JPH0421564A - Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate - Google Patents

Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate

Info

Publication number
JPH0421564A
JPH0421564A JP2164812A JP16481290A JPH0421564A JP H0421564 A JPH0421564 A JP H0421564A JP 2164812 A JP2164812 A JP 2164812A JP 16481290 A JP16481290 A JP 16481290A JP H0421564 A JPH0421564 A JP H0421564A
Authority
JP
Japan
Prior art keywords
alumina substrate
zirconia
powder
alumina
pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2164812A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Horibe
Takao Nakada
Akihito Iwai
Masato Taya
Hideaki Uehara
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP10118890 priority Critical
Application filed by Hitachi Chem Co Ltd filed Critical Hitachi Chem Co Ltd
Priority to JP2164812A priority patent/JPH0421564A/en
Publication of JPH0421564A publication Critical patent/JPH0421564A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To readily obtain a substrate, having a smooth surface and hardly causing grain growth of alumina and zirconia by burning a formed product of a mixture containing alumina powder, zirconia powder and stabilizer powder for the zirconia, an organic binder, etc., in a specific proportion.
CONSTITUTION: With 60-90 pts.wt. alumina powder, are mixed 10-40 pts.wt. zirconia powder and stabilizer powder for the zirconia, an organic binder, a plasticizer and a solvent. The resultant mixture is then formed to provide a formed compact, which is then burned. Thereby, an alumina substrate containing 60-90 pts.wt. alumina having ≤5μm average crystal grain diameter and 10-40 pts.wt. zirconia and stabilizer for the zirconia having ≥80% tetragonal phase is obtained.
COPYRIGHT: (C)1992,JPO&Japio
JP2164812A 1990-04-17 1990-06-22 Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate Pending JPH0421564A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10118890 1990-04-17
JP2164812A JPH0421564A (en) 1990-04-17 1990-06-22 Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2164812A JPH0421564A (en) 1990-04-17 1990-06-22 Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate

Publications (1)

Publication Number Publication Date
JPH0421564A true JPH0421564A (en) 1992-01-24

Family

ID=26442102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2164812A Pending JPH0421564A (en) 1990-04-17 1990-06-22 Alumina substrate, production of the same alumina substrate and wiring board using the same alumina substrate

Country Status (1)

Country Link
JP (1) JPH0421564A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1514856A1 (en) * 2003-09-10 2005-03-16 Kyocera Corporation Alumina/zirconia ceramics and method of producing the same
JP2007269524A (en) * 2006-03-30 2007-10-18 Kyocera Corp Insulating ceramic, ceramic heater using the same and heater integrated element
WO2010114126A1 (en) * 2009-04-03 2010-10-07 株式会社住友金属エレクトロデバイス Sintered ceramic and substrate comprising same for semiconductor device
JP2013032265A (en) * 2011-07-01 2013-02-14 Maruwa Co Ltd Alumina zirconia sintered board for semiconductor device and manufacturing method therefor
JP2015032604A (en) * 2013-07-31 2015-02-16 京セラ株式会社 Insulation substrate for electronic component and electronic component
WO2016208766A1 (en) * 2015-06-26 2016-12-29 京セラ株式会社 Ceramic substrate and mounting substrate using same, and electronic device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1514856A1 (en) * 2003-09-10 2005-03-16 Kyocera Corporation Alumina/zirconia ceramics and method of producing the same
JP2007269524A (en) * 2006-03-30 2007-10-18 Kyocera Corp Insulating ceramic, ceramic heater using the same and heater integrated element
WO2010114126A1 (en) * 2009-04-03 2010-10-07 株式会社住友金属エレクトロデバイス Sintered ceramic and substrate comprising same for semiconductor device
JP4717960B2 (en) * 2009-04-03 2011-07-06 株式会社住友金属エレクトロデバイス Ceramic sintered body and substrate for semiconductor device using the same
CN102395540A (en) * 2009-04-03 2012-03-28 株式会社住友金属电设备 Sintered ceramic and substrate comprising same for semiconductor device
JP2013032265A (en) * 2011-07-01 2013-02-14 Maruwa Co Ltd Alumina zirconia sintered board for semiconductor device and manufacturing method therefor
JP2015032604A (en) * 2013-07-31 2015-02-16 京セラ株式会社 Insulation substrate for electronic component and electronic component
WO2016208766A1 (en) * 2015-06-26 2016-12-29 京セラ株式会社 Ceramic substrate and mounting substrate using same, and electronic device
JPWO2016208766A1 (en) * 2015-06-26 2018-04-19 京セラ株式会社 Ceramic substrate, mounting substrate using the same, and electronic device

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