JPH0422688A - Intaglio and manufacture thereof - Google Patents

Abstract

PURPOSE:To easily correct the flaw of an intaglio itself, to prolong the life thereof and to improve dimensional accuracy and the cutting of a fine pattern by filling the unnecessary recessed part of a base with a resin. CONSTITUTION:A base 8 is etched by an ething solution through a Cr mask and a recessed pattern 9 constituted of parallel lines having the min. line width of 15-100mum is formed to the entire surface of the base 8. An epoxy adhesive (resin 12) is applied to unnecessary recessed parts 1 in a spot form using a dispenser and cured to fill the recessed parts 11 with the resin 12. Next, the surface of this intaglio is lightly polished to remove the protruding parts of the resin 12. Subsequently, when this corrected places are observed by a microscope, the resin 12 protrudes to parts other than short places, that is, in a planar direction. Then, a correction device is fitted to the microscope and the protruding parts are removed while the short places of the resin are observed. The intaglio whose flaw parts are corrected is set to an intaglio offset press and conductive ink is printed on a plate to be printed and subsequently baked.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to etching resists, conductor patterns, insulator (dielectric) patterns, and color filters used in the manufacture of electronic components such as circuit boards, liquid crystal display elements, and thermal heads. The present invention relates to an intaglio plate used for printing with high accuracy and fine precision, and a method for manufacturing the same.

2. Description of the Related Art Conventionally, techniques for forming fine conductive patterns have been used in the manufacture of electronic components such as circuit boards, liquid crystal display elements, and thermal heads. Furthermore, as for other electronic components, pattern formation of insulators (or dielectric materials, magnetic materials, etc.) is required during the manufacturing of resistors, coils, capacitors, or composite electronic devices of these, or in the manufacturing of color filters and light-emitting devices. Formation of fine patterns is indispensable in many cases.

In recent years, methods for manufacturing fine patterns using various printing methods have been proposed, which are more advantageous in terms of productivity, cost, and larger area than conventional methods for manufacturing fine patterns using photoresists. .

Among these, intaglio offset printing technology is particularly attracting attention as an alternative to conventional screen printing technology in printing fine patterns. [Nikkei Electronics Special Issue “Flat Panel Display '90J (1)
989)].

Here, intaglio offset printing will be briefly explained using figures. FIG. 8 is a diagram for explaining an offset printing method using an intaglio plate. In Figure 8, 1 is the stand, 2
is a cylinder body, and a blanket 7 is wrapped around the surface. 3 is an intaglio plate, and a concave pattern 4 formed on the surface is filled with ink. Further, 5 is a printing medium, on the surface of which a printed image 6 is formed. Here, in the offset printing procedure, first, the ink filled in the concave pattern 4 formed on the surface of the intaglio plate 3 poisons the ink. It was created by etching a board.

For example, as a method for manufacturing an intaglio using etching technology, the method proposed in Japanese Patent Publication No. 62-23306 involves plating copper on a nickel substrate and then etching the copper into a predetermined shape. By doing so, a concave pattern is formed. However, for intaglios produced by these etching methods, the yield in the etching process is the same as the yield of the intaglio. Furthermore, it is not possible to modify the intaglio pattern as necessary after etching is completed. For this reason, the intaglio itself has defects (scratches, foreign matter, contamination,
If there is a partial defect in the concave pattern itself), defects corresponding to the defects in the intaglio plate will also occur in the obtained printed pattern. Since such defects in the intaglio are printed as they are, they become fatal defects when manufacturing electronic components. As described above, the finer the pattern required during the manufacture of electronic parts, the more serious the problem of defects in intaglio printing becomes.

On the other hand, various resin intaglio manufacturing methods have been proposed as methods for manufacturing intaglios without using etching techniques. For example, there are methods for producing intaglio plates made of synthetic resin as proposed in Japanese Patent Publication No. 55-21340 and photosensitive resin as proposed in Japanese Patent Application Laid-Open No. 58-139140. In any case, since the concave pattern is created using resin, there remain problems with the lifespan of the intaglio, dimensional accuracy, and sharpness of the fine pattern, making it impossible to obtain the precision required for manufacturing electronic components. . That is,
Conventional intaglio plates using etching cannot effectively repair defects that occur in the intaglio plates, and those made of resin have problems such as dimensional accuracy over the life span and breakage of fine patterns.

In view of these problems, it is an object of the present invention to provide an intaglio plate in which defects in the intaglio plate itself can be easily corrected, and which also has good dimensional accuracy over a lifetime and good cutting of fine patterns.

Means for Solving the Problems and In order to achieve this object, the present invention is one in which the unnecessary recesses of the base are filled with resin.

Function: With this configuration, unnecessary recesses that are defective parts can be easily repaired by filling them with resin, and since the base is not made of resin, the product has good lifespan, dimensional accuracy, and fine pattern cutting.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 6.

(Example 1) First, as (Example 1), Figs. 1 to 4 show the structure and correction method of an intaglio plate in which defective parts such as pinholes and sheets that occurred in the concave patterns of the completed intaglio plate were corrected. This will be explained using figures.

FIG. 1 is a diagonal view of a concave pattern according to the present invention (as Example 1) after defective parts such as pinholes and seats have been corrected. In FIG. 1, 8 is a base, 9 is a concave pattern, and 10 is a corrected part of the intaglio plate, in which pinholes are corrected with resin.

Next, pinholes occurred in the concave pattern 9 of the intaglio plate completed using FIGS. 2 to 4.

A method for correcting defective parts such as short circuits will be explained using FIGS. 2 to 4 for explaining cross-sectional views. FIG. 2 is a diagram for explaining defective parts such as pinholes and short circuits that occur in the concave pattern 9 of the completed intaglio plate. In FIG. 2, 8 is the base, and 1) is unnecessary recesses such as pinholes and short circuits. 9 is the original concave pattern.

FIG. 3 is for explaining how the unnecessary recess 1) is filled with the resin 12. In FIG. 3, 12 is a resin, and the unnecessary recess 1) is filled by locally applying the resin 12 to the unnecessary recess 1) and curing it.

Figure 4 is for explaining the situation after filling the unnecessary recesses 1) with the resin 12 and removing the unnecessary parts (inside the recess pattern 9 of the resin and the protruding portion of the resin 12 on the surface of the base 8). It is. In FIG. 4, 12 is the resin portion after the protrusion has been corrected. As described above, even a defective intaglio plate as shown in FIG. 2 can be corrected to the original intaglio plate as shown in FIG. 4. Furthermore, by using a repair device widely used in the electronic parts industry, it is possible to easily repair protruding resin while observing it. This will be explained in more detail next. First, glass was used as the material for the base 8. Then, this base 8 was etched using a Cr (chromium) mask used in the manufacture of semiconductors using a hydrofluoric acid-based etching solution. A base 8 having dimensions of 300 x 200 m and a thickness of 2 m was used, and a concave pattern 9 composed of parallel lines with a minimum line width of 15 to 100 μm was created on the entire surface. The depth of the recess pattern 9 after etching was measured to be 10 to 15 μm.

Next, the intaglio plate was set in an intaglio offset printing machine, conductive ink was printed on the printing target (alumina substrate), and the intaglio plate was baked and inspected for short circuits, and five short points were found. Therefore, when the intaglio portion of the printing material corresponding to the short-circuit location was carefully inspected using a microscope, five unnecessary recesses 1) were found at positions corresponding to the short-circuiting locations on the printing material.

In other words, it was found that the cause of the short circuit on the printing material was a defective pattern on the intaglio plate. Therefore, we decided to correct the five short points. First, an epoxy adhesive (resin 12) was applied to the unnecessary recess 1) using a dispenser, hardened, and filled with resin 12 as shown in FIG. Next, the surface of this intaglio was lightly polished to remove the protruding portion of the resin 12. Next, when this repaired area was observed under a microscope, it was found that the resin 12 was protruding into areas other than the shorted area (also into the concave pattern 9), that is, in the planar direction. Therefore, a correction device was attached to the microscope, and while observing the short-circuit portion of the resin, the protruding portion (unnecessary portion) was removed as shown in FIG. 4. The intaglio plate with the defect portions corrected as described above was set in an intaglio offset printing machine, conductive ink was printed on the printing material (alumina substrate), and the intaglio plate was baked and inspected for short circuits. No short circuits were found. In addition, after squeegeeing 1000 times in succession, the corrected parts of the intaglio plate were observed, but there were no particular changes. We also compared the intaglio plates before and after correction with respect to printing accuracy and plate life, and found no particular problems. This is because the surface of the intaglio is mostly glass, and the resin 12 is used only in a portion.

(Example 2) Next, (Example 2) will be explained using FIGS. 5 to 7.

FIGS. 5 and 6 are for explaining the state before formation of the concave pattern of the intaglio plate produced according to the present invention.

In FIGS. 5 and 6, 13 is a base and 14 is a resin. In addition, the cross section taken along the line Vl-Vl' in Fig. 5 is
It is shown in FIG.

As shown in FIG. 6, the resin layer 14 is formed to fill the lattice-shaped recesses of the base 13. As shown in FIG.

FIG. 7 is for explaining the state after formation (after completion) of the concave pattern of the intaglio plate created according to the present invention.

In FIG. 7, reference numeral 15 indicates a concave pattern, and the resin 17 is removed from unnecessary areas within the grid-like concavities by the laser correction device described above.
It is created by removing only the

This will be explained in more detail next. First, a glass base 13 was created under the same conditions as in Example 1. Note (Example 2)
The base 13 had dimensions of 300 x 200 m and a thickness of 2 cm, and a perpendicular lattice-like depression (a pattern equivalent to screen gauze in screen printing) with a minimum line width of 15 to 100 μm was etched on the entire surface. The depth of the lattice-like depressions on the base 13 after etching is approximately 15μ.
Met. Next, pour the exci-based resin 14 into the lattice-shaped recesses of the base 13, and after hardening, mix the resin 14 and base 1.
The surface of 3 was polished as shown in Figure 6 so that it was flat. Next, this base 13 is fixed to a computer-controlled (numerical side) XY table equipped with a chipping motor, and unnecessary portions of the tree 14 are removed using a laser to create a recessed part 15.
It was created. Next, the intaglio surface was observed after squeegeeing this intaglio 1000 times in a row, but no particular change was observed. Even when intaglio offset printing was performed in the same manner as in Example 1, it was similar to the conventional intaglio with a single lath. Printing accuracy and lifespan were improved. For reference, I made an intaglio using resin alone]
After squeegeeing 300 times, the surface of the intaglio plate was observed to be considerably abraded, and when further printing was performed, it was not possible to obtain a certain level of printing accuracy.

Effects of the Invention As described above, according to the present invention, a defective intaglio can be easily corrected into a good intaglio by filling the defective part J of the intaglio, which is an unnecessary concave part, with resin, and furthermore, since the base itself is not made of resin, the lifespan is 1.
It is possible to obtain products with no problems in terms of dimensional accuracy, cutting of fine patterns, etc.

[Brief Description of the Drawings] Fig. 1 is a perspective view of an intaglio plate of the present invention (Example 1), Fig. 2 is a cross-sectional view taken along line n-n' in Fig. 1, and Fig. 3 is an unnecessary recessed portion made of resin. Cross-sectional view for explaining how to embed, 4th ry
J is a sectional view for explaining the state after filling unnecessary recesses with resin and removing the unnecessary parts, FIGS. 5 to 7 are perspective views of the intaglio of the present invention (implementation ff1l 2 ), FIG. 5 is a cross-sectional view taken along line VI-Vl', FIG. 7 is a perspective view, and FIG. 8 is a perspective view for explaining an offset printing method using an intaglio plate. 8... Base, 9... Concave pattern,
1)...Unnecessary recess, 12...Resin part. Name of agent: Patent attorney Shigetaka Awano et al.

Claims (2)

[Claims] (1) An intaglio plate in which a concave pattern is formed on the surface of the base and unnecessary concave portions of the base are filled with resin. (2) Forming a recess in a predetermined shape on the surface of the base, then filling the recess with resin, and then using a laser to remove the resin that has entered the recess so that a predetermined recess pattern is formed. A method for manufacturing an intaglio plate characterized by: