JPH042026U - - Google Patents
Info
- Publication number
- JPH042026U JPH042026U JP1990041830U JP4183090U JPH042026U JP H042026 U JPH042026 U JP H042026U JP 1990041830 U JP1990041830 U JP 1990041830U JP 4183090 U JP4183090 U JP 4183090U JP H042026 U JPH042026 U JP H042026U
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- needles
- paste mounting
- predetermined area
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990041830U JPH042026U (enExample) | 1990-04-19 | 1990-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990041830U JPH042026U (enExample) | 1990-04-19 | 1990-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042026U true JPH042026U (enExample) | 1992-01-09 |
Family
ID=31552834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990041830U Pending JPH042026U (enExample) | 1990-04-19 | 1990-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042026U (enExample) |
-
1990
- 1990-04-19 JP JP1990041830U patent/JPH042026U/ja active Pending