JPH04239755A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To connect many signals with input/output pins to be exclusively used to connect the signals by mounting a power supply terminal at a power supply pad provided on a circuit board, and connecting an external power source through the terminal to supply power to integrated circuit elements on the board. CONSTITUTION:Connecting pads 3, etc., for connecting integrated circuit elements 1 by soldering, etc., are provided on the surface of a circuit board 2. Input/output pins 5 for connecting to external signals are provided on the rear surface of the board 2. A power supply component 7 for supplying power is mounted at each side of a frame 6 on the board 2. Since the component 7 is secured to the frame 6 by using an insulating washer 8, it is insulated. A hole is provided at each power supply pad 4, a power supply terminal 10 is inserted, and connected by soldering. The component 7 is connected to the terminal 10 by a screw 11, and power is supplied to the elements 1 by connecting a bus, etc., connected to the external power source to an external power source connecting terminal.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit package used in electronic equipment such as information processing equipment.

0002

2. Description of the Related Art Electronic devices such as large-scale information processing devices are constructed by housing a plurality of wiring boards on which a large number of integrated circuit elements are mounted and interconnected with each other in a rack. In recent years, there has been an increasing demand for improved performance in devices, and in order to achieve this, it is necessary to mount integrated circuit elements as densely as possible and minimize the wiring between the elements. To meet these demands, several types of integrated circuit packages have been put into practical use, in which high-density wiring is formed on a ceramic plate or the like and a large number of integrated circuit elements are mounted.

FIG. 3 shows this type of integrated circuit package. In FIG. 3, 301 is an integrated circuit element, and 302 is a wiring board on which a plurality of integrated circuit elements 301 are mounted. 30
Reference numeral 3 denotes an input/output pin, which is used for inputting and outputting signals to and from the outside as well as for supplying power to the integrated circuit element 301. Further, a frame 304 is fixed to the wiring board 302, and the frame 304 is used for fixing to a motherboard and for attaching parts for cooling the integrated circuit base 302.

0004

[Problems to be Solved by the Invention] The conventional integrated circuit package described above is used for both external signal connection and power supply to the integrated circuit element through input/output pins, so it is difficult to integrate the integrated circuit element. As devices become larger in scale and packages become more powerful, the number of signals connected to external devices increases as well as the supply current. The absolute number of is insufficient. Conversely, if you reduce the number of power supply pins and increase the power supply per pin, the voltage drop due to the resistance of the pins,
Heat generation becomes a problem.

[0005]

Means for Solving the Problems In an integrated circuit package according to the present invention, a plurality of integrated circuit elements are mounted on a wiring board, and a frame is fixed to the wiring board, in which the integrated circuit elements are mounted on the wiring board. It has a power supply pad provided on the surface for supplying power, a power supply terminal fixed to the power supply pad, and an input/output pin dedicated to external signal connection provided on the back surface of the wiring board.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an integrated circuit package of the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view thereof. 1 is an integrated circuit element, and 2 is a wiring board on which a large number of integrated circuit elements 1 are mounted. On the surface of the wiring board 2, in addition to a power supply pad 3 for connecting the integrated circuit element 1 by soldering or the like, a power supply pad 4 for supplying power from the outside is provided. Also, the board 2
The back side is equipped with input/output pins 5 for continuation of signals with the outside.

Reference numeral 6 denotes a frame fixed to the wiring board 2 for fixing the integrated circuit package to the motherboard and for mounting parts for cooling the integrated circuit element 1. Furthermore, power supply components 7 for supplying power to the wiring board 2 are attached to each side of the frame 6. The power supply component 7 and the frame 6 are fixed to each other by screws 9 using insulating washers 8, so that they are electrically insulated.

Further, a hole is provided in the power supply pad 4 of the wiring board 2, and a power supply terminal 10 is inserted thereinto and electrically connected to the power supply pad 4 by soldering. Power supply part 7 and power supply terminal 1
0 by a screw 11, and by connecting a bus or cable connected to an external power source to the external power connection terminal 12 of the power supply component 7, power can be supplied to the integrated circuit element 1 mounted on the wiring board 2. It becomes possible.

Therefore, since the input/output pins 5 provided on the back surface of the wiring board 2 can be used exclusively for signal connections, it is possible to cope with an increase in the number of signal connections to the outside due to an increase in the degree of integration of the integrated circuit element 1. In addition, a material with low electrical resistance such as copper can be used for the power supply component 7, and the cross-sectional area can also be made large, so that the voltage drop when a large current is passed can be suppressed to a small level.

[0011]

[Effects of the Invention] As explained above, the present invention attaches a power supply terminal to a power supply pad provided on a wiring board, connects an external power supply through the power supply terminal, and supplies power to an integrated circuit element on the wiring board. With this structure, input/output pins can be used exclusively for signal connections, allowing a large number of signal connections, and an integrated circuit package with a small voltage drop in the power supply can be realized.

Furthermore, by connecting the power supply component attached to the frame fixed to the wiring board and the power supply terminal on the wiring board, and connecting the power supply component from the outside, the input/output pins can be used exclusively for signal connection with a simple structure. As a result, a large number of signal connections can be made, and an integrated circuit package with a small voltage drop in the power supply can be realized.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a longitudinal cross-sectional view of the embodiment shown in FIG. 1;

FIG. 3 is a cross-sectional view of a conventional integrated circuit package.

[Explanation of symbols]

1 Integrated circuit element 2. Wiring board 3 Connection pad 4 Power supply pad 5 Input/output pin 6 Frame 7 Power supply parts 8 Insulating washer 9 Screw 10 Power supply terminal 11 Screw 12 External power connection terminal 301 Integrated circuit element 302 Wiring board 303 Input/output pin 304 frame

Claims (2)

[Claims] 1. An integrated circuit package comprising a plurality of integrated circuit elements mounted on a wiring board and a frame fixed to the wiring board, wherein a power supply provided on the integrated circuit element mounting surface of the wiring board; An integrated circuit package comprising: a power supply pad for power supply; a power supply terminal fixed to the power supply pad; and input/output pins provided on the back surface of the wiring board dedicated to external signal connections. . 2. The integrated circuit package of claim 1, wherein an external power source and a power supply component connected to the supply terminal are attached to the frame.