JPH042097B2 - - Google Patents
Info
- Publication number
- JPH042097B2 JPH042097B2 JP59010550A JP1055084A JPH042097B2 JP H042097 B2 JPH042097 B2 JP H042097B2 JP 59010550 A JP59010550 A JP 59010550A JP 1055084 A JP1055084 A JP 1055084A JP H042097 B2 JPH042097 B2 JP H042097B2
- Authority
- JP
- Japan
- Prior art keywords
- paper
- foam
- phenolic resin
- surface material
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 58
- 239000006260 foam Substances 0.000 claims description 49
- 239000011888 foil Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000005011 phenolic resin Substances 0.000 claims description 15
- 239000011134 resol-type phenolic resin Substances 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 14
- 239000011162 core material Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229920001568 phenolic resin Polymers 0.000 claims description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000005187 foaming Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 1
- 239000000123 paper Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004604 Blowing Agent Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010425 asbestos Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000019256 formaldehyde Nutrition 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical compound ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- DDMOUSALMHHKOS-UHFFFAOYSA-N 1,2-dichloro-1,1,2,2-tetrafluoroethane Chemical compound FC(F)(Cl)C(F)(F)Cl DDMOUSALMHHKOS-UHFFFAOYSA-N 0.000 description 1
- QPVRKFOKCKORDP-UHFFFAOYSA-N 1,3-dimethylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CC(C)(O)CC=C1 QPVRKFOKCKORDP-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- 238000003855 Adhesive Lamination Methods 0.000 description 1
- VOPWNXZWBYDODV-UHFFFAOYSA-N Chlorodifluoromethane Chemical compound FC(F)Cl VOPWNXZWBYDODV-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004338 Dichlorodifluoromethane Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 1
- 229940087091 dichlorotetrafluoroethane Drugs 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000004079 fireproofing Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229940029284 trichlorofluoromethane Drugs 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
Description
本発明は耐火性、防火性にすぐれたフエノール
樹脂発泡体断熱パネル及びその製造方法に関す
る。
フエノール樹脂発泡体は、耐火性、断熱性など
が特にすぐれており、金属箔などの耐火性の表面
材を積層一体化して、耐火性、防火性のすぐれた
断熱パネルとして建築材料などに使用されてきて
いる。
この種の断熱パネルを製造するには従来一定方
向に一定速度で進行する片側の表面材上に発泡体
形成用混合液を供給し、発泡させながら、他側表
面材を発泡体表面に供給し、樹脂の発泡硬化を完
了させて、発泡体を芯材とし、両側表面に表面材
を積層一体化させて製造する方法が一般的に行わ
てれいる。
しかしながらレゾール型フエノール樹脂発泡体
を生成させる過程において、フエノール樹脂、硬
化剤中に含まれる水分、などが発泡時に表面材と
発泡体との接着を悪くする欠点があり、特に表面
材が金属箔などの気体不透過性の場合は殆んどパ
ネルの製造が不可能でさえあつた。
またパネルに成形した後も芯材のフエノール発
泡体中には残存水分があり、断熱パネルの小口だ
けからの外部への蒸発排出だけでは不充分であ
り、表面材が膨出したり剥れたりすることが生じ
た。
本発明は金属箔のような気体不透性の表面材を
使用しても前記のような欠点がなく容易に良品質
の断熱パネルを製造し得、また長期にわたつて安
定した良品質のフエノール樹脂発泡体断熱パネル
を提供することを目的とするものである。
すなわち本発明のフエノール樹脂発泡体断熱パ
ネルは、レゾール型フエノール樹脂発泡体を芯材
とし、その両表面に、少なくとも紙と金属箔を積
層一体化した表面材の紙面を接着し、金属箔を最
外層として積層一体化してなる断熱パネルであつ
て、片側表面材には多数の小孔を形成してなるこ
とを特徴とするものである。
また本発明はそのような断熱パネルを製造する
に際し、少なくとも紙と金属箔を積層一体化した
表面材の紙面に自己発泡硬化性レゾール型フエノ
ール樹脂発泡体混合液を供給し、発泡させ、つい
で該発泡体表面に少なくとも紙と金属箔を積層一
体化させ、かつ多数の小孔を形成した表面材の紙
面を当接させ、発泡体芯材の両表面に表面材を積
層一体形成することを特徴とするものである。
以下図面実施例に従い説明する。
本発明の製造方法は、第1図に示す如き原理の
装置を使用して行われる。第1図に示すように表
面材2上に自己発泡硬化性レゾール型フエノール
樹脂発泡体混合液7を供給、発泡させ、孔径0.01
〜3.0mm、孔数1000000個/m2以下の孔をあけた他
の表面材1を発泡体上に供給し、ダブルコンベア
ー9内にて発泡、硬化させ、フエノール樹脂発泡
体断熱パネル10を連続的に製造するものであ
る。
表面材2は、紙、接着剤、金属箔からなる面材
であり、紙面にレゾール型フエノール樹脂発泡体
混合液が供給できるように固定する。面材には、
面材のシワ防止等を考慮し、適正なテンシヨンを
かける。
表面材1は、ロール8又は他の方法により、孔
径0.01〜3.0mm、孔数1000000個/m2以下の孔をあ
け、レゾール型フエノール樹脂発泡体上に供給す
る。
ロール8は、金属又はラバーロールいずれでも
よい。又、孔径、孔数は、ロール上の針と面材の
テンシヨンにより自由にコントロール出来る。
レゾール型フエノール樹脂発泡体は、レゾール
型フエノール樹脂初期縮合物と界面活性剤を適正
比に混合した液3、発泡剤4、硬化剤5を適正比
に定量ポンプで混合機6に送給し、回転数1000〜
10000rpmの混合機で連続的に撹拌混合し、吐出
口より吐出される。
表面材2の上に吐出された混合液7は直ちに泡
化してクリーム状となる。その後混合液の上に孔
あき表面材1をのせる。この泡化物は、縮合反応
による反応熱でさらに泡化及び硬化が進行し、ダ
ブルコンベアー9により、一定の厚味の断熱パネ
ルを得る事が出来る。
この様にして得られた断熱パネルは、カツター
11により、一定寸法にカツトされ、第2図に示
すような断熱パネル製品10となる。
本発明に使用する表面材は少なくとも紙と金属
箔を積層一体化したものであり、紙が発泡体と強
力に接着し、金属箔によつて耐火性、防火性、強
度が付与される。紙と金属箔の他に他材料を複層
させることも可能である。
紙は必要な性能と軽量化との観点から、重量が
50〜700g/m2、好ましくは60〜500g/m2のもの
であればどのような種類のものでも使用すること
ができる。使用する紙としては例えばクラフト
紙、ダンボール紙、Kライナー紙、石綿紙、ガラ
ス不織布、無機不燃紙などがある。
紙を使用する理由は、芯材となるレゾール型フ
エノール樹脂発泡体の自己接着性による面材との
接着一体化に際し、発泡体との接着性が良好であ
り、強固に芯材と面材を接着積層させることであ
る。
金属箔は、アルミニウム箔、鋼箔、鉄箔、銅箔
などがある。金属箔の厚味は7μmから100μm、好
ましくは15μmから50μmが良い。金属箔は、防錆
のために金属箔の表又は表裏面に表面処理層を積
層してもよい。表面処理層としては、亜鉛、ニツ
ケル、スズ等の電気メツキ層、リン酸処理層、ク
ロム酸処理層、塗料層、合成樹脂シート層があ
る。
紙と金属箔を接着する接着剤としては、熱可塑
性樹脂、熱硬化性樹脂のどちらでもよい。熱可塑
性樹脂としては、ポリエチレン樹脂、ポリプロピ
レン樹脂共重合系ポリエチレン樹脂(アイオノマ
ーを含む)等があり、又熱硬化性樹脂としては、
ウレタン樹脂、メラミン樹脂、ユリア樹脂、エポ
キシ樹脂、フエノール樹脂等がある。
表面材1の孔は孔径0.01〜3.0mm好ましくは0.1
〜1.0mm、孔数1000000個/m2以下好ましくは10〜
1000個/m2が良い。0.01mm未満の場合、フエノー
ル樹脂発泡体より発生する水分の透過性が悪くな
り、紙と発泡体との接着不良を起こすので好まし
くない。又、3.0mmより大きい場合、フエノール
樹脂が面材よりはみ出して来るので好ましくな
い。
表面材1に孔をあける方法としては、紙と金属
箔を積層する際に、又は断熱パネル製造前に孔を
あける方法のどちらでも良く、特に限定するもの
でない。この様に、表面材に小孔を設けることに
より、従来のパネル製造時の問題点(表面材とフ
オームの接着不良、フオーム中の水分の除去不充
分など)を解決することができる。然も、上記の
如き小孔であるから表面材に設けた孔による弊害
を未然に防ぐことができる。
本発明に使用するレゾール型フエノール樹脂発
泡体は、ホルムアルデヒド類/フエノール類のモ
ル比が1.0〜2.5好ましくは1.2〜2.0で含水率が5
〜35%好ましくは10〜25%のレゾール型フエノー
ル樹脂および界面活性剤、発泡剤、酸性硬化剤、
添加剤等から構成される。
ホルムアルデヒド類としては、ホルムアルデヒ
ド、パラホルムアルデヒド、ポリオキシメチレン
等があり単独使用又は併用する。フエノール類と
しては、フエノール、o−クレゾール、m−クレ
ゾール、p−クレゾール、3.5キシレノール、ナ
フトール等があり単独使用又は併用する。
界面活性剤としては、非イオン系界面活性剤、
カチオン系又はアニオン系界面活性剤、シリコー
ン系界面活性剤等があり単独使用又は併用する。
発泡剤としては、ハロゲン化炭化水素類が使用で
きる。例えば、ジクロロジフルオロメタン、トリ
クロロモノフルオロメタン、メチレンジクロロメ
タン、モノクロロジフルオロメタン、トリクロロ
トリフルオロエタン、ジクロロテトラフルオロエ
タンなどがあり単独使用又は併用できる。酸性硬
化剤としては、無機酸又は/及び有機酸が使用で
きる。
本発明によつて得られるフエノール樹脂発泡体
断熱パネルの特徴は下記のとおりである。
1 発泡体と面材の接着が良く、パネルの反り、
変形がない。
2 金属箔をパネルの両面に使用する事が出来、
パネルの剛性が増大する。
3 耐熱性、難熱性の優れるフエノール樹脂発泡
体を芯材に使用し、面材に金属箔を使用してい
るために耐火性に優れ、準不燃材料試験及び耐
火試験に合格する。
4 芯材にフエノール樹脂発泡体を使用している
ために断熱性に優れる。
5 フエノール樹脂発泡体中に存在する水分の除
去が容易である。
以上の如く本発明によると、反り、変形がな
く、パネルの剛性が高く、かつ耐火性、防火性に
すぐれたレゾール型フエノール樹脂発泡体断熱パ
ネルを容易に得ることができ、広く建材分野に使
用することができる。
次に実施例により本発明を具体的に説明する
が、本発明はこの実施例に限定されるものではな
い。
実施例 1
表−1に示す反応混合物を6000rpmの混合機で
撹拌、混合し、下面材(300g/m2、石綿紙、10
g/m2接着剤、20μアルミ箔)の石綿紙面上に連
続的に吐出する。下面材は10m/分の一定速度で
ダブルコンベアー方向に進み、下面材と同じ構成
で孔径0.6mm、孔数200個/m2の上面材がフエノー
ル樹脂発泡体上に供給され、ダブルコンベアーに
よつて30mm厚味、巾1000mmの連続した断熱パネル
を製造した。
得られた断熱パネルは、面材と発泡体の接着が
良く、耐火性、耐熱性の優れたパネルであつた。
実施例 2〜4
面材の孔径と孔数を変えた実施例−1と同様に
断熱パネルを製造した。
得られた断熱パネルは、面材と発泡体の接着が
良く、耐火性、耐熱性の優れたパネルであつた。
実施例 5,6
面材の種類を変え、実施例−1と同様に断熱パ
ネルを製造した。
得られた断熱パネルは、面材と発泡体の接着が
良く、耐火性、耐熱性の優れたパネルであつた。
実施例 7,8
発泡体の配合、パネルの厚味を変えた実施例−
1と同様に断熱パネルを製造した。
得られた断熱パネルは、面材と発泡体の接着が
良く、耐火性、耐熱性の優れたパネルであつた。
比較例 1
面材に孔をあけずに実施例−1と同様に断熱パ
ネルを製造した。
得られた断熱パネルは、面材と発泡体の接着が
悪く、一部面材が剥離する箇所があつた。
The present invention relates to a phenolic foam insulation panel with excellent fire resistance and fire prevention properties, and a method for manufacturing the same. Phenol resin foam has particularly excellent fire resistance and heat insulation properties, and is used as a building material by laminating and integrating fire-resistant surface materials such as metal foil to create heat-insulating panels with excellent fire resistance and fire-retardant properties. It's coming. Conventionally, to manufacture this type of insulation panel, a foam-forming mixture is supplied onto the surface material on one side moving in a fixed direction at a constant speed, and while foaming, the surface material on the other side is supplied onto the surface of the foam. A commonly used manufacturing method is to complete foaming and curing of the resin, use the foam as a core material, and integrate and laminate surface materials on both surfaces. However, in the process of producing resol type phenolic resin foam, there is a drawback that moisture contained in the phenolic resin and curing agent deteriorates the adhesion between the surface material and the foam during foaming, especially when the surface material is metal foil, etc. In the case of gas impermeability, it was almost impossible to manufacture panels. In addition, even after being formed into a panel, there is residual moisture in the core material phenol foam, and it is not sufficient to evaporate it to the outside only from the edges of the insulation panel, causing the surface material to bulge or peel. Something happened. The present invention does not have the above-mentioned drawbacks even if a gas-impermeable surface material such as metal foil is used, and high-quality insulation panels can be easily manufactured. The object of the present invention is to provide a resin foam insulation panel. That is, the phenolic resin foam insulation panel of the present invention uses a resol-type phenolic resin foam as a core material, and adheres to both surfaces of the core material the paper surface of a surface material that is an integrated lamination of at least paper and metal foil. This is a heat insulating panel formed by laminating and integrating the outer layer, and is characterized by having a large number of small holes formed in the surface material on one side. Further, when manufacturing such a heat insulating panel, the present invention provides a self-foaming hardening resol type phenolic resin foam mixture to the paper surface of a surface material made by laminating and integrating at least paper and metal foil, foams it, and then The feature is that at least paper and metal foil are laminated and integrated on the surface of the foam, and the paper surface of the surface material with a large number of small holes is brought into contact with the surface material, and the surface material is laminated and integrally formed on both surfaces of the foam core material. That is. The following will explain the embodiments according to the drawings. The manufacturing method of the present invention is carried out using an apparatus based on the principle shown in FIG. As shown in FIG. 1, a self-foaming hardening resol type phenolic resin foam mixture 7 is supplied onto the surface material 2 and foamed, with a pore diameter of 0.01.
Another surface material 1 with holes of ~3.0 mm and 1,000,000 holes/ m2 or less is supplied onto the foam, foamed and cured in a double conveyor 9, and a phenolic resin foam insulation panel 10 is continuously formed. It is manufactured in a specific manner. The surface material 2 is a surface material made of paper, adhesive, and metal foil, and is fixed to the paper surface so that the resol type phenolic resin foam mixture can be supplied. For the facing material,
Apply appropriate tension to prevent wrinkles on the surface material. The surface material 1 is provided with holes having a diameter of 0.01 to 3.0 mm and a number of holes of 1,000,000 holes/m 2 or less using a roll 8 or other method, and then supplied onto the resol type phenolic resin foam. The roll 8 may be either a metal or a rubber roll. Further, the hole diameter and number of holes can be freely controlled by the tension of the needle on the roll and the face material. The resol type phenolic resin foam is produced by feeding a liquid 3, which is a mixture of a resol type phenolic resin initial condensate and a surfactant in an appropriate ratio, a blowing agent 4, and a curing agent 5 in an appropriate ratio, to a mixer 6 using a metering pump. Rotation speed 1000~
The mixture is continuously stirred and mixed with a mixer at 10,000 rpm, and then discharged from the discharge port. The liquid mixture 7 discharged onto the surface material 2 immediately foams and becomes cream-like. After that, the perforated surface material 1 is placed on top of the mixed liquid. This foamed material is further foamed and hardened by the reaction heat caused by the condensation reaction, and a heat insulating panel with a certain thickness can be obtained by the double conveyor 9. The heat insulating panel thus obtained is cut to a certain size by a cutter 11, resulting in a heat insulating panel product 10 as shown in FIG. The surface material used in the present invention is an integrated lamination of at least paper and metal foil, and the paper strongly adheres to the foam, and the metal foil provides fire resistance, fireproofing properties, and strength. It is also possible to use multiple layers of other materials in addition to paper and metal foil. From the viewpoint of necessary performance and weight reduction, paper is
Any type of material having a weight of 50 to 700 g/m 2 , preferably 60 to 500 g/m 2 can be used. Examples of the paper used include kraft paper, cardboard paper, K liner paper, asbestos paper, glass nonwoven fabric, and inorganic nonflammable paper. The reason for using paper is that the self-adhesive properties of the resol-type phenolic resin foam that serves as the core material provide good adhesion with the foam, allowing for strong bonding between the core material and the facing material. It is adhesive lamination. Metal foils include aluminum foil, steel foil, iron foil, copper foil, etc. The thickness of the metal foil is preferably 7 μm to 100 μm, preferably 15 μm to 50 μm. The metal foil may have a surface treatment layer laminated on the front or front and back surfaces of the metal foil for rust prevention. Examples of the surface treatment layer include an electroplated layer of zinc, nickel, tin, etc., a phosphoric acid treated layer, a chromic acid treated layer, a paint layer, and a synthetic resin sheet layer. The adhesive for bonding the paper and metal foil may be either a thermoplastic resin or a thermosetting resin. Thermoplastic resins include polyethylene resins, polypropylene copolymerized polyethylene resins (including ionomers), and thermosetting resins include:
There are urethane resins, melamine resins, urea resins, epoxy resins, phenolic resins, etc. The pores of the surface material 1 have a pore diameter of 0.01 to 3.0 mm, preferably 0.1 mm.
~1.0mm, number of holes 1,000,000/ m2 or less, preferably 10~
1000 pieces/ m2 is good. If it is less than 0.01 mm, the permeability of water generated from the phenolic resin foam will be poor, resulting in poor adhesion between the paper and the foam, which is not preferable. Moreover, if it is larger than 3.0 mm, the phenol resin will protrude from the face material, which is not preferable. The method of making holes in the surface material 1 is not particularly limited, and may be any method of making holes when laminating paper and metal foil or before manufacturing a heat insulating panel. By providing small holes in the surface material in this manner, problems encountered in conventional panel manufacturing (such as poor adhesion between the surface material and the foam, insufficient removal of moisture from the foam, etc.) can be solved. However, since the holes are small as described above, it is possible to prevent the harmful effects caused by the holes provided in the surface material. The resol type phenolic resin foam used in the present invention has a formaldehyde/phenol molar ratio of 1.0 to 2.5, preferably 1.2 to 2.0, and a water content of 5.
~35% preferably 10-25% resol type phenolic resin and surfactant, blowing agent, acidic curing agent,
Consists of additives, etc. Formaldehydes include formaldehyde, paraformaldehyde, polyoxymethylene, etc., and are used alone or in combination. Examples of phenols include phenol, o-cresol, m-cresol, p-cresol, 3.5 xylenol, naphthol, and the like, which are used alone or in combination. As surfactants, nonionic surfactants,
Cationic or anionic surfactants, silicone surfactants, etc. are used alone or in combination.
As the blowing agent, halogenated hydrocarbons can be used. Examples include dichlorodifluoromethane, trichloromonofluoromethane, methylene dichloromethane, monochlorodifluoromethane, trichlorotrifluoroethane, and dichlorotetrafluoroethane, which can be used alone or in combination. As the acidic curing agent, inorganic acids and/or organic acids can be used. The characteristics of the phenolic resin foam insulation panel obtained by the present invention are as follows. 1 Good adhesion between the foam and surface material, preventing panel warping,
No deformation. 2 Metal foil can be used on both sides of the panel,
The stiffness of the panel increases. 3. Phenol resin foam with excellent heat resistance and heat resistance is used for the core material, and metal foil is used for the face material, so it has excellent fire resistance and passes the quasi-noncombustible material test and fire resistance test. 4 Excellent heat insulation properties due to the use of phenolic resin foam for the core material. 5. Water present in the phenolic resin foam can be easily removed. As described above, according to the present invention, it is possible to easily obtain a resol-type phenolic resin foam insulation panel that does not warp or deform, has high panel rigidity, and has excellent fire resistance and fire prevention properties, and is widely used in the field of construction materials. can do. EXAMPLES Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to these Examples. Example 1 The reaction mixture shown in Table 1 was stirred and mixed with a mixer at 6000 rpm, and the bottom material (300 g/m 2 , asbestos paper, 10
g/m 2 adhesive, 20μ aluminum foil) is continuously discharged onto the asbestos paper surface. The bottom material advances in the direction of the double conveyor at a constant speed of 10 m/min, and the top material with the same configuration as the bottom material with a hole diameter of 0.6 mm and 200 holes/ m2 is fed onto the phenolic resin foam, and then transported by the double conveyor. We manufactured a continuous insulation panel with a thickness of 30 mm and a width of 1000 mm. The resulting heat insulating panel had good adhesion between the face material and the foam, and was excellent in fire resistance and heat resistance. Examples 2 to 4 Insulating panels were manufactured in the same manner as in Example 1, except that the pore diameter and number of pores in the face material were changed. The resulting heat insulating panel had good adhesion between the face material and the foam, and was excellent in fire resistance and heat resistance. Examples 5 and 6 A heat insulating panel was manufactured in the same manner as in Example 1, except that the type of face material was changed. The resulting heat insulating panel had good adhesion between the face material and the foam, and was excellent in fire resistance and heat resistance. Examples 7 and 8 Examples with different foam formulations and panel thickness-
A heat insulating panel was manufactured in the same manner as in Example 1. The resulting heat insulating panel had good adhesion between the face material and the foam, and was excellent in fire resistance and heat resistance. Comparative Example 1 A heat insulating panel was manufactured in the same manner as in Example-1 without making holes in the face material. In the resulting heat insulating panel, the adhesion between the face material and the foam was poor, and there were some areas where the face material peeled off.
【表】【table】
【表】【table】
第1図は、本発明の方法を実施するのに適する
装置の概念図、第2図は、本発明によつて得られ
た断熱パネルの斜視図である。
1……孔あき表面材、2……表面材、3……レ
ゾール型フエノール樹脂初期縮合物と界面活性剤
の混合液、4……発泡剤、5……硬化剤、6……
混合機、7……混合液、8……孔あけ用ロール、
9……ダブルコンベアー、10……フエノール樹
脂発泡体断熱パネル、11……カツター、12…
…孔。
FIG. 1 is a conceptual diagram of an apparatus suitable for carrying out the method of the invention, and FIG. 2 is a perspective view of a heat-insulating panel obtained according to the invention. 1... Porous surface material, 2... Surface material, 3... Mixed liquid of resol type phenolic resin initial condensate and surfactant, 4... Foaming agent, 5... Curing agent, 6...
Mixer, 7...Mixed liquid, 8...Drilling roll,
9...Double conveyor, 10...Phenol resin foam insulation panel, 11...Cutter, 12...
...hole.
Claims (1)
し、その両表面に、少なくとも紙と金属箔を積層
一体化した表面材の紙面を接着し、金属箔を最外
層として積層一体化してなる断熱パネルであつ
て、片側表面材には多数の小孔を形成してなるこ
とを特徴とするフエノール樹脂発泡体断熱パネ
ル。 2 少なくとも紙と金属箔を積層一体化した表面
材の紙面に自己発泡硬化性レゾール型フエノール
樹脂発泡体混合液を供給し、発泡させ、ついで該
発泡体表面に少なくとも紙と金属箔を積層一体化
させ、かつ多数の小孔を形成した表面材の紙面を
当接させ、発泡体芯材の両表面に表面材を積層一
体成形することを特徴とするフエノール樹脂発泡
体断熱パネルの製造方法。[Scope of Claims] 1. A resol-type phenolic resin foam is used as a core material, and on both surfaces thereof, the paper side of a surface material made by laminating and integrating at least paper and metal foil is adhered, and the metal foil is laminated and integrated as the outermost layer. What is claimed is: 1. A phenolic resin foam insulation panel characterized by having a large number of small holes formed in one side surface material. 2 Supplying and foaming a self-foaming hardening resol type phenolic resin foam mixture to the paper surface of the surface material in which at least paper and metal foil are laminated and integrated, and then laminating at least paper and metal foil on the surface of the foam. A method for manufacturing a phenolic resin foam heat insulating panel, which comprises: laminating and integrally molding the surface material on both surfaces of a foam core material by bringing the paper surface of the surface material having a large number of small holes into contact with each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1055084A JPS60154053A (en) | 1984-01-24 | 1984-01-24 | Phenol resin form heat-insulating panel and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1055084A JPS60154053A (en) | 1984-01-24 | 1984-01-24 | Phenol resin form heat-insulating panel and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60154053A JPS60154053A (en) | 1985-08-13 |
JPH042097B2 true JPH042097B2 (en) | 1992-01-16 |
Family
ID=11753363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1055084A Granted JPS60154053A (en) | 1984-01-24 | 1984-01-24 | Phenol resin form heat-insulating panel and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60154053A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009525441A (en) * | 2006-01-30 | 2009-07-09 | キングスパン・ホールディングス・(アイアールエル)・リミテッド | Phenolic foam board |
WO2019189840A1 (en) * | 2018-03-30 | 2019-10-03 | 旭化成建材株式会社 | Phenol resin foam laminate plate and production method therefor |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01178413A (en) * | 1988-01-08 | 1989-07-14 | Nec Corp | Peeling mechanism |
JPH01107713U (en) * | 1988-01-11 | 1989-07-20 | ||
JPH0649297B2 (en) * | 1989-06-02 | 1994-06-29 | 東洋ゴム工業株式会社 | Flame-retardant heat insulating material and manufacturing method thereof |
JPH07247677A (en) * | 1994-01-19 | 1995-09-26 | Shinden:Kk | Panel and manufacture thereof |
JPH10226016A (en) * | 1997-02-12 | 1998-08-25 | Sekisui Plastics Co Ltd | Heat insulation panel and concrete curing room using the panel |
JP2000204689A (en) * | 1999-01-08 | 2000-07-25 | Daicel Chem Ind Ltd | Composite heat insulating material |
JP2003321886A (en) * | 2002-05-01 | 2003-11-14 | Panahome Corp | Heat-insulating backing panel for building |
FI20060569A0 (en) * | 2006-06-08 | 2006-06-08 | Walki Wisa Oy | Film product and process for its preparation |
JP5698891B2 (en) * | 2007-06-21 | 2015-04-08 | アキレス株式会社 | Non-combustible internal insulation panel |
JP6904732B2 (en) * | 2017-03-01 | 2021-07-21 | 積水化学工業株式会社 | Foamed resin laminate |
JP6936080B2 (en) * | 2017-08-25 | 2021-09-15 | 積水化学工業株式会社 | Foam resin laminated board |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583858A (en) * | 1981-06-30 | 1983-01-10 | 昭和アルミニウム株式会社 | Heat insulating panel |
JPS583860A (en) * | 1981-06-30 | 1983-01-10 | 昭和アルミニウム株式会社 | Heat insulating panel |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57189838U (en) * | 1981-05-27 | 1982-12-02 |
-
1984
- 1984-01-24 JP JP1055084A patent/JPS60154053A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583858A (en) * | 1981-06-30 | 1983-01-10 | 昭和アルミニウム株式会社 | Heat insulating panel |
JPS583860A (en) * | 1981-06-30 | 1983-01-10 | 昭和アルミニウム株式会社 | Heat insulating panel |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009525441A (en) * | 2006-01-30 | 2009-07-09 | キングスパン・ホールディングス・(アイアールエル)・リミテッド | Phenolic foam board |
WO2019189840A1 (en) * | 2018-03-30 | 2019-10-03 | 旭化成建材株式会社 | Phenol resin foam laminate plate and production method therefor |
JPWO2019189840A1 (en) * | 2018-03-30 | 2021-01-14 | 旭化成建材株式会社 | Phenol resin foam laminate and its manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
JPS60154053A (en) | 1985-08-13 |
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