JPH0422697B2 - - Google Patents
Info
- Publication number
- JPH0422697B2 JPH0422697B2 JP58133988A JP13398883A JPH0422697B2 JP H0422697 B2 JPH0422697 B2 JP H0422697B2 JP 58133988 A JP58133988 A JP 58133988A JP 13398883 A JP13398883 A JP 13398883A JP H0422697 B2 JPH0422697 B2 JP H0422697B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- composition
- electron beam
- viscosity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 35
- 238000010894 electron beam technology Methods 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims 1
- -1 etc. Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 239000000047 product Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000002759 woven fabric Substances 0.000 description 8
- 238000003475 lamination Methods 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 238000007757 hot melt coating Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 239000002649 leather substitute Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000002964 rayon Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- KAJBSGLXSREIHP-UHFFFAOYSA-N 2,2-bis[(2-sulfanylacetyl)oxymethyl]butyl 2-sulfanylacetate Chemical compound SCC(=O)OCC(CC)(COC(=O)CS)COC(=O)CS KAJBSGLXSREIHP-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- FEWFXBUNENSNBQ-UHFFFAOYSA-N 2-hydroxyacrylic acid Chemical class OC(=C)C(O)=O FEWFXBUNENSNBQ-UHFFFAOYSA-N 0.000 description 1
- NIAGUSHJWAMKBZ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound CC(=C)C(O)=O.NC1=NC(N)=NC(N)=N1 NIAGUSHJWAMKBZ-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical class OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
(技術分野)
本発明は電子線を利用して合成樹脂複合シート
を製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of manufacturing a synthetic resin composite sheet using electron beams.
(従来技術)
従来、この種の複合シートを製造する方法とし
ては次の2つの方法が例示できる。(Prior Art) Conventionally, the following two methods can be exemplified as methods for manufacturing this type of composite sheet.
その1は、板状基材に放射線硬化材料を塗布し
たものに凹凸模様を有するエンドレスベルトを重
ね合わせ、この状態で放射線を照射することによ
り、塗布面に凹凸を形成させつつ塗膜を硬化さ
せ、硬化後、上記エンドレスベルトを剥離する方
法である(特開昭49−45946号)。 The first method is to overlay an endless belt with an uneven pattern on a plate-shaped base material coated with a radiation-curable material, and then irradiate it with radiation to cure the coating film while forming unevenness on the coated surface. , a method in which the endless belt is peeled off after curing (Japanese Patent Application Laid-Open No. 49-45946).
又、その2は凹凸を有する型材に電子線硬化性
液状物を塗布し、次いで塗布面に基材をラミネー
トし、電子線により硬化させて後、型材を除去す
る方法である。 The second method is to apply an electron beam curable liquid material to a mold material having irregularities, then laminate a base material on the coated surface, cure it with an electron beam, and then remove the mold material.
しかし、上記のいずれの方法も、基材が非浸透
性であるときは良いが、浸透性であるときは塗布
物が基材にしみこむため、裏面が樹脂化された
り、製品の凹凸面に基材の一部が露出する欠点を
生じ、又、凹凸の正確な形成も困難になる。 However, all of the above methods are good when the base material is non-permeable, but when the base material is permeable, the coating material soaks into the base material, resulting in the back side being made of resin or the uneven surface of the product being coated. This results in the disadvantage that a part of the material is exposed, and it also becomes difficult to accurately form unevenness.
(発明の目的)
本発明は上記の従来技術の欠点を解消し、基材
の風合を損わず、しかも凹凸の形成が正確に行な
える合成樹脂複合シートの製造法を提供すること
を目的とする。(Objective of the Invention) An object of the present invention is to provide a method for manufacturing a synthetic resin composite sheet that eliminates the drawbacks of the above-mentioned prior art, does not impair the texture of the base material, and can accurately form unevenness. shall be.
(発明の構成)
本発明は、凹凸模様を予め形成した型材に、室
温での粘度10000c.p.s.以上の電子線硬化性組成物
を塗布し、次いで塗布面に浸透性基材をラミネー
トし、その後、全体に電子線を照射し、しかる
後、型材より基材と一体になつた硬化物を剥離す
ることを特徴とする合成樹脂複合シートの製造方
法をその主旨とする。(Structure of the Invention) The present invention applies an electron beam curable composition having a viscosity of 10,000 c.ps or more at room temperature to a mold material on which an uneven pattern has been formed in advance, and then laminates a permeable base material on the coated surface. The gist of the method is to irradiate the entire surface with an electron beam, and then to peel off the cured product integrated with the base material from the mold material.
第1図は本発明の製造法を説明するための概念
図であつて型材1の凹凸面2上にホツトメルト塗
布装置3を用いて電子線硬化性組成物4を塗布
し、浸透性基材5を塗布面にラミネートし、ラミ
ネート後、電子線照射装置6により電子線を照射
して電子線硬化性組成物4を硬化させて硬化物7
とし、最後に型材1から浸透性基材と一体化した
硬化物7を脱型除去する。 FIG. 1 is a conceptual diagram for explaining the manufacturing method of the present invention, in which an electron beam curable composition 4 is applied onto the uneven surface 2 of a mold 1 using a hot melt coating device 3, and a permeable base material 5 is coated with an electron beam curable composition 4. is laminated on the coating surface, and after lamination, an electron beam is irradiated with an electron beam irradiation device 6 to cure the electron beam curable composition 4 to form a cured product 7.
Finally, the cured product 7 integrated with the permeable base material is removed from the mold material 1.
型材1としては適宜な基体に凹凸の型面を形成
したものを使用する。基体としてはプラスチツ
ク、紙、金属などの単層のもの、或いはこれらか
らなる任意の複合体、又は以上の単層若しくは複
合体の方面に必要に応じポリエチレン、ポリプロ
ピレンなどのポリオレフイン樹脂やシリコーン樹
脂の層を剥離層として積層したものが使用され
る。これら基体の片面に凹凸を形成するにはエン
ボス処理や印刷により凸パターンの積層などの公
知の方法によればよい。 As the mold material 1, a material having an uneven mold surface formed on a suitable base is used. The substrate may be a single layer of plastic, paper, metal, etc., or any composite made of these materials, or a layer of polyolefin resin such as polyethylene, polypropylene, or silicone resin as necessary for the single layer or composite. A laminated version of these is used as a release layer. In order to form irregularities on one side of these substrates, known methods such as lamination of convex patterns by embossing or printing may be used.
ここで凹凸の形状としては任意のものが使用で
きるが、典型的な形状の例は天然皮革の表面状態
を模したものであり、或いはこれに縫製などの加
工を行なつたものを模したものであつてもよい。 Any shape can be used for the unevenness, but a typical shape is one that imitates the surface condition of natural leather, or one that imitates that which has undergone processing such as sewing. It may be.
本発明で使用する電子線硬化性組成物について
説明すると、組成物としては、分子中にエチレン
性不飽和結合を有するプレポリマー若しくはオリ
ゴマーを主に用い、粘度調整のためにエチレン性
不飽和結合を有するモノマーを適宜用いる。本発
明において用いる組成物は、浸透性基材(後述)
に対し塗布後のしみ込みが適度で浸透性基材の風
合を損なわず、又、得られる最終製品における凹
凸再現性の良いものが望まれる。この観点におい
て、組成物の粘度としては室温(25℃)での粘度
が10000c.p.s.以上であるものを使用することが望
ましい。ここで粘度が10000c.p.s.未満では組成物
の浸透性基材へのしみ込みが過度となつて浸透性
基材の風合を損なう上、肝心の凹凸の再現性も低
下する。なお組成物の粘度の上限は、ホツトメル
トコーテイングの適性から決められるべきもので
あり、通常のホツトメルトコーテイングでは100
℃の温度で100000c.p.s.である。 To explain the electron beam curable composition used in the present invention, the composition mainly uses a prepolymer or oligomer having ethylenically unsaturated bonds in the molecule, and ethylenically unsaturated bonds are added to adjust the viscosity. A monomer having the following properties is used as appropriate. The composition used in the present invention is a permeable substrate (described later).
On the other hand, it is desired that the permeability after application is moderate, that the texture of the permeable substrate is not impaired, and that the resulting final product has good reproducibility of irregularities. From this point of view, it is desirable to use a composition having a viscosity of 10,000 c.ps or more at room temperature (25° C.). If the viscosity is less than 10,000 c.ps, the composition will penetrate excessively into the permeable base material, impairing the texture of the permeable base material, and also reducing the reproducibility of the important irregularities. The upper limit of the viscosity of the composition should be determined based on its suitability for hot melt coating, and for normal hot melt coating it is
The temperature in °C is 100000c.ps.
上記の粘度範囲の組成物を得るには、分子中に
エチレン性不飽和結合を有するプレポリマー若し
くはオリゴマーを組成物で50重量%以上とし、分
子中にエチレン性不飽和結合を有するモノマーを
50重量%未満とするとよい。 In order to obtain a composition with a viscosity within the above range, the prepolymer or oligomer having an ethylenically unsaturated bond in the molecule should be at least 50% by weight, and the monomer having an ethylenically unsaturated bond in the molecule should be at least 50% by weight.
It is preferably less than 50% by weight.
エチレン性不飽和結合を有するプレポリマー若
しくはオリゴマーとしては次のような化合物が具
体例として挙げられる;
不飽和ポリエステル類、ポリエステルアクリレ
ート、エポキシアクリレート、ウレタンアクリレ
ート、ポリエーテルアクリレート、ポリオールア
クリレート、メラミンアクリレートなどの各種ア
クリレート類、ポリエステルメタクリレート、エ
ポキシメタクリレート、ウレタンメタクリレー
ト、ポリエーテルメタクリレート、ポリオールメ
タクリレート、メラミンメタクリレートなどの各
種メタクリレート類。 Specific examples of prepolymers or oligomers having ethylenically unsaturated bonds include the following compounds; unsaturated polyesters, polyester acrylates, epoxy acrylates, urethane acrylates, polyether acrylates, polyol acrylates, melamine acrylates, etc. Various acrylates, various methacrylates such as polyester methacrylate, epoxy methacrylate, urethane methacrylate, polyether methacrylate, polyol methacrylate, and melamine methacrylate.
分子中にエチレン性不飽和結合を有するモノマ
ーとしては、上記プレポリマー若しくはオリゴマ
ーを希釈する能力があり、硬化後、被膜に凝集力
等の機械強度を付与するものが好ましく、次のよ
うな化合物が具体例として挙げられる;
ブチルカルバモイルエチルアクリレート、エチ
ルカルバモイルエチルアクリレート、フエニルカ
ルバモイルエチルアクリレートなどのウレタンア
クリレート類、ブチルカルバモイルエチルメタク
リレート、エチルカルバモイルエチルメタクリレ
ート、フエニルカルバモイルエチルメタクリレー
トなどのウレタンメタアリレート類、ヒドロキシ
エチルアクリレート、ヒドロキシプロピルアクリ
レートなどのヒドロキシアクリレート類、エチレ
ングリコールジアクリレート、プロピレングリコ
ールジアクリレート、ネオペンチルグリコールジ
アクリレート、1,6−ヘキサンジオールジアク
リレート、トリエチレングリコールジアクリレー
ト、ネオペンチルグリコールジメタクリレート、
トリエチレングリコールジメタクリレート等の多
官能性化合物、及び/又はチオール化合物、例え
ばトリメチロールプロパントリチオグリコレー
ト、ペンタエリスリトールテトラチオグリコレー
ト。 The monomer having an ethylenically unsaturated bond in the molecule is preferably one that has the ability to dilute the prepolymer or oligomer and imparts mechanical strength such as cohesive force to the film after curing, and the following compounds are preferred. Specific examples include: Urethane acrylates such as butyl carbamoylethyl acrylate, ethyl carbamoylethyl acrylate, and phenyl carbamoylethyl acrylate; urethane metharylates such as butyl carbamoylethyl methacrylate, ethyl carbamoylethyl methacrylate, and phenyl carbamoylethyl methacrylate; Hydroxyacrylates such as ethyl acrylate and hydroxypropyl acrylate, ethylene glycol diacrylate, propylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, triethylene glycol diacrylate, neopentyl glycol dimethacrylate,
Polyfunctional compounds such as triethylene glycol dimethacrylate, and/or thiol compounds such as trimethylolpropane trithioglycolate, pentaerythritol tetrathioglycolate.
上記したプレポリマー若しくはオリゴマー、及
びモノマーは、いずれも1種又は2種以上選択し
て使用し組成物とすることができる。 The above-mentioned prepolymers or oligomers and monomers can be used alone or in combination to form a composition.
なお、組成物中には、電子線照射を行なう以前
に硬化が進行することを防止する意味で、ハイド
ロキノン、ハイドロキノンモノメチルエーテル、
ベンゾキノンなどの重合禁止剤を安定剤として添
加することもできる。又、組成物中には組成物を
着色する意味で顔料若しくは染料等の着色剤を5
〜30重量%の範囲で添加することができる。5重
量%未満では着色の効果が薄いので隠蔽力がな
く、30重量%を超えると組成物の硬化性が低下す
る。 In addition, in the composition, hydroquinone, hydroquinone monomethyl ether, hydroquinone monomethyl ether,
Polymerization inhibitors such as benzoquinone can also be added as stabilizers. In addition, a coloring agent such as a pigment or dye may be added to the composition to color the composition.
It can be added in a range of ~30% by weight. If it is less than 5% by weight, the coloring effect will be weak and there will be no hiding power, and if it exceeds 30% by weight, the curability of the composition will decrease.
凹凸模様を予め形成した型材に、上記の粘度が
10000c.p.s.以上の組成物を塗布するには、室温に
加熱して組成物を塗布可能な粘度に低下させて行
なうホツトメルト方式が用いられ、塗布ヘツドの
方式としてはロールコート、グラビアコート、フ
アウンテンコート等の方式である。ホツトメルト
の加熱温度としては50〜150℃であり、塗布量と
しては型材の凹凸の程度にもよるが通常、20〜
150μmである。 The above viscosity is applied to a mold material with a pre-formed uneven pattern.
To apply a composition of 10,000 c.ps or more, a hot-melt method is used, in which the composition is heated to room temperature to reduce the viscosity to a coatable level, and coating head methods include roll coating, gravure coating, and fountain coating. This is a method such as a coat. The heating temperature for hot melt is 50 to 150℃, and the amount of application is usually 20 to 150℃, although it depends on the degree of unevenness of the mold material.
It is 150 μm.
型材の凹凸面に電子線硬化性組成物を塗布した
後、塗布面に浸透性基材をラミネートする。浸透
性基材としては不織布、織布、或いは不織布と織
布の複合材等の繊維質のものが用いられるが、こ
の他、不織布・織布に合成樹脂発泡層を積層した
ものも使用でき、このようなものを使用するとソ
フトな手触りの製品が得られる。不織布の例とし
てはポリエステル、レーヨン、ナイロン、若しく
は芳香族ポリアミドなどの繊維から成るもの、又
は紙が挙げられる。織布の例としてはアクリル、
ポリエステル、コツトン、ナイロン、若しくはレ
ーヨン等の繊維からなるもの、又はこれらの繊維
の混紡材が挙げられる。 After applying an electron beam curable composition to the uneven surface of the mold material, a permeable base material is laminated on the applied surface. As the permeable base material, fibrous materials such as non-woven fabrics, woven fabrics, or composite materials of non-woven fabrics and woven fabrics are used, but in addition, non-woven fabrics or woven fabrics laminated with a synthetic resin foam layer can also be used. Using such a product will result in a product that is soft to the touch. Examples of nonwoven fabrics include those made of fibers such as polyester, rayon, nylon, or aromatic polyamide, or paper. Examples of woven fabrics include acrylic;
Examples include materials made of fibers such as polyester, cotton, nylon, or rayon, or blends of these fibers.
ラミネートの方法は、例えば、浸透性基材5の
巻取りを繰り出して塗布面上に導き、必要に応じ
てゴムロール若しくは金ロールにより押圧して行
なえばよい。 The lamination may be carried out, for example, by unrolling a roll of the permeable base material 5, guiding it onto the coating surface, and pressing it with a rubber roll or a metal roll as necessary.
次に、ラミネート体に電子線を照射して、ラミ
ネート体中の組成物を硬化させて硬化物とする。
電子線照射のための線源としては低エネルギー電
子加速器、たとえばエネルギーサイエンス社製、
エレクトロカーテンCB200/50/30、あるいはオ
ツトーデユール社製、NP−ESH150などを用い
ることができ、電子線照射は望ましくは窒素ガス
雰囲気中で行なうとよく、又、照射線量としては
0.5〜30Mradでよい。 Next, the laminate body is irradiated with an electron beam to cure the composition in the laminate body to form a cured product.
As a source for electron beam irradiation, a low-energy electron accelerator, such as one manufactured by Energy Science Co., Ltd.
Electrocurtain CB200/50/30 or NP-ESH150 made by Otsto-Dühl can be used, and electron beam irradiation is preferably carried out in a nitrogen gas atmosphere, and the irradiation dose is
0.5~30Mrad is sufficient.
なお、電子線照射は、ラミネートのいずれの側
から行なつてもよく、即ち、型材側から行なつて
も浸透性基材側から行なつてもよい。又、両側か
ら行なつても差支えない。 Note that the electron beam irradiation may be performed from either side of the laminate, that is, it may be performed from the molding material side or from the permeable substrate side. Also, it can be done from both sides.
電子線照射後、浸透性基材と一体になつた硬化
物を型材から剥離して、表面に凹凸を有し、か
つ、裏面に浸透性基材を有する合成樹脂複合シー
トを得る。 After electron beam irradiation, the cured product integrated with the permeable base material is peeled off from the mold material to obtain a synthetic resin composite sheet having an uneven surface and a permeable base material on the back side.
(発明の効果)
以上の本発明の方法によれば、電子線硬化性組
成物として粘度が10000c.p.s.以上のものを用いて
いるので、組成物を塗布後、浸透性基材をラミネ
ートしても、基材への組成物のしみ込みが少な
く、基材の質感が損なわれることがなく、又、ラ
ミネート後に基材が型面と接したり、基材の一部
が型面に露出して得られる製品の凹凸感を損なう
こともない。(Effects of the Invention) According to the above method of the present invention, since an electron beam curable composition having a viscosity of 10,000 c.ps or more is used, a permeable base material is laminated after the composition is applied. Also, there is little penetration of the composition into the base material, the texture of the base material is not impaired, and there is no possibility that the base material will come into contact with the mold surface after lamination, or a part of the base material will be exposed to the mold surface. It does not impair the texture of the resulting product.
(実施例)
以下に、実施例により、本発明を更に具体的に
説明する。(Example) Below, the present invention will be explained in more detail with reference to Examples.
実施例 1
ポリプロピレンラミネート紙に天然皮革の皮し
ぼ形状をエンボス加工して得た型材に、フアウン
テンコーターにより下記組成物を50℃の温度に加
温しつつ、塗布量が30g/m2になるよう塗布し
た。50℃における粘度は12000c.p.s.であつた。Example 1 The following composition was heated to a temperature of 50°C using a fountain coater on a molded material obtained by embossing the grain shape of natural leather on polypropylene laminated paper, and the amount of coating was 30 g/m 2 It was coated like this. The viscosity at 50°C was 12000 c.ps.
組成物
〓ウレタンアクリレート …80重量部
(東亜合成(株)製、M−1200X)
ブチルカルバモイルエチルアクリレート
…20 〃
カーボンブラツク …10 〃
次に塗布面にポリエステルサテン織布を室温状
態でラミネートし、ラミネート後、織布側よりエ
ネルギーサイエンス社製、エレクトロカーテン
CB200/50/30を使用し、窒素雰囲気中で
10Mradの電子線を照射した。Composition Urethane acrylate...80 parts by weight (manufactured by Toagosei Co., Ltd., M-1200X) Butyl carbamoylethyl acrylate
…20 〃 Carbon black …10 〃 Next, a polyester satin woven fabric was laminated on the coated surface at room temperature, and after lamination, an electro curtain manufactured by Energy Science Co., Ltd. was applied from the woven fabric side.
Using CB200/50/30 in nitrogen atmosphere
A 10 Mrad electron beam was irradiated.
照射後、型材を除去することにより、織布を基
材とした、表面に皮革様の凹凸形状を有する合成
皮革を得た。 After the irradiation, the mold material was removed to obtain a synthetic leather having a leather-like uneven shape on the surface and using a woven fabric as a base material.
実施例 2
型材として、ポリエチレンラミネート紙にエン
ボス加工したものを用い、組成物としては以下の
ものを用い、その他は実施例1と同様に行ない、
同様の合成皮革を得た。組成物の50℃における粘
度は11000c.p.s.であつた。Example 2 Embossed polyethylene laminated paper was used as the template, the following composition was used, and the rest was carried out in the same manner as in Example 1.
Similar synthetic leather was obtained. The viscosity of the composition at 50°C was 11000 c.ps.
組成物
〓オリゴエステルアクリレート …80重量部
(東亜合成(株)製、M6200)
トリエチレングリコールジアクリレート
…20 〃
ベンガラ …5 〃
比較例
組成物としては以下のものを用い、その他は実
施例1と同様に行なつた。組成物の50℃における
粘度は5000c.p.s.であつた。Composition Oligoester acrylate...80 parts by weight (manufactured by Toagosei Co., Ltd., M6200) Triethylene glycol diacrylate
...20 〃Red Garla...5 〃Comparative Example The following compositions were used, and the other procedures were the same as in Example 1. The viscosity of the composition at 50°C was 5000 c.ps.
組成物
〓ウレタンアクリレート …80重量部
(東亜合成(株)製、M−1200X)
ブチルカルバモイルエチルアクリレート
…20 〃
カーボンブラツク …10 〃
しかしながら、上記の組成物は織布へのしみ込
みが著しく、得られた製品は裏面が樹脂化されて
おり、かつ、型材の凹凸の再現性が著しく悪かつ
た。Composition Urethane acrylate...80 parts by weight (manufactured by Toagosei Co., Ltd., M-1200X) Butyl carbamoylethyl acrylate
...20 〃 Carbon Black ...10 〃 However, the above compositions were found to be extremely soaked into the woven fabric, the back side of the resulting product was made of resin, and the reproducibility of the unevenness of the mold material was extremely poor. .
第1図は本発明の製造法を説明するための概念
図である。
1……型材、2……凹凸面、3……ホツトメル
ト塗布装置、4……電子線硬化性組成物、5……
浸透性基材、6……電子線照射装置、7……硬化
物。
FIG. 1 is a conceptual diagram for explaining the manufacturing method of the present invention. DESCRIPTION OF SYMBOLS 1... Shape material, 2... Uneven surface, 3... Hot melt coating device, 4... Electron beam curable composition, 5...
Permeable base material, 6... Electron beam irradiation device, 7... Cured product.
Claims (1)
度10000c.p.s以上の電子線硬化性組成物を塗布
し、次いで塗布面に浸透性基材をラミネートし、
その後、全体に電子線を照射し、しかる後、型材
より基材と一体になつた硬化物を剥離することを
特徴とする合成樹脂複合シートの製造法。1. Apply an electron beam curable composition with a viscosity of 10,000 c.ps or more at room temperature to a mold material with a pre-formed uneven pattern, then laminate a permeable base material on the coated surface,
A method for producing a synthetic resin composite sheet, which comprises: thereafter irradiating the entire surface with an electron beam, and then peeling off the cured product integrated with the base material from the mold material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58133988A JPS6025750A (en) | 1983-07-22 | 1983-07-22 | Manufacture of synthetic resin composite sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58133988A JPS6025750A (en) | 1983-07-22 | 1983-07-22 | Manufacture of synthetic resin composite sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6025750A JPS6025750A (en) | 1985-02-08 |
JPH0422697B2 true JPH0422697B2 (en) | 1992-04-20 |
Family
ID=15117754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58133988A Granted JPS6025750A (en) | 1983-07-22 | 1983-07-22 | Manufacture of synthetic resin composite sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025750A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0725096B2 (en) * | 1989-03-03 | 1995-03-22 | 東洋クロス株式会社 | Method for producing film having irregularities |
JPH07100370B2 (en) * | 1992-05-14 | 1995-11-01 | バンドー化学株式会社 | Laminated sheet with a three-dimensional effect |
JP2611724B2 (en) * | 1993-06-16 | 1997-05-21 | 日本電気株式会社 | Solar cell power supply |
JP2005161199A (en) * | 2003-12-02 | 2005-06-23 | Sumitomo Bakelite Co Ltd | Plastic laminate and production method for the same |
-
1983
- 1983-07-22 JP JP58133988A patent/JPS6025750A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6025750A (en) | 1985-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS59102972A (en) | Peeling coating | |
JPS6059878B2 (en) | Transfer painting method | |
JPH0422697B2 (en) | ||
JPS5936874B2 (en) | Decorative board manufacturing method | |
JP2000127328A (en) | Decorative sheet and its manufacture | |
JP3115039B2 (en) | Manufacturing method of artificial leather | |
JP3173168B2 (en) | Method and apparatus for manufacturing decorative paper | |
JP2000006325A (en) | Decorative material having abrasion resistance | |
JPH0419924B2 (en) | ||
JPH0422696B2 (en) | ||
JPS632780B2 (en) | ||
JP3173167B2 (en) | Manufacturing method of decorative paper | |
JP3087405B2 (en) | Manufacturing method of decorative sheet | |
JPH0155991B2 (en) | ||
JPH1177944A (en) | Decorative material with wear resistance | |
JPH0422694B2 (en) | ||
JPH08156390A (en) | Transfer of patterns to surface of glass | |
JPS6216236B2 (en) | ||
JPH0661525B2 (en) | Method for manufacturing decorative material having uneven pattern | |
JPH0142747B2 (en) | ||
JPH05177800A (en) | Decorative laminated material and production thereof | |
JPH0824776A (en) | Decorative sheet and its production | |
JPH0223345B2 (en) | ||
JPH02258090A (en) | Preparation of decorative board having embossed pattern | |
JP3028429B2 (en) | Cosmetic material and manufacturing method thereof |