JPH042071U - - Google Patents
Info
- Publication number
- JPH042071U JPH042071U JP1990042984U JP4298490U JPH042071U JP H042071 U JPH042071 U JP H042071U JP 1990042984 U JP1990042984 U JP 1990042984U JP 4298490 U JP4298490 U JP 4298490U JP H042071 U JPH042071 U JP H042071U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin
- wiring board
- printed wiring
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990042984U JPH042071U (bg) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990042984U JPH042071U (bg) | 1990-04-19 | 1990-04-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH042071U true JPH042071U (bg) | 1992-01-09 |
Family
ID=31555007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990042984U Pending JPH042071U (bg) | 1990-04-19 | 1990-04-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH042071U (bg) |
-
1990
- 1990-04-19 JP JP1990042984U patent/JPH042071U/ja active Pending