JPH0423389B2 - - Google Patents
Info
- Publication number
- JPH0423389B2 JPH0423389B2 JP2104805A JP10480590A JPH0423389B2 JP H0423389 B2 JPH0423389 B2 JP H0423389B2 JP 2104805 A JP2104805 A JP 2104805A JP 10480590 A JP10480590 A JP 10480590A JP H0423389 B2 JPH0423389 B2 JP H0423389B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive agent
- liquid crystal
- conductive
- crystal panel
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006258 conductive agent Substances 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 21
- 229910052709 silver Inorganic materials 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- 239000004033 plastic Substances 0.000 description 13
- 238000007747 plating Methods 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000001235 sensitizing effect Effects 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、信頼性に優れた回路間の接続構造に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a highly reliable connection structure between circuits.
例えば、液晶パネルは現在時計用表示体、電卓
用表示体、テレビ、計測器等の表示体として広く
使用されている。最近は、液晶パネルの表示容量
が大きくなる傾向があり、ここで第２図、第３図
に従来の液晶パネルの上下導通部の概略図を示
す。第２図は上下基板の上下導通を取るために軟
金属を用いた場合のものである。上基板に穴を開
けておき、３のコモン電極のリード端子５へ導通
を取るために、穴の中に軟金属であるインジウム
ボール６を入れて、つぶした状態のものである。
このように、インジウムボールによつて上下導通
を取つた場合、３のコモン電極と６のインジウム
ボールのコンタクトが取れないことが多く、ま
た、工数もかかり生産性が悪かつた。この欠点を
改良して、銀ペースト９を上下基板のどちらかに
印刷することによつて、工数を減したものが第３
図の状態である。
For example, liquid crystal panels are currently widely used as displays for watches, calculators, televisions, measuring instruments, and the like. Recently, the display capacity of liquid crystal panels has tended to increase, and FIGS. 2 and 3 are schematic diagrams of the upper and lower conductive parts of conventional liquid crystal panels. FIG. 2 shows a case where soft metal is used to establish vertical conduction between the upper and lower substrates. A hole is made in the upper substrate, and an indium ball 6 made of soft metal is placed in the hole and crushed in order to establish conduction to the lead terminal 5 of the common electrode 3.
In this way, when vertical conduction is established using indium balls, it is often impossible to establish contact between the common electrode 3 and the indium ball 6, and it also takes a lot of man-hours, resulting in poor productivity. The third method is to improve this drawback and reduce the number of man-hours by printing the silver paste 9 on either the upper or lower substrate.
This is the state shown in the figure.
ところが、このような状態の液晶パネルも、上
下導通部の不良が液晶パネルの歩留り低下の大き
な原因となつていた。これは、７のシール剤と９
の銀ペーストの乾燥温度が異ること。また、通常
液晶パネルは単品で製造するのではなく、二枚の
ガラス板を貼り合わせ、第４図のような形にした
あと破線部に切り込みを入れ、割ることによつて
単品の液晶パネル１０を製造している。このため
液晶パネルの端部には力が加わり、シール剤の外
部にある銀ペーストがはがれ上下導通不良を起す
原因となつていた。そこで銀ペーストの接着性を
高くするために樹脂分を多くすると、銀ペースト
内での銀粒子の接触が取れにくくなり、上下導通
不良を起こすこととなつた。また銀ペースト中の
銀粒子を多くすると、当然のことながら接着性が
悪くなつた。更に、適当の割合であつても、製造
時の湿度、温度、乾燥時の温度等によつても歩留
りが大きく変動し、その原因の解析も困難を極め
ているのが現状である。
However, even in liquid crystal panels in such a state, defects in the upper and lower conductive parts have been a major cause of a decrease in the yield of liquid crystal panels. This is 7 sealant and 9
The drying temperature of the silver paste is different. In addition, normally LCD panels are not manufactured as single items, but are made by bonding two glass plates together, forming a shape as shown in Figure 4, making a cut along the dashed line, and breaking it to create a single liquid crystal panel (10). is manufactured. As a result, force is applied to the edges of the liquid crystal panel, causing the silver paste on the outside of the sealant to peel off, resulting in poor vertical continuity. Therefore, when the resin content was increased in order to improve the adhesion of the silver paste, it became difficult to maintain contact between the silver particles within the silver paste, resulting in poor vertical conduction. Furthermore, as the amount of silver particles in the silver paste was increased, the adhesiveness naturally deteriorated. Furthermore, even if the ratio is appropriate, the yield varies greatly depending on the humidity and temperature during manufacturing, the temperature during drying, etc., and it is currently extremely difficult to analyze the causes of this.
また銀ペーストを用いた場合、銀粒子の径が一
定でなく、大きい粒子の径が7μｍ以上であるの
が一般的にものである。このため、ギヤツプ厚が
5μｍの液晶パネルを量産することが困難であつ
た。第５図にこの状態を示す。１１は銀粒子、１
２は銀ペースト中の接着樹脂である。 Furthermore, when silver paste is used, the diameter of the silver particles is not constant, and the diameter of large particles is generally 7 μm or more. For this reason, the gap thickness
It was difficult to mass produce 5μm liquid crystal panels. FIG. 5 shows this state. 11 is a silver particle, 1
2 is the adhesive resin in the silver paste.
そこで、本発明は上記問題点を解決するために
なされたものであり、その目的とするところは、
信頼性に優れた導通剤を用いた回路の接続構造を
提供することにある。 Therefore, the present invention has been made to solve the above problems, and its purpose is to:
The object of the present invention is to provide a circuit connection structure using a conductive agent with excellent reliability.
本発明の回路の接続構造は、相対向して形成さ
れた接続用回路が、弾力性を有する絶縁物質の表
面に形成された導電性金属薄層により実質的に被
覆された導通剤と絶縁性接着剤とからなる電気的
接続部材により相互に接続され、前記導通剤は相
対向する回路により押圧変形した状態で、前記回
路と前記導通剤とが面接触し電気的接続されたこ
とを特徴とする。
In the circuit connection structure of the present invention, the connection circuits formed opposite to each other have a conductive agent substantially covered with a conductive metal thin layer formed on the surface of an elastic insulating material and an insulating material. They are interconnected by an electrical connection member made of an adhesive, and the conductive agent is pressed and deformed by the opposing circuit, and the circuit and the conductive agent come into surface contact and are electrically connected. do.
まず、弾力性のある絶縁物質に導電性を付与し
た導電剤としては、プラスチツクボール、プラス
チツクフアイバー等がある。これを使用した場
合、プラスチツクボールあるいはプラスチツクフ
アイバーは例えば液晶パネルのギヤツプ厚と同じ
径から、２倍までの径をもつものが良い。これは
接点不良を解消する目的の導通剤であるが、液晶
パネルのギヤツプよりプラスチツクボールあるい
はプラスチツクフアイバーが大きいと液晶パネル
のギヤツプ厚が変動しても弾力性に富むためメタ
ライズされた導通剤が変化し、導通部と強く、且
つ面状に接触することによつて接点不良がなくな
る訳である。
First, examples of conductive agents that impart conductivity to elastic insulating materials include plastic balls and plastic fibers. When this is used, the plastic ball or plastic fiber preferably has a diameter that is equal to or twice the gap thickness of the liquid crystal panel, for example. This is a conductive agent intended to eliminate contact failure, but if the plastic ball or plastic fiber is larger than the gap of the LCD panel, it will be highly elastic even when the gap thickness of the LCD panel changes, so the metalized conductive agent will change. However, contact failure is eliminated by strong and planar contact with the conductive portion.
この状態を第１図に示す。第１図中１５はメタ
ライジングされたプラスチツクボール、１６は接
着剤である。 This state is shown in FIG. In FIG. 1, 15 is a metallized plastic ball, and 16 is an adhesive.
ここで、プラスチツクボール、プラスチツクフ
アイバーの径が液晶パネルのギヤツプ厚の２倍を
超えるとパネルが組み立てられる際に1/2に圧縮
されるためメタル層にキ裂が入り易くなり、かえ
つて導通不良の原因を起すことになる。好ましく
はプラスチツクボール径をギヤツプ厚の1.1〜1.3
倍程である。 If the diameter of the plastic ball or plastic fiber exceeds twice the gap thickness of the LCD panel, it will be compressed to 1/2 when the panel is assembled, making it easier for the metal layer to crack, which can lead to poor conductivity. It will cause the cause of Preferably the plastic ball diameter is 1.1 to 1.3 of the gap thickness.
It's about double that.
次に本発明で用いた導通剤の製造方法について
述べる。 Next, a method for manufacturing the conductive agent used in the present invention will be described.
これらの絶縁物質にメツキをするために、通常
次のような無電解前処理工程を用いる。 To plate these insulating materials, the following electroless pretreatment process is typically used.
(1) アルカリ脱脂
(2) 酸中和
(3) SnCl2溶液におけるセンシタイジング
(4) PdCl2溶液におけるアクチベイチング
である。センシイタイジングは、絶縁物質の表面
に例えばSn2+イオンを吸着させる工程であり、
アクチベイチングは例えば
Sn2+＋Pd2+→Sn4＋Pd0
の反応を絶縁物質表面に起し、Pd0を無電解メツ
キの触媒核とする工程である。(1) Alkaline degreasing (2) Acid neutralization (3) Sensitizing in SnCl 2 solution (4) Activating in PdCl 2 solution. Sensitizing is a process in which, for example, Sn 2+ ions are adsorbed onto the surface of an insulating material.
Activating is a process in which, for example, a reaction of Sn 2+ + Pd 2+ → Sn 4 + Pd 0 occurs on the surface of an insulating material, and Pd 0 becomes a catalyst nucleus for electroless plating.
無電解メツキ前処理工程を行つた後、所定の方
法に従つて建浴、加温された無電解メツキ浴に浸
漬すればメタライジングできる。 After performing the electroless plating pretreatment step, metallization can be performed by immersing the product in an electroless plating bath that has been prepared and heated according to a predetermined method.
無電解メツキ浴としては、Au、Ni、Cu、Ag、
Co、Sn等のメツキ浴があり、導通剤として使用
可能であるが、メツキ被膜の密着性は、Niが最
も良く、そのため絶縁性物質のメタライジングに
は無電解ニツケル浴が最もすぐれている。 Electroless plating baths include Au, Ni, Cu, Ag,
There are plating baths of Co, Sn, etc., which can be used as conductive agents, but Ni has the best adhesion of the plating film, so electroless nickel baths are the best for metallizing insulating materials.
また、前述のプラスチツクボール、プラスチツ
クフアイバーをメタライズする場合はメツキ膜厚
は200Åから4μｍが良い。200Å以下であるとプ
ラスチツクボール等にメツキ被膜の形成されてい
ない部分が生じたり、抵抗が大きくなるため実用
的ではない。一方、4μｍ以上メツキ被膜を形成
するとメツキ層にパネル組み立て時にキレツが入
りやすくなり導通不良の原因となりやすい。また
これ以上メツキ被膜を形成すると液晶パネルのギ
ヤツプコントロールが困難になる。 Furthermore, when metalizing the aforementioned plastic balls and plastic fibers, the plating film thickness is preferably from 200 Å to 4 μm. If it is less than 200 Å, parts of the plastic ball etc. where no plating film is formed or the resistance becomes large, which is not practical. On the other hand, if a plating film is formed with a thickness of 4 μm or more, cracks will easily form in the plating layer when assembling the panel, which can easily cause poor conductivity. Furthermore, if more plating film is formed, gap control of the liquid crystal panel becomes difficult.
また、絶縁性物質にニツケル被膜等を形成した
場合、抵抗値が大きい場合は、ニツケル等の表面
に無電解銀メツキ、無電解メツキ等の電気導通性
の良い貴金属被膜を形成するとよい。貴金属無電
解メツキの被膜厚みは50Å〜1μｍが好ましい。 In addition, when a nickel film or the like is formed on an insulating material and the resistance value is large, it is preferable to form a noble metal film with good electrical conductivity such as electroless silver plating or electroless plating on the surface of the nickel or the like. The thickness of the noble metal electroless plating film is preferably 50 Å to 1 μm.
このようにしてメタライズされた絶縁性物質を
接着剤に加え均一に分散させる。 The thus metalized insulating material is added to the adhesive and uniformly dispersed.
接着剤としてはエポキシ樹脂、アクリル樹脂等
を使用した。 Epoxy resin, acrylic resin, etc. were used as the adhesive.
上記接着剤中へのメタライズされた絶縁性物質
の割合は0.1wt％〜30wt％が適当であり、0.1wt
％以下であると導通部の抵抗が大きくなつたり、
ばらついたりしやすくなる。また30wt％以上に
なると接着性に問題がでやすくなる。またギヤツ
プ剤の分散状態は、液晶パネルの少なくとも導通
部において５ケ／mm2〜500ケ／mm2が良い。上限、
下限の値は上記と同様の理由である。もちろん、
これらの値は、絶縁性物質の径により多少異る。 The appropriate proportion of the metalized insulating material in the above adhesive is 0.1wt% to 30wt%, and 0.1wt%
If it is less than %, the resistance of the conductive part will increase,
It becomes easy to fluctuate. Furthermore, if the content exceeds 30 wt%, problems with adhesion tend to occur. The dispersion state of the gapping agent is preferably 5 particles/mm 2 to 500 particles/mm 2 at least in the conductive portion of the liquid crystal panel. upper limit,
The lower limit value is determined for the same reason as above. of course,
These values differ somewhat depending on the diameter of the insulating material.
このようにして作られた導通剤は、例えば印刷
によつて液晶パネルの上下導通部につけられ、液
晶パネルに組込まれる。 The conductive agent thus produced is applied to the upper and lower conductive parts of the liquid crystal panel by, for example, printing, and is incorporated into the liquid crystal panel.
液晶パネルの基板は通常ガラスが用いられてい
るが、プラスチツクフイルムに透明電極（SnO2、
In2O3等）をパターニングしたものを用いてもよ
い。プラスチツクフイルムの場合は、上下導通剤
の接触した部分が、組立時の加圧によりへこみ、
それによつて上下導通剤との接触面積が大きくな
り信頼性が増すことになる。 Glass is usually used for the substrate of liquid crystal panels, but transparent electrodes (SnO 2 ,
In 2 O 3 etc.) may be patterned. In the case of plastic film, the part where the upper and lower conductive agents are in contact may be dented due to the pressure applied during assembly.
This increases the contact area with the upper and lower conductive agents and increases reliability.
次に具体的な実施例を用いて詳細に説明する。 Next, a detailed explanation will be given using a specific example.
実施例 １
径12μｍのスチレンボールをクロム酸混液の中
へ５分間浸漬し、穴径2μｍのミクロフイルター
によつて、ろ過後充分水洗した。次にSnCl21
ｇ／、HCl 1cc／の混合溶液中にこれらの粒
子を分散させ、ろ過、水洗後、所定の方法によつ
て建浴されたカニゼン社製のレツドシユーマー中
に分散させ、ろ過、水洗した。そして所定の方法
によつて建浴されたカニゼン社製Ｓ−680（45℃）
溶液中に６分間分散させろ過、水洗した。これに
よつてスチレンボール上に3500Åのニツケル−リ
ンメツキができた。これをエポキシ樹脂中に
20wt％を分散させ、ギヤツプ厚10μｍの液晶パネ
ルの上下導通剤として使用したところ、上下導通
部の抵抗値は8KΩとなつた。また所定の加速試
験を行つてもその値に変化はなかつた。Example 1 A styrene ball with a diameter of 12 μm was immersed in a chromic acid mixture for 5 minutes, filtered through a microfilter with a hole diameter of 2 μm, and thoroughly washed with water. Then SnCl 2 1
The particles were dispersed in a mixed solution of 1 cc/g/g/HCl, filtered and washed with water, and then dispersed in a Red Shumer manufactured by Kanigen Co., Ltd. prepared by a predetermined method, followed by filtration and washing with water. Then, Kanigen S-680 (45℃) was prepared using a prescribed method.
The mixture was dispersed in the solution for 6 minutes, filtered, and washed with water. As a result, a nickel-phosphorus plating of 3500 Å was formed on the styrene ball. Put this in epoxy resin
When 20wt% was dispersed and used as a conductive agent between the upper and lower sides of a liquid crystal panel with a gap thickness of 10 μm, the resistance value of the upper and lower conductive parts was 8KΩ. Further, even after performing a prescribed accelerated test, the value did not change.
実施例 ２
実施例１でメタライズされたスチレンボールを
紫外線硬化性のアクリル樹脂中に10wt％分散さ
せて、実施例１と同様のギヤツプ厚10μｍの液晶
パネルを作製した。液晶パネルの上下導通部の抵
抗値は9KΩであり、所定の加速試験を行なつて
もその値は変化なかつた。Example 2 A liquid crystal panel with a gap thickness of 10 μm as in Example 1 was prepared by dispersing 10 wt % of the styrene balls metalized in Example 1 in an ultraviolet curable acrylic resin. The resistance value of the upper and lower conductive parts of the liquid crystal panel was 9KΩ, and this value did not change even after performing the specified acceleration test.
実施例 ３
実施例１と同様に径10μｍのナイロンボール
に、2500Åのニツケル−リンメツキを行つた。そ
の後、日本エンゲルハルド社製のアトメツクス無
電解金メツキ液にて500Åの置換金メツキを施し
た。これをエポキシ樹脂中に5wt％を分散させ、
ギヤツプ厚10μｍの液晶パネルの上下導通剤とし
て使用したところ、その上下導通部の抵抗値は
6KΩとなり、所定の加速試験を行つてもその値
に変化はなかつた。Example 3 As in Example 1, a nylon ball with a diameter of 10 μm was plated with 2500 Å of nickel-phosphorus. Thereafter, displacement gold plating of 500 Å was applied using Atomex electroless gold plating solution manufactured by Nippon Engelhard. Disperse 5wt% of this in epoxy resin,
When used as a conductive agent for the upper and lower conductors of a liquid crystal panel with a gap thickness of 10 μm, the resistance value of the upper and lower conductive parts was
The resistance value was 6KΩ, and the value did not change even after performing the specified acceleration test.
実施例 ４
実施例２と同様に径10μｍのスチレンボール
に、2000Åの無電解ニツケルメツキと600Åの無
電解金メツキを施し、銀ペーストに3wt％分散さ
せ、ギヤツプ厚7μｍの液晶パネルの上下導通剤
とした。その上下導通部の抵抗値は6KΩであり、
所定の加速試験を行つた後もその値には変化はな
かつた。Example 4 As in Example 2, a styrene ball with a diameter of 10 μm was coated with 2000 Å electroless nickel plating and 600 Å electroless gold plating, dispersed at 3 wt% in silver paste, and used as an upper and lower conductive agent for a liquid crystal panel with a gap thickness of 7 μm. did. The resistance value of the upper and lower conductive parts is 6KΩ,
There was no change in the value even after performing the prescribed accelerated test.
実施例 ５
実施例４でメタライズされたスチレンボールを
紫外線硬化性のアクリル樹脂に10wt％分散させ、
ギヤツプ厚10μｍの液晶パネルの上下導通剤とし
て使用したところ、その上下導通部の抵抗値は
8KΩとなり、所定の加速試験を行つた後にもそ
の値は変化しなかつた。Example 5 10wt% of the styrene balls metalized in Example 4 were dispersed in an ultraviolet curable acrylic resin,
When used as a conductive agent for the upper and lower conductors of a liquid crystal panel with a gap thickness of 10 μm, the resistance value of the upper and lower conductive parts was
The resistance value was 8KΩ, and the value did not change even after performing the specified acceleration test.
上記各実施例で用いた導通剤を、従来の導通剤
と比較したところ導通不良が1/10に減少した。 When the conductive agent used in each of the above examples was compared with a conventional conductive agent, the conductivity defects were reduced to 1/10.
なお、上記実施例では液晶パネルを主体に述べ
たが、エレクトロクロミツクパネル、エレクロル
ミネツサンス用パネル等各種表示体にも本発明が
適用可能であることは言うまでもない。 In the above embodiments, a liquid crystal panel was mainly described, but it goes without saying that the present invention is also applicable to various display bodies such as an electrochromic panel and an electroluminescence panel.
以上述べたように、本発明によれば、特に導通
剤を相対向する回路により押圧変形した状態で、
前記回路と前記導通剤と面接触し電気的接続され
たので、接続部の信頼性を大きく向上することが
できる。
As described above, according to the present invention, in particular, when the conductive agent is pressed and deformed by opposing circuits,
Since the circuit and the conductive agent are in surface contact and electrically connected, the reliability of the connection portion can be greatly improved.
第１図は本発明の一実施例を示す図。第２図〜
第５図は従来技術を説明する図。
FIG. 1 is a diagram showing an embodiment of the present invention. Figure 2~
FIG. 5 is a diagram explaining the prior art.
Claims (1)
を有する絶縁物質の表面に形成された導電性金属
薄層により実質的に被覆された導通剤と絶縁性接
着剤とからなる電気的接続部材により相互に接続
され、前記導通剤は相対向する回路により押圧変
形した状態で、前記回路と前記導通剤とが面接接
触し電気的接続されたことを特徴とする回路の接
続構造。1. An electrical connection in which the connecting circuits formed facing each other are substantially covered with a conductive metal thin layer formed on the surface of an elastic insulating material and an insulating adhesive and a conductive agent. A circuit connection structure characterized in that the circuits and the conductive agent are connected to each other by members, and the conductive agent is pressed and deformed by the opposing circuits, and the circuit and the conductive agent are brought into surface contact and electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480590A JPH02291680A (en) | 1990-04-20 | 1990-04-20 | Connecting structure for circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10480590A JPH02291680A (en) | 1990-04-20 | 1990-04-20 | Connecting structure for circuit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57065698A Division JPS58182685A (en) | 1982-04-20 | 1982-04-20 | Vertical energization agent for display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02291680A JPH02291680A (en) | 1990-12-03 |
| JPH0423389B2 true JPH0423389B2 (en) | 1992-04-22 |
Family
ID=14390643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10480590A Granted JPH02291680A (en) | 1990-04-20 | 1990-04-20 | Connecting structure for circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02291680A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343306A (en) * | 1976-10-01 | 1978-04-19 | Furukawa Electric Co Ltd:The | Current collecting method for moving body |
| JPS56118467A (en) * | 1980-02-25 | 1981-09-17 | Nippon Kokuen Kogyo Kk | Manufacture of conductive powder paint |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57175126U (en) * | 1981-04-30 | 1982-11-05 |
-
1990
- 1990-04-20 JP JP10480590A patent/JPH02291680A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5343306A (en) * | 1976-10-01 | 1978-04-19 | Furukawa Electric Co Ltd:The | Current collecting method for moving body |
| JPS56118467A (en) * | 1980-02-25 | 1981-09-17 | Nippon Kokuen Kogyo Kk | Manufacture of conductive powder paint |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02291680A (en) | 1990-12-03 |
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