JPH0422594A - Laser beam cut piece discharging device - Google Patents
Laser beam cut piece discharging deviceInfo
- Publication number
- JPH0422594A JPH0422594A JP2128744A JP12874490A JPH0422594A JP H0422594 A JPH0422594 A JP H0422594A JP 2128744 A JP2128744 A JP 2128744A JP 12874490 A JP12874490 A JP 12874490A JP H0422594 A JPH0422594 A JP H0422594A
- Authority
- JP
- Japan
- Prior art keywords
- cut piece
- discharge
- laser beam
- base metal
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007599 discharging Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000010953 base metal Substances 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は、レーザ加工機、レーザ複合加工機における、
レーザ加工切断片排出装置に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a laser processing machine, a laser compound processing machine,
The present invention relates to a laser processing cut piece discharge device.
[従来の技術]
従来レーザ加工機では、材料(母材)を保持するクラン
プが、レーザ加工終了直後、X軸又は、Y軸方向に移動
し、材料の内の切断片を切断面で接触しながら、排出位
置まで移動し、排出させていた。[Prior art] In a conventional laser processing machine, a clamp that holds a material (base material) moves in the X-axis or Y-axis direction immediately after laser processing is completed, and contacts the cut pieces of the material at the cutting surface. However, it was moved to the ejection position and ejected.
[発明が解決しようとする課題]
しかし、前述の従来技術では、材料の曲がり、そりによ
り、材料の内の切断片を切断面で接触させて移動させる
ことができず、2枚が重なった状態となり加工中の機械
を一時停止させ、人の手により排出しなければならない
事が、しばしばあり、危険、稼動率低下、長時間安定稼
動ができないといった課題があった。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, due to bending and warpage of the material, it is not possible to move the cut pieces of the material so that they come into contact with each other at the cut surface, and the two pieces overlap. It is often necessary to temporarily stop the machine during processing and manually discharge the waste, which poses problems such as danger, lower operating rates, and the inability to operate stably for long periods of time.
そこで、本発明は、このような課題を解決するためのも
ので、その目的とするところは、確実に切断片を排出で
きる、レーザ加工切断片排出装置を提供することである
。SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and an object of the present invention is to provide a laser-processed cut piece discharging device that can reliably discharge cut pieces.
[課題を解決するための手段]
本発明の、レーザ加工切断片排出装置は、材料(母材)
より、所定の加工が終了する直前から排出が終了するま
での時間に、材料(母材)と切断片とを平面上で接続し
、かつ、材料(母材)と切断片とが重ならない範囲に規
制させる機構を有することを特徴とする。[Means for Solving the Problems] The laser processing cut piece discharge device of the present invention has a material (base material)
Therefore, the range in which the material (base material) and the cut pieces are connected on a plane and the material (base material) and the cut pieces do not overlap during the time from just before the end of the specified processing until the end of discharge. It is characterized by having a mechanism that regulates the
[作用]
本発明によれば、材料(母材)と切断片とを所定の加工
が終了する直前から排出が終了するまでの時間に、材料
(母材)と切断片とを平面上で接続し、かつ、材料(母
材)と切断片とが重ならない範囲に規制させる機構を有
することにより、材料(母材)と切断片とが、切断面で
確実に移動させることが容易に可能となり、切断片排出
のために、稼動中の機械を一時停止させることを不用と
し、排出作業の危険を除去すると共に、長時間安定稼動
を可能にできる。[Function] According to the present invention, the material (base material) and the cut pieces are connected on a plane during the period from just before the predetermined processing of the material (base metal) and the cut pieces ends until the discharge is finished. In addition, by having a mechanism that restricts the material (base material) and cut pieces to a range where they do not overlap, it becomes possible to easily move the material (base metal) and cut pieces reliably on the cutting surface. It is not necessary to temporarily stop the machine in operation for discharging cut pieces, eliminating the danger of discharging work, and enabling stable operation for a long time.
[実施例] 以下に、本発明の実施例を図面にもとづいて説明する。[Example] Embodiments of the present invention will be described below based on the drawings.
第1図において、本発明のレーザ加工切断片排出装置が
、レーザ加工終了直前に作動した一例を示す。ワーク受
け4上の材料(母材)1と切断片2は、クランプろの移
動により切断面で接触し排出案内6の位置に向かって移
動する。しかし、材料1と切断片2の上には、排出案内
8が、材料1の板厚の2倍以下に設定した位置に設置さ
れているため、クランプ6にて移動しても、材料1と切
断片2は、重なることなく排出位置に移動できる。排出
案内8は、案内取付ブロック9に固着され、軸受10に
案内された案内軸17と係合され、連結板12により、
エアシリンダ取付板16に固着したエアシリンダ14の
駆動により上下方向に滑動できる。排出案内8を上下に
移動させるのは、レーザ加工終了直後に、材料1の移動
をさせるためレーザヘッド7が上向きに移動し、レーザ
ヘッド取付部と同−取り付けでは、材料1の板厚の2倍
以下の位置に、排出案内8の位置を保持することが困難
であることによる。第2図は、材料(母材)と切断片と
を平面上で接続する一例を示す。材料(母材)1と切断
片2を、排出案内8(棒状)で接続している。排出案内
8は、材料子より硬度の低い材質が望ましい、又、形状
は、棒状、板状2回転体等が考えられる。排出案内8が
レーザヘッドの左右にあるのは、レーザ加工終了位置が
任意の位置であっても対応可能とするためである。第3
図は、従来技術による、2枚重ね排出不良を示す、ワー
ク受はフレーム5に固着され、材料1と点接触で回転接
触するワーク受け4の上に、切断片2が、材料(母材)
1の下に入り2枚重ねとなり、材料1と切断片2とは、
切断面で接触できず、排出位置まで移動させることがで
きない。材料1は、クランプ6にて把持されている。第
4図は、本発明における排出完了を示す。材料1の切断
面に接触して移動した切断片2は、排出案内8により、
排出位置まで2枚重ねせずに移動でき、排出プレート6
上を滑動落下し排出される。FIG. 1 shows an example in which the laser-processed cut piece discharging device of the present invention operates immediately before the end of laser processing. The material (base material) 1 on the workpiece receiver 4 and the cut piece 2 come into contact with each other at the cut surfaces due to the movement of the clamp filter, and move toward the position of the discharge guide 6. However, because the discharge guide 8 is installed above the material 1 and the cut piece 2 at a position set to be less than twice the thickness of the material 1, even if it is moved by the clamp 6, the material 1 The cut pieces 2 can be moved to the discharge position without overlapping. The discharge guide 8 is fixed to a guide mounting block 9 and engaged with a guide shaft 17 guided by a bearing 10, and is connected by a connecting plate 12.
It can slide vertically by driving the air cylinder 14 fixed to the air cylinder mounting plate 16. The reason why the ejection guide 8 is moved up and down is that the laser head 7 moves upward to move the material 1 immediately after the laser processing is completed, and when the laser head is attached in the same manner as the laser head attachment part, it is This is due to the fact that it is difficult to maintain the position of the discharge guide 8 at a position that is less than double the position. FIG. 2 shows an example of connecting a material (base material) and a cut piece on a plane. A material (base material) 1 and a cut piece 2 are connected by a discharge guide 8 (rod-shaped). The discharge guide 8 is desirably made of a material with lower hardness than the material, and its shape may be a rod-like, plate-like two-rotator, or the like. The reason why the discharge guides 8 are provided on the left and right sides of the laser head is to enable the laser processing to be completed at any position. Third
The figure shows a double sheet ejection failure according to the conventional technology.
Material 1 and cut piece 2 are placed under 1 and become two layers, and material 1 and cut piece 2 are
It cannot be touched at the cutting surface and cannot be moved to the discharge position. The material 1 is held by a clamp 6. FIG. 4 shows the completion of discharge in the present invention. The cut pieces 2 that have moved in contact with the cut surface of the material 1 are moved by the discharge guide 8.
It can be moved to the ejection position without stacking two sheets, and the ejection plate 6
It slides down and is ejected.
[発明の効果]
本発明のレーザ加工切断片排出装置は、以上説明したよ
うに、レーザ加工機において、材料(母材)より所定の
加工が終了する直前から排出が終了するまでの時間に、
材料(母材)と切断片とが重ならない範囲に規制させる
機構を有することにより、切断面で確実に移動させるこ
とが容易に可能となり、切断片排出が安定し、作業者の
危険を除去させ、長時間安定稼動を可能にできる効果が
ある。[Effects of the Invention] As explained above, the laser-processed cut piece discharging device of the present invention, in a laser processing machine, can process a material (base material) from just before a predetermined process is completed to when discharging is completed.
By having a mechanism that restricts the material (base material) and cut pieces to a range where they do not overlap, it is possible to easily move them reliably on the cutting surface, stabilizing the discharge of cut pieces, and eliminating danger to workers. This has the effect of enabling stable operation for long periods of time.
第1図は、本発明のレーザ加工切断片排出装置が、レー
ザ加工終了直前に作動した一例図。
第2図は、本発明の材料(母材)と切断片とを平面上で
接続する一例図。
第6図は、従来技術による、2枚重ね排出不良を示す図
。
第4図は、本発明における排出完了を示す図。
1・・・・・・・・・材料(母材)
2−−−−・−・切断片
5・・・・・・・・・クランプ
4−・・・・−・ワーク受け
5・・・・・・・・・ワーク受はフレーム6・・・・・
・・・・排出プレート
7−・・・・・・・レーザヘッド
8・・・・・・・・・排出案内
9・・・・・・・・・案内取付ブロック0・・・−・・
・軸 受
1・・・・・・・・・案内軸
2・・・・・・・・・連結板
3・・・・・・・・・エアシリンダ取付板4・・・・・
・・・・エアシリンダFIG. 1 is an example diagram in which the laser-processed cut piece discharging device of the present invention operates immediately before the end of laser processing. FIG. 2 is a diagram showing an example of connecting the material (base material) of the present invention and a cut piece on a plane. FIG. 6 is a diagram showing a double sheet ejection failure according to the prior art. FIG. 4 is a diagram showing completion of discharge in the present invention. 1... Material (base material) 2-------... Cut piece 5... Clamp 4-... Work receiver 5...・・・・・・The work receiver is frame 6...
...Ejection plate 7 - ...Laser head 8 ...Ejection guide 9 ...Guide mounting block 0 ...
・Bearing 1...Guide shaft 2...Connecting plate 3...Air cylinder mounting plate 4...
····Air cylinder
Claims (1)
終了する直前から排出が終了するまでの時間に、材料(
母材)と切断片とを平面上で接続し、かつ、材料(母材
)と切断片とが重ならない範囲に規制させる機構を有す
ることを特徴とする、レーザ加工切断片排出装置。In a laser processing machine, the material (base material) is removed from the material (base material) during the period from just before the specified processing ends until the end of ejection.
1. A laser-processed cut piece discharging device characterized by having a mechanism that connects a material (base material) and a cut piece on a plane and restricts the material (base material) and the cut piece to a range in which they do not overlap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2128744A JPH0422594A (en) | 1990-05-18 | 1990-05-18 | Laser beam cut piece discharging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2128744A JPH0422594A (en) | 1990-05-18 | 1990-05-18 | Laser beam cut piece discharging device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0422594A true JPH0422594A (en) | 1992-01-27 |
Family
ID=14992387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2128744A Pending JPH0422594A (en) | 1990-05-18 | 1990-05-18 | Laser beam cut piece discharging device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422594A (en) |
-
1990
- 1990-05-18 JP JP2128744A patent/JPH0422594A/en active Pending
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