JPH042028U - - Google Patents
Info
- Publication number
- JPH042028U JPH042028U JP1990043300U JP4330090U JPH042028U JP H042028 U JPH042028 U JP H042028U JP 1990043300 U JP1990043300 U JP 1990043300U JP 4330090 U JP4330090 U JP 4330090U JP H042028 U JPH042028 U JP H042028U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- tip
- comes
- chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図Aは本考案を適用するW/B用キヤピラ
リーの一例を示す説明図、第1図Bは第1図Aの
先端部の部分拡大図、第2図は第1図Aのキヤピ
ラリーに本考案を実施した場合の例を示す部分拡
大図、第3図は第1図Aに示した一例でおこる不
具合の様子を示した部分拡大図である。 1……ワイヤー通抜穴、2……接触部、3……
ダイアモンド膜、4……摩耗部。
リーの一例を示す説明図、第1図Bは第1図Aの
先端部の部分拡大図、第2図は第1図Aのキヤピ
ラリーに本考案を実施した場合の例を示す部分拡
大図、第3図は第1図Aに示した一例でおこる不
具合の様子を示した部分拡大図である。 1……ワイヤー通抜穴、2……接触部、3……
ダイアモンド膜、4……摩耗部。
Claims (1)
- 半導体ICチツプを基板やリードフレーム等に
電気的に接続するワイヤーボンデイング工程用の
機械(以降、W/Bと略記する)のワイヤーを前
記基板やリードフレーム等に接合するためのキヤ
ピラリーにおいて、被接合部と接触するキヤピラ
リーの先端部表面をダイアモンドでコーテイング
した事を特徴とするキヤピラリーの構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990043300U JPH042028U (ja) | 1990-04-23 | 1990-04-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990043300U JPH042028U (ja) | 1990-04-23 | 1990-04-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH042028U true JPH042028U (ja) | 1992-01-09 |
Family
ID=31555600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990043300U Pending JPH042028U (ja) | 1990-04-23 | 1990-04-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH042028U (ja) |
-
1990
- 1990-04-23 JP JP1990043300U patent/JPH042028U/ja active Pending