JPH042028U - - Google Patents

Info

Publication number
JPH042028U
JPH042028U JP1990043300U JP4330090U JPH042028U JP H042028 U JPH042028 U JP H042028U JP 1990043300 U JP1990043300 U JP 1990043300U JP 4330090 U JP4330090 U JP 4330090U JP H042028 U JPH042028 U JP H042028U
Authority
JP
Japan
Prior art keywords
capillary
tip
comes
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990043300U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990043300U priority Critical patent/JPH042028U/ja
Publication of JPH042028U publication Critical patent/JPH042028U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • H01L2224/78302Shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図Aは本考案を適用するW/B用キヤピラ
リーの一例を示す説明図、第1図Bは第1図Aの
先端部の部分拡大図、第2図は第1図Aのキヤピ
ラリーに本考案を実施した場合の例を示す部分拡
大図、第3図は第1図Aに示した一例でおこる不
具合の様子を示した部分拡大図である。 1……ワイヤー通抜穴、2……接触部、3……
ダイアモンド膜、4……摩耗部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ICチツプを基板やリードフレーム等に
    電気的に接続するワイヤーボンデイング工程用の
    機械(以降、W/Bと略記する)のワイヤーを前
    記基板やリードフレーム等に接合するためのキヤ
    ピラリーにおいて、被接合部と接触するキヤピラ
    リーの先端部表面をダイアモンドでコーテイング
    した事を特徴とするキヤピラリーの構造。
JP1990043300U 1990-04-23 1990-04-23 Pending JPH042028U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990043300U JPH042028U (ja) 1990-04-23 1990-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990043300U JPH042028U (ja) 1990-04-23 1990-04-23

Publications (1)

Publication Number Publication Date
JPH042028U true JPH042028U (ja) 1992-01-09

Family

ID=31555600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990043300U Pending JPH042028U (ja) 1990-04-23 1990-04-23

Country Status (1)

Country Link
JP (1) JPH042028U (ja)

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