 Leads 8a, 8b Tape clamp 9, 15, 20 IC pellet holding mechanism 10 Presser pawl 11 Claw position adjustment section 12 Presser pawl slide mechanism 16 Heat insulating plate 17 Heater block 17a Cartridge heater 21 Presser pawl 22 Insulating plate 23 Lead wire 24 Terminal 25 Terminal fixing screw

Claims (4)

[Claims] 1. A semiconductor component, a mounting means having a mounting surface on which the semiconductor component is mounted, a first heating means mounted on the mounting means for heating the semiconductor component, and a first heating means for heating the semiconductor component; A fixing part provided on the placing means for fixing and positioning one side of the semiconductor component to be placed on the placing surface of the placing means, and a fixing part for positioning the semiconductor component on the fixing part and holding it from the other end. a movable presser mechanism for fixing the semiconductor component from one side; the presser mechanism includes a presser member that presses the semiconductor component from one side; a second heating means that heats the presser member; and a height and inclination position of the presser member. A bonding device comprising: a position adjustment section for adjusting the position of the bonding device; 2. The bonding apparatus according to claim 1, wherein the second heating means heats the pressing member from a lower surface thereof. 3. The bonding apparatus according to claim 1, wherein the second heating means heats only substantially the tip of the holding member. 4. The bonding apparatus according to claim 1, wherein the temperature of the second heating means is controlled by feedback of changes in resistance of the presser member.