JPH04208453A - Manufacture of plastic molded object with conductive circuit - Google Patents

Manufacture of plastic molded object with conductive circuit

Info

Publication number
JPH04208453A
JPH04208453A JP2403979A JP40397990A JPH04208453A JP H04208453 A JPH04208453 A JP H04208453A JP 2403979 A JP2403979 A JP 2403979A JP 40397990 A JP40397990 A JP 40397990A JP H04208453 A JPH04208453 A JP H04208453A
Authority
JP
Japan
Prior art keywords
mold
molding
metal
plastic
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2403979A
Other languages
Japanese (ja)
Other versions
JPH07119019B2 (en
Inventor
Akira Yotsutsuji
晃 四ッ辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KOOKI ENG YUGEN
Original Assignee
KOOKI ENG YUGEN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KOOKI ENG YUGEN filed Critical KOOKI ENG YUGEN
Priority to JP2403979A priority Critical patent/JPH07119019B2/en
Publication of JPH04208453A publication Critical patent/JPH04208453A/en
Publication of JPH07119019B2 publication Critical patent/JPH07119019B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the production cost by a method in which the sheet in which the woven cloth or unwoven cloth of inorganic fiber or organic fiber, etc., is coated with the method of low melting point in the shape of an electric circuit, is inserted in a mold, and said mold is filled with plastic material. CONSTITUTION:The woven cloth or the unwoven cloth produced by using glass fiber or organic fiber is coated with suitable metallic amount into a necessary shape by using the spray gun of metal with the melting point of 47-300 deg.C, whereby an aimed sheet is made. Said sheet is fitted into the mold for molding thermoplastic resin. When the mold is filled with the material melted at high temperature, the metallic particle coated with resin is instantaneously softened by the heat of the resin material at high temperature, while the metallic particle is pushed against the surface of the mold. Further, the metal and fiber material melted and softened by the material-filling pressure of the thermoplastic resin in injection molding are pushed against the mold wall with high pressure, whereby the metal becomes a metallic film and is cooled on the mold surface. Consequently, the film of conductive circuit excellent in uniformity and adhesion may be molded on the surface of the plastic.

Description

【発明の詳細な説明】 (イ)産業上の利用分野本発明は無機質繊維、有機質繊
維等より製造された織物あるいは不織布に融点が70℃
から300℃を示す金属を電気回路形状に塗布したシー
ト(以後シートと称す)をプラスチック成形金型中に挿
入し、プラスチックの表面に電気回路を一体不可分に形
成した成形品の製造方法に関する6本発明によって製造
された成形品はプラスチックの絶縁体に電気回路が一体
的に形成されているので、その成形品は電気部品9発熱
体、静電防止9等の用途に使用される。
Detailed Description of the Invention (a) Industrial Application Field The present invention applies to woven or non-woven fabrics made of inorganic fibers, organic fibers, etc. that have a melting point of 70°C.
6 books related to a method of manufacturing a molded product in which a sheet (hereinafter referred to as a sheet) coated with a metal having a temperature of 300°C to 300°C in the shape of an electric circuit is inserted into a plastic mold, and an electric circuit is inseparably formed on the surface of the plastic. Since the molded product manufactured according to the invention has an electric circuit integrally formed on a plastic insulator, the molded product can be used as a heating element for electrical parts 9, an antistatic device 9, and the like.

(ロ)従来の技術 一般に見かけらる電気部品、制御ボックス、自動車内装
部品等はプラスチックで各種形状のケース、ボックス。
(b) Conventional technology Electrical parts, control boxes, automobile interior parts, etc. that are commonly seen are made of plastic and come in various shapes of cases and boxes.

構造体を製造し、つぎにプリント基板等の電気回路を組
込み、さらに電線等によって結線されて製造されている
。しかしそのような工程をできるかぎり簡素化したいと
いった要望はあらゆる分野で数多く見掛けられる。こう
いった要望に対応するため2例えば、銅箔を貼ったプラ
スチックフィルムを用いて、化学エツチング法等によっ
て各種電気回路を形成し、これに接着材等を塗布し。
The structure is manufactured by manufacturing a structure, then incorporating an electric circuit such as a printed circuit board, and then connecting it with electric wires or the like. However, there are many requests to simplify such processes as much as possible in all fields. In order to meet these demands, 2. For example, various electrical circuits are formed using a chemical etching method using a plastic film covered with copper foil, and then an adhesive or the like is applied to this.

この接着材を介して、プラスチック材料を射出成形、あ
るいは圧縮成形で一体化する方法は現在工業的に行われ
ている4 しかしこの方法では、プラスチックフィルム
に金属箔をはりつける工程、化学的エッチング工程、接
着材を塗布する工程等が必要で生産コスト高を招いてい
る。また金属箔の伸び率が低いため9例えば前記フィル
ムを金型においてプラスチックを充填すると、簡単な形
状であれば材料の充填圧力によって形状づけられるが。
The method of integrating plastic materials through this adhesive by injection molding or compression molding is currently being carried out industrially4. However, this method involves a process of gluing metal foil onto a plastic film, a chemical etching process, The process of applying adhesive is required, leading to high production costs. Furthermore, since the elongation rate of metal foil is low, for example, if the film is placed in a mold and filled with plastic, a simple shape can be formed by the filling pressure of the material.

伸び率が要求されるような用途では金属回路が切断され
、目的の電気回路をプラスチックに表面に形成できない
といった問題点がある。またフィルムに塗布する接着材
はプラスチック材料の種類によって種々選択しなければ
ならない、もしこの選択が不適性であると、得られた成
形品は全く実用に耐えないものとなる。さらに、収縮が
大きく、難接着性のプラスチック材料例えば、ポリエチ
レン、ポリプロピレン、ポリアセタール7ボリブチレン
テレフタレートといった材料ではどのような接着材を用
いても金属箔とプラスチックを接着できないといったこ
とも大きな難点である。
In applications where a high elongation rate is required, there is a problem in that the metal circuit is cut, making it impossible to form the desired electrical circuit on the surface of the plastic. Furthermore, the adhesive applied to the film must be selected from among various types depending on the type of plastic material; if this selection is inappropriate, the resulting molded product will be completely unusable. Another major drawback is that plastic materials that shrink significantly and are difficult to adhere to, such as polyethylene, polypropylene, and polyacetal 7-bolybutylene terephthalate, cannot be bonded to metal foil and plastic no matter what adhesive is used.

(ハ)発明が解決しようとする問題点 本発明は従来技術が抱えている前記問題点、すなわち。(c) Problems that the invention attempts to solve The present invention solves the above-mentioned problems faced by the prior art, namely.

どのような形状品の表面にも電気回路が簡単に一体的に
形成できること、電気回路の形成工程を成形と同時に行
うこと、どのようなプラスチック材料にも電気回路が一
体不可分に形成できること7生産コストが安価であるこ
と、接着材等を必要としないことなどの問題点を根本的
に解決することにある。
An electric circuit can be easily and integrally formed on the surface of any shaped product, the process of forming an electric circuit can be performed at the same time as molding, and an electric circuit can be formed inseparably into any plastic material 7. Production cost The aim is to fundamentally solve problems such as low cost and no need for adhesives.

(ニ)問題点を解決するための手段 本発明は前記手法と全く異なる手法でプラスチックの表
面に電気回路を形成するものである。この目的に使用す
るシート及びこれを用いての成形品製造方法についてよ
り詳しく述べる4すなわち、ガラス繊維、有機繊維等を
用いて製造された織物、あるいは不織布に融点が47〜
300℃の金属(以下金属と称す)を例えば、メタルス
プレーガンを用いて必要な形状に適量塗布してシートを
作成する4 この状態では塗布された金属は繊維状物の
表面に粒子状あるいは鱗片状で仮付着されたままである
(d) Means for Solving the Problems The present invention forms an electric circuit on the surface of plastic using a method completely different from the above method. The sheet used for this purpose and the method for producing molded products using the same will be described in more detail.4 In other words, woven fabrics or nonwoven fabrics made of glass fibers, organic fibers, etc. have a melting point of 47 to
A sheet is created by applying an appropriate amount of 300℃ metal (hereinafter referred to as metal) into the required shape using a metal spray gun.4 In this state, the applied metal forms particles or scales on the surface of the fibrous material. It remains temporarily attached.

これを例えば熱可塑性樹脂成形用金型に装着し、高温で
溶融された成形材料を充填してゆくと、塗装された金属
粒子は金型の表面に押し付けられるとともに高温の材料
の熱によって瞬時に軟化する。さらに熱可塑性樹脂の射
出成形は300〜2000kg/cm2もの高圧の材料
充填圧力を掛けることが一般的条件であるので、溶融軟
化した金属及び繊維状物は材料によって金型壁に高圧で
押し付けられ、その結果、金属は完全な金属薄膜となっ
て金型表面で冷却される。結果としてプラスチック表面
に金属膜を成形金型中で瞬時に形成できることとなる。
For example, when this is attached to a thermoplastic resin mold and filled with molding material melted at high temperature, the coated metal particles are pressed against the surface of the mold and are instantly heated by the high temperature material. soften. Furthermore, the general condition for injection molding of thermoplastic resin is to apply a high material filling pressure of 300 to 2000 kg/cm2, so the molten and softened metal and fibrous material are pressed against the mold wall by the material under high pressure. As a result, the metal becomes a perfect thin metal film and is cooled on the mold surface. As a result, a metal film can be instantaneously formed on the plastic surface in a mold.

(ホ)作用 成形で形成された金属薄膜はその外面が金属調となると
ともに使用した繊維材料によって補強された形態となる
。さらに繊維状物には数多くの凹凸や空隙が残存してい
るが、この部分にはプラスチック材料が充填され、なん
ら接着材を使用しなくとも、プラスチックとシート材間
には強固な接合が行われる。またどのようなプラスチッ
ク材料とも強固な接合ができ、いままでは接着材がみあ
たらずに、金属との接合が不可能とされていた。ポリエ
チレン、ポリプロピレン、アセタール樹脂ポリブチレン
テレフタレート、ポリスチレン変性ポリフェニレンオキ
サイド等にも完全な一体化電気伝導膜を形成することが
できた。その他のプラスチック、例えば、ポリスチレン
、ポリカーボネート、ポリウレタン、ポリイミド、ポリ
アミド、塩化ビニル、ABS樹脂、AS樹脂、アクリル
樹脂、繊維素プラスチック、その多いわゆるボリマーア
ロイといわれる樹脂、スーパエンジニアリング樹脂等は
もちろん本発明に使用できる。また熱硬化性樹脂にも本
発明のシートは使用できる4例えば、不飽和ポリエステ
ル樹脂主成分とする。BMC,SMC,エポキシ樹脂成
形材料、ジアリールフタレート樹脂等を成形する加熱さ
れた金型に本発明のシートを置き、この上に前記熱硬化
性樹脂成形材料を置き、金型を高圧で型締めし、材料が
硬化後成形品を取り出すといった工程、すなわち圧縮成
形でも、その成形品に表面に均一でしかもきれいな外観
を示す成形品が得られた本発明のシート製造に使用する
繊維材料は織物であればその織り方、不織布であればそ
の繊維長およびバインダーを調節すれば金属薄膜では得
られない大きな伸び率をもたせることも可能で9例えば
100%以上の伸び率とすることもできる。このためど
のような複雑形状品にも導電層を形成することができ、
またシートがどのように延ばされた状態であっても、最
終的にかけられる材料充填圧力と温度によって金属粒子
は薄膜となるので、プラスチックの表面には、均一でし
かも欠損のない導電膜回路を形成することができる0本
発明に使用する金属は特に限定しないが使用目的によっ
て金属そのもの、あるいは合金として使用される。その
選択の目安は使用するプラスチック材料の可塑化温度、
成形するときの金型温度、成形材料からの熱量、要求さ
れる耐熱性、金属薄膜に要求される特性等である6例え
ば、その−例をあげると、錫−ビスマスーインジューム
ー鉛合金(融点47℃)、ビスマス−鉛−錫合金(融点
96℃)、錫−インジュム合金(融点117℃)、ビス
マス−錫合金(融点138℃)、錫−鉛−カドミューム
合金(融点145℃)、錫亜鉛合金(融点199℃)、
カドミュームーアンチモン合金(融点292℃)、その
他車−成分金属としては、すす、鉛、ビスマス等融点が
300℃以下の金属が使用できる(へ)実施例 実施例1 ポリエステル繊維、レーヨン繊維、硝子繊維、綿繊維。
(e) The metal thin film formed by action forming has a metallic appearance on its outer surface and is reinforced by the fiber material used. Furthermore, there are many unevenness and voids left in the fibrous material, but these parts are filled with plastic material, and a strong bond is created between the plastic and the sheet material without using any adhesive. . It can also be strongly bonded to any plastic material, and until now it was thought impossible to bond it to metal because no adhesive was found. Completely integrated electrically conductive membranes could be formed on polyethylene, polypropylene, acetal resin polybutylene terephthalate, polystyrene-modified polyphenylene oxide, etc. Other plastics such as polystyrene, polycarbonate, polyurethane, polyimide, polyamide, vinyl chloride, ABS resin, AS resin, acrylic resin, cellulose plastic, resins called so-called polymer alloys, super engineering resins, etc. can of course be used in the present invention. can. The sheet of the present invention can also be used with thermosetting resins.4 For example, the sheet may have an unsaturated polyester resin as its main component. The sheet of the present invention is placed in a heated mold for molding BMC, SMC, epoxy resin molding material, diaryl phthalate resin, etc., the thermosetting resin molding material is placed on top of this, and the mold is clamped under high pressure. Even in the process of taking out the molded product after the material has hardened, that is, compression molding, a molded product with a uniform and clean appearance on the surface can be obtained. By adjusting the weave of the grass, the fiber length, and the binder of nonwoven fabrics, it is possible to provide a large elongation rate that cannot be obtained with metal thin films.9 For example, it is possible to achieve an elongation rate of 100% or more. Therefore, a conductive layer can be formed on products with any complex shape.
In addition, no matter how the sheet is stretched, the metal particles will form a thin film depending on the final material filling pressure and temperature applied, so a uniform and defect-free conductive film circuit can be formed on the surface of the plastic. The metal used in the present invention is not particularly limited, but the metal itself or an alloy may be used depending on the purpose of use. The guideline for selection is the plasticization temperature of the plastic material used,
The temperature of the mold during molding, the amount of heat from the molding material, the required heat resistance, the characteristics required of the metal thin film, etc. 47℃), bismuth-lead-tin alloy (melting point 96℃), tin-indum alloy (melting point 117℃), bismuth-tin alloy (melting point 138℃), tin-lead-cadmium alloy (melting point 145℃), tin zinc Alloy (melting point 199°C),
Cadmu-antimony alloy (melting point 292°C), other car component metals such as soot, lead, bismuth, etc. with melting points of 300°C or less can be used.Examples Example 1 Polyester fibers, rayon fibers, glass Textile, cotton fiber.

より作られた織物および不織布を用意し、この表面に融
点が96℃のビスマス−鉛−錫合金、融点が145℃の
錫−鉛一カドミューム合金をメタルスプレーガンを用い
て9回路形状に1平方センチメートル当たり金属の量が
0.03g、0.05g、0.08gとなるよう塗布し
てシートを作成した。 一方型締圧力が100屯の射出
成形機を用意しこれに100mm角、厚さ3mmの成形
品が成形できる金型を取り付けた。 成形材料はポリプ
ロピレン、ABS、ポリカーボネートを用いた。成形金
型を80℃に調節し、開いた金型の間に前記シートを挟
み込んで標準的な成形条件で成形した。得られた成形品
の外観、金属層とプラスチックの密着性、電気伝導度等
について試験した。
A bismuth-lead-tin alloy with a melting point of 96°C and a tin-lead-cadmium alloy with a melting point of 145°C are applied to the surface of the woven and non-woven fabrics using a metal spray gun in the shape of 9 circuits of 1 square centimeter. Sheets were prepared by applying the metal in amounts of 0.03 g, 0.05 g, and 0.08 g. On the other hand, an injection molding machine with a mold clamping pressure of 100 tons was prepared, and a mold capable of forming a molded product of 100 mm square and 3 mm thick was attached to it. The molding materials used were polypropylene, ABS, and polycarbonate. The molding mold was adjusted to 80° C., and the sheet was sandwiched between the open molds and molded under standard molding conditions. The resulting molded product was tested for appearance, adhesion between the metal layer and plastic, electrical conductivity, etc.

1、外観試験 繊維の種類(織物)  金属の融点 成形品外観ポリエ
ステル    96℃    良好レーヨン     
 96     良好綿          96  
   良好硝子        96     良好繊
維の種類、不織布  金属の融点 成形品外観ポリエス
テル   145℃    良好レーヨン     1
45     良好綿        145    
 良好硝子       145     良好上記結
果はプラスチック材料としてポリカーボネートを用いた
結果であるが、ABS、ポリプロピレンも同様の結果を
示した。金属の塗布量は0.05g/cm2である。金
属塗布量が少ない場合は金属調の光沢がやや失われ、多
い場合は極めて滑らかな外観を示した。
1. Appearance test Type of fiber (fabric) Melting point of metal Molded product appearance Polyester 96℃ Good rayon
96 Good cotton 96
Good glass 96 Good type of fiber, non-woven fabric Melting point of metal Molded product appearance Polyester 145°C Good Rayon 1
45 Good cotton 145
Good Glass 145 Good The above results were obtained using polycarbonate as the plastic material, but ABS and polypropylene also showed similar results. The amount of metal applied was 0.05 g/cm2. When the amount of metal applied was small, the metallic luster was slightly lost, and when it was applied in a large amount, the appearance was extremely smooth.

24密着試験(90°剥離 ) 繊維の種類(織物) 金属の融点 密着力ポリエステル
    96℃   材質破壊レーヨン       
96      /I綿          96  
    /l硝子        96 繊維の種類、不織布  金属の融点 密着力ポリエステ
ル   145℃    材質破壊レーヨン     
145       /I綿         145
       〃硝子       145     
  !I上記結果は成形材料としてポリプロピレンを、
金属は0.05g/cm2で成形した試料に付いて測定
した結果である4 実施例2 熱硬化性樹脂での成形についての実施例を示す使用シー
ト材料 繊維の種類、不織布 金属の融点 塗布量ポリエステル
   145℃  0.05g/cm2レーヨン   
  145   0.05//綿         1
45    0.05/1硝子       145 
  0.057/使用成形材料 MC 不飽和ポリエステル樹脂  30% ガラス繊維(マット)    30% 炭酸カルシューム     10% タルク           20% 増粘材           9% 硬化材          045% 顔料           0. 5%100mm角、
厚さ3mmの成形品が成形できる圧縮成形金型を圧縮成
形機に取り付け、金型温度を150°に調節した。この
金型に上記のシートを置き、このうえに計量したSMC
をおいて150 k g/cm2の圧力で型締し、5分
で材料を硬化させた。金型を開いて成形品を取り出し各
種試験を行った。
24 adhesion test (90° peeling) Type of fiber (fabric) Melting point of metal Adhesion strength Polyester 96℃ Material failure rayon
96 /I cotton 96
/l glass 96 Type of fiber, non-woven fabric Melting point of metal Adhesion polyester 145℃ Material destruction rayon
145 /I cotton 145
〃Glass 145
! I The above results show that polypropylene is used as the molding material,
Metal is the result of measurement on a sample molded at 0.05 g/cm2 Example 2 Showing an example of molding with thermosetting resin Sheet material used Type of fiber, non-woven fabric Melting point of metal Coating amount Polyester 145℃ 0.05g/cm2 Rayon
145 0.05//cotton 1
45 0.05/1 glass 145
0.057/MC of molding material used Unsaturated polyester resin 30% Glass fiber (matte) 30% Calcium carbonate 10% Talc 20% Thickener 9% Hardening material 045% Pigment 0. 5% 100mm square,
A compression molding mold capable of molding a molded product with a thickness of 3 mm was attached to a compression molding machine, and the mold temperature was adjusted to 150°. Place the above sheet in this mold and weigh the SMC on top of it.
The mold was then clamped under a pressure of 150 kg/cm2, and the material was cured in 5 minutes. The mold was opened, the molded product was taken out, and various tests were conducted.

外観試験:鏡面の光沢を示した。Appearance test: Showed mirror gloss.

密着力 :完全一体化し、材質破壊した導電性 :すべ
での回路は0.005ミリオーム以下の抵抗値を示した
Adhesion: Complete integration, material destruction Conductivity: All circuits showed a resistance value of 0.005 milliohm or less.

実施例3 300メツシユ以下に粉砕した金属粉(融点96℃)1
00gと5gのアクリル樹脂、溶剤よりなる印刷用イン
クを製造し、スクリーン印刷法で不織布上に印刷した。
Example 3 Metal powder pulverized to 300 mesh or less (melting point 96°C) 1
Printing inks consisting of 00 g and 5 g of acrylic resin and solvent were produced and printed on a nonwoven fabric using a screen printing method.

インクの乾燥段階では導電性を示さなかったが、このシ
ートを金型に押入して、ポリプロピレンを成形材料とし
て射出成形したところ、実施例1,2.で得られたもの
とほぼ同一特性を示す電気回路を成形品面上に形成する
ことが出来た。
Although the ink did not exhibit conductivity during the drying stage, when this sheet was pressed into a mold and injection molded using polypropylene as the molding material, Examples 1 and 2. We were able to form an electric circuit on the surface of the molded product that had almost the same characteristics as the one obtained in .

(ト)発明の効果 本発明では種々な融点を示す金属材料を適切な方法6例
えば金属溶射装置等を用いて、各種繊維基材の表面に回
路形状に塗布したシート材、あるいは微粉状金属を少量
の樹脂と混合したインクを適切な形状にスクリーン印刷
したものを、射出成形、圧縮成形、トランスファ成形等
に用いる金型中に挿入し、プラスチック材料の材料熱。
(g) Effects of the Invention In the present invention, metal materials exhibiting various melting points are applied to the surface of various fiber base materials in a circuit shape using an appropriate method 6, such as a metal spraying device, or a finely powdered metal is coated onto the surface of various fiber base materials. Ink mixed with a small amount of resin is screen-printed into an appropriate shape and inserted into a mold used for injection molding, compression molding, transfer molding, etc. to heat the plastic material.

金型温度あるいは圧力を利用して9粒状あるいは鱗片状
金属を溶融軟化させてプラスチック表面に均質でしかも
密着性の高い導電性回路薄膜を一工程で形成できること
である。さらに本発明ではどのようなプラスチック材料
にも適用が可能で、さらに優れている点は、なんら接着
材を使用せずして、金属層とプラスチック層を強固に金
型中で一体化できることである。また繊維基材を適切に
選択すれば、大きな伸び性が得られるため、従来の金属
では達成できなかった深い絞り形状品まで適用できるこ
と、すなわち複雑形状品に対応できることも大きな長所
である6以上の利点の他に、工業生産において工程が簡
単であること、大がかりな装置が不用なこと:生産性が
優れていること等の理由によって成形品の大幅なコスト
低減が可能である。
It is possible to form a homogeneous and highly adhesive conductive circuit thin film on a plastic surface in one step by melting and softening metal particles or scales using mold temperature or pressure. Furthermore, the present invention can be applied to any plastic material, and a further advantage is that the metal layer and plastic layer can be firmly integrated in a mold without using any adhesive. . In addition, if the fiber base material is appropriately selected, large elongation properties can be obtained, so it can be applied to products with deep drawing shapes that could not be achieved with conventional metals. In addition to the advantages, it is possible to significantly reduce the cost of molded products due to the simple process in industrial production, no need for large-scale equipment, and excellent productivity.

Claims (2)

【特許請求の範囲】[Claims] 1.射出成形,圧縮成形,トランスファ成形,等の成形
方法で行うプラスチックの成形で,その成形品の表面に
電気伝導性回路を形成するために無機質繊維,有機質繊
維等より製造された織物あるいは不織布に融点が47℃
から300℃を示す金属を電気回路状に溶射塗布,ある
いはスクリーン印刷したシートを射出成形,圧縮成形,
トランスファ成形等の成形時の金型の片面あるいは両面
に配置し,シートが外層となるようにしてその内面にプ
ラスチック材料を射出成形,圧縮成形あるいはトランス
ファ成形法を用いてプラスチック材料を充填し,材料の
熱あるいは金型の電熱さらには材料の充填圧力で,挿入
されたシート中の粒状金属を溶融圧延し,繊維あるいは
不織布層に強固に複合化し,さらに,充填されたプラス
チックとも一体化して製造する電気回路を形成した成形
品の製造方法。
1. In plastic molding performed by injection molding, compression molding, transfer molding, etc., melting point is applied to woven or non-woven fabrics made from inorganic fibers, organic fibers, etc. in order to form electrically conductive circuits on the surface of the molded product. is 47℃
A sheet of metal that exhibits a temperature of 300°C to 300°C is spray-coated or screen-printed in the shape of an electrical circuit, and is then injection molded, compression molded,
It is placed on one or both sides of a mold during molding such as transfer molding, and the inner surface is filled with plastic material using injection molding, compression molding, or transfer molding, with the sheet serving as the outer layer. The granular metal in the inserted sheet is melted and rolled using the heat from the mold, the electric heat from the mold, and the filling pressure of the material, and is strongly composited into a fiber or nonwoven layer, and is also integrated with the filled plastic to manufacture it. A method of manufacturing a molded product with an electric circuit formed thereon.
2.特許請求範囲第1項によって製造された成形品。2. A molded article manufactured according to claim 1.
JP2403979A 1990-12-01 1990-12-01 Method for manufacturing plastic molded article having conductive circuit Expired - Fee Related JPH07119019B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2403979A JPH07119019B2 (en) 1990-12-01 1990-12-01 Method for manufacturing plastic molded article having conductive circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2403979A JPH07119019B2 (en) 1990-12-01 1990-12-01 Method for manufacturing plastic molded article having conductive circuit

Publications (2)

Publication Number Publication Date
JPH04208453A true JPH04208453A (en) 1992-07-30
JPH07119019B2 JPH07119019B2 (en) 1995-12-20

Family

ID=18513683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2403979A Expired - Fee Related JPH07119019B2 (en) 1990-12-01 1990-12-01 Method for manufacturing plastic molded article having conductive circuit

Country Status (1)

Country Link
JP (1) JPH07119019B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841740B2 (en) 2000-06-14 2005-01-11 Ngk Spark Plug Co., Ltd. Printed-wiring substrate and method for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6841740B2 (en) 2000-06-14 2005-01-11 Ngk Spark Plug Co., Ltd. Printed-wiring substrate and method for fabricating the same

Also Published As

Publication number Publication date
JPH07119019B2 (en) 1995-12-20

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