JPH0420587U - - Google Patents
Info
- Publication number
- JPH0420587U JPH0420587U JP6083090U JP6083090U JPH0420587U JP H0420587 U JPH0420587 U JP H0420587U JP 6083090 U JP6083090 U JP 6083090U JP 6083090 U JP6083090 U JP 6083090U JP H0420587 U JPH0420587 U JP H0420587U
- Authority
- JP
- Japan
- Prior art keywords
- hinge
- width
- door
- fittings
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Hinges (AREA)
- Securing Of Glass Panes Or The Like (AREA)
- Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
Description
第１図は斜視図である。
１……蝶番、２……側板、３……側板、４……
ドア、５，５′……樋端、６……呑み込み穴、７
……ナツクル部、８……辺、９……一方の稜線、
１０……他方の稜線、ｔ……見込み幅。
FIG. 1 is a perspective view. 1... Hinge, 2... Side plate, 3... Side plate, 4...
Door, 5, 5'...Gutter end, 6...Swallow hole, 7
...Natsukuru part, 8...side, 9...one ridgeline,
10...Other ridgeline, t...Expected width.
Claims (1)
側板の幅を、それぞれ、ドアの見込み幅と同一と
したことを特徴とする建具用蝶番。 A hinge for fittings, characterized in that the hinge is coated with a concealing color, and the width of the two side plates of the hinge is the same as the expected width of the door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6083090U JPH0420587U (en) | 1990-06-08 | 1990-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6083090U JPH0420587U (en) | 1990-06-08 | 1990-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420587U true JPH0420587U (en) | 1992-02-20 |
Family
ID=31588540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6083090U Pending JPH0420587U (en) | 1990-06-08 | 1990-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420587U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148354A (en) * | 1995-11-22 | 1997-06-06 | Nec Corp | Die for encapsulating semiconductor with resin |
-
1990
- 1990-06-08 JP JP6083090U patent/JPH0420587U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09148354A (en) * | 1995-11-22 | 1997-06-06 | Nec Corp | Die for encapsulating semiconductor with resin |