JPH04202517A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH04202517A JPH04202517A JP33965590A JP33965590A JPH04202517A JP H04202517 A JPH04202517 A JP H04202517A JP 33965590 A JP33965590 A JP 33965590A JP 33965590 A JP33965590 A JP 33965590A JP H04202517 A JPH04202517 A JP H04202517A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- component
- formula
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 46
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 46
- 239000000203 mixture Substances 0.000 title claims abstract description 24
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract 2
- 125000000962 organic group Chemical group 0.000 claims abstract 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 abstract description 18
- 239000000853 adhesive Substances 0.000 abstract description 16
- 238000005470 impregnation Methods 0.000 abstract description 5
- 150000003512 tertiary amines Chemical class 0.000 abstract description 3
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- 238000007718 adhesive strength test Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 150000004075 acetic anhydrides Chemical class 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- -1 boron trifluoride amine Chemical class 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000002257 embryonic structure Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、耐熱接着性および含浸性に優れたエポキシ
樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an epoxy resin composition with excellent heat-resistant adhesive properties and impregnating properties.
従来から、モータの鉄心に巻回された絶縁コイルやトラ
ンスに組み込まれるコイル等の含浸固着用接着剤として
は、エポキシ樹脂組成物が汎用されている。上記エポキ
シ樹脂組成物としては、例えばビスフェノールＡ型エポ
キシ樹脂、ノボラック型エポキシ樹脂、脂環型エポキシ
樹脂等のエポキシ樹脂を主成分とし、これに酸無水物、
ポリアミン等の硬化剤、三級アミン、イミダゾール等の
硬化促進剤、−充填剤、その他の添加剤を配合したもの
が知られている。Conventionally, epoxy resin compositions have been widely used as adhesives for impregnating and fixing insulated coils wound around the iron core of motors, coils incorporated in transformers, and the like. The above-mentioned epoxy resin composition contains an epoxy resin such as a bisphenol A epoxy resin, a novolak epoxy resin, or an alicyclic epoxy resin as a main component, and an acid anhydride,
Products containing curing agents such as polyamines, curing accelerators such as tertiary amines and imidazole, fillers, and other additives are known.
そして、最近、モータの小形化および高性能化に伴い、
モータに組み込まれるコイルの含浸固着に用いられるコ
イル含浸用樹脂組成物には、含浸性に冨み、かつ高温雰
囲気下において連続使用に耐えうるもの、特に熱履歴に
よる接着力低下の少ないものが要求されている。Recently, with the miniaturization and higher performance of motors,
The coil impregnating resin composition used for impregnating and fixing coils incorporated in motors is required to have high impregnating properties and to be able to withstand continuous use in high-temperature atmospheres, and in particular, to have little decrease in adhesive strength due to thermal history. has been done.
（発明が解決しようとする課題〕
しかしながら、上記要求に対して従来のエポキシ樹脂組
成物で対応することは困難である。一方、耐熱性に優れ
たものとして、マレイミド樹脂を主剤とする樹脂組成物
があげられるが、このマレイミド樹脂組成物を用いると
、耐熱性は向上するものの形成塗膜が跪く、機械的強度
が低下し、その結果、接着力が大幅に低下するという問
題が生じる。また、上記マレイミド樹脂は、エポキシ樹
脂と比較して反応の進行が遅いため、硬化時間も長くな
り、作業性の低下を招くという問題を有している。(Problems to be Solved by the Invention) However, it is difficult to meet the above requirements with conventional epoxy resin compositions.On the other hand, resin compositions containing maleimide resin as a main ingredient have been proposed as having excellent heat resistance. However, when this maleimide resin composition is used, although the heat resistance is improved, the formed coating film is weak, the mechanical strength is reduced, and as a result, the adhesive strength is significantly reduced.Also, The above-mentioned maleimide resin has a problem in that the reaction progresses slowly compared to epoxy resin, so that the curing time is also longer, leading to a decrease in workability.
この発明は、このような事情に鑑みなされたもので、含
浸性および耐熱接着性に優れ、しかも作業性に優れたエ
ポキシ樹脂組成物の提供をその目的とする。The present invention was made in view of the above circumstances, and an object of the present invention is to provide an epoxy resin composition that has excellent impregnating properties and heat-resistant adhesion properties, as well as excellent workability.
〔課題を解決するための手段］
上記の目的を達成するため、この発明のエポキシ樹脂組
成物は、下記の（Ａ）〜（Ｃ）成分を含み、（Ｂ）成分
の配合量が（Ａ）成分１００重量部に対して４０〜８０
重量部になるように設定されているという構成をとる。[Means for Solving the Problem] In order to achieve the above object, the epoxy resin composition of the present invention contains the following components (A) to (C), and the blending amount of component (B) is (A). 40 to 80 per 100 parts by weight of ingredients
The configuration is such that it is set to be the weight part.
（Ａ）下記の一般式（Ｉ）で表されるエポキシ樹脂。(A) An epoxy resin represented by the following general formula (I).
（Ｂ）下記の一般式（ＩＩ）で表される繰り返し単位を
主成分とするビニルフェノール樹脂。(B) A vinyl phenol resin whose main component is a repeating unit represented by the following general formula (II).
（Ｃ）硬化促進剤。(C) Curing accelerator.
〔作用］
すなわち、本発明者らは、含浸性および耐熱接着性に優
れ、しかも作業性に優れたエポキシ樹脂組成物を得るた
め一連の研究を重ねた。その結果、主成分であるエポキ
シ樹脂として上記−数式（■）で表される特殊なエポキ
シ樹脂と、硬化剤であるフェノール樹脂として上記−数
式（ＩＦ）で表される繰り返し単位を特徴とする特殊な
ビニルフェノール樹脂を用い、さらに両者を特定の配合
割合で用いると、含浸性に優れ、しかも高温雰囲気下で
の連続使用等による熱履歴によって接着力の低下が抑制
されることを見出しこの発明に到達した。[Function] That is, the present inventors have conducted a series of studies in order to obtain an epoxy resin composition that has excellent impregnation properties and heat-resistant adhesive properties, as well as excellent workability. As a result, a special epoxy resin represented by the formula (■) above as the epoxy resin as the main component, and a special repeating unit represented by the formula (IF) above as the curing agent phenol resin. We have discovered that when a vinyl phenol resin is used and both are used in a specific blending ratio, it has excellent impregnating properties and also suppresses the decrease in adhesive strength due to heat history due to continuous use in high-temperature atmospheres. Reached.
つぎに、この発明の詳細な説明する。Next, this invention will be explained in detail.
この発明のエポキシ樹脂組成物は、特殊なエポキシ樹脂
（Ａ成分）と、特殊なビニルフェノール樹脂（Ｂ成分）
と、硬化促進剤（Ｃ成分）とを用いて得られるものであ
る。The epoxy resin composition of this invention comprises a special epoxy resin (component A) and a special vinylphenol resin (component B).
and a curing accelerator (component C).
上記特殊なエポキシ樹脂（Ａ成分）としては、前記−数
式（１）で表されるエポキシ樹脂が用いられる。このエ
ポキシ樹脂は、一般に結晶性エポキシ樹脂であり、この
ものは結晶状体から急激に溶解して低粘度の液状（いわ
ばシャブシャブ状になる）になる。したがって、これを
用いることにより流動性が向上し、その結果、含浸性に
優れたものが得られるようになる。As the above-mentioned special epoxy resin (component A), an epoxy resin represented by the above-mentioned formula (1) is used. This epoxy resin is generally a crystalline epoxy resin, which rapidly dissolves from a crystalline state to become a low-viscosity liquid (so to speak, shabu-shabu-like). Therefore, by using this, fluidity is improved, and as a result, a product with excellent impregnating properties can be obtained.
上記特殊なビニルフェノール樹脂は、上記特殊なエポキ
シ樹脂（Ａ成分）の硬化剤として作用するものであり、
前記−数式（ＩＩ）を繰り返し単位とする実質的に線状
の重合体である。前記−数式（Ｉりにおいて、繰り返し
数ｎｌ は１５〜１５０の範囲である必要があり、特に
好ましくは、３０〜８０である−０また、平均分子量３
６００〜１００００のものを用いるのが好ましい。すな
わち、前記−数式（Ｉｆ）において、繰り返し数ｎ１が
１５未満であると耐熱接着性が低下し、逆に３００を超
えると含浸性が低下するからである。The special vinyl phenol resin acts as a curing agent for the special epoxy resin (component A),
It is a substantially linear polymer having the above-mentioned formula (II) as a repeating unit. In the above formula (I), the number of repetitions nl must be in the range of 15 to 150, particularly preferably 30 to 80.
It is preferable to use one having a molecular weight of 600 to 10,000. That is, in the above formula (If), if the number of repetitions n1 is less than 15, the heat-resistant adhesion will decrease, and if it exceeds 300, the impregnability will decrease.
そして、このような−数式（ｎ）で表される繰り返し単
位を特徴とする特殊なビニルフェノール樹脂としては、
具体的には、ポリビニルブチルフェノール、ポリビニル
クレゾール、ポリビニルオクチルフェノール等があげら
れる。これらビニルフェノール樹脂は、単独でもしくは
併せて用いられる。And, as a special vinyl phenol resin characterized by a repeating unit represented by the formula (n),
Specific examples include polyvinylbutylphenol, polyvinylcresol, polyvinyloctylphenol, and the like. These vinyl phenol resins may be used alone or in combination.
上記特殊なエポキシ樹脂（Ａ成分）と特殊なビニルフェ
ノール樹脂（Ｂ成分）との配合割合は、エポキシ樹脂１
００重量部（以下「部」と略す）に対してビニルフェノ
ール樹脂を４０〜８０部の割合に設定する必要がある。The blending ratio of the above special epoxy resin (component A) and special vinyl phenol resin (component B) is 1 part epoxy resin.
It is necessary to set the vinyl phenol resin at a ratio of 40 to 80 parts per 0.00 parts by weight (hereinafter abbreviated as "parts").
すなわち、ビニルフェノール樹脂の配合量が８０部を超
えると得られるエポキシ樹脂組成物の含浸性が低下し、
逆に４０部未満では耐熱接着性が低下するからである。That is, when the blending amount of the vinyl phenol resin exceeds 80 parts, the impregnating property of the obtained epoxy resin composition decreases,
On the other hand, if the amount is less than 40 parts, the heat-resistant adhesion will decrease.
上記特殊なエポキシ樹脂（Ａ成分）および特殊なビニル
フェノール樹脂（Ｂ成分）とともに用いられる硬化促進
剤（Ｃ成分）としては、三級アミン、三フッ化ホウ素ア
ミン錯体、イミダゾール誘導体、金属アセチルアセテー
ト化合物、過酸化物等があげられ、単独でもしくは併せ
て用いられる。上記硬化促進剤の配合割合は、上記特殊
なエポキシ樹脂（Ａ成分）に対して０．０１〜２０部の
割合に設定するのが好適である。すなわち、硬化促進剤
の配合量が０．０１部未満では硬化時間長く作業性の低
下を招くことがあり、逆に２０部を超えると溶融時間が
短くなり含浸性が低下する傾向がみられるからである。Curing accelerators (component C) used together with the special epoxy resin (component A) and special vinylphenol resin (component B) include tertiary amines, boron trifluoride amine complexes, imidazole derivatives, and metal acetyl acetate compounds. , peroxide, etc., which may be used alone or in combination. The blending ratio of the curing accelerator is preferably set to 0.01 to 20 parts with respect to the special epoxy resin (component A). In other words, if the amount of the curing accelerator is less than 0.01 part, the curing time will be longer and workability may be lowered, whereas if it exceeds 20 parts, the melting time will be shorter and the impregnating property will tend to be lower. It is.
この発明のエポキシ樹脂組成物には、上記Ａ〜Ｃ成分の
各成分以外に、必要に応じて、従来から用いられている
各種の添加剤を適宜配合することができる。In addition to the above-mentioned components A to C, various conventionally used additives may be appropriately blended into the epoxy resin composition of the present invention, if necessary.
上記各種の添加剤としては、タルク、ケイ砂。The various additives mentioned above include talc and silica sand.
シリカ、炭酸カルシウム、硫酸バリウム等の充填剤、カ
ーボンブラック、ベンガラ、酸化チタン。Fillers such as silica, calcium carbonate, barium sulfate, carbon black, red iron oxide, titanium oxide.
酸化クロム、シアニンブルー、シアニングリーン等の顔
料、その他流れ調整剤等があげられる。Examples include pigments such as chromium oxide, cyanine blue, and cyanine green, and other flow control agents.
このような添加剤の配合量は、そのｐｉｉｍや用途に応
して適宜設定されるが、通常、エポキシ樹脂組成物全体
の０．５〜２００重量％（以下「％」と略す）の割合に
設定され、好ましく０．５〜５０％である。The blending amount of such additives is appropriately set depending on the piim and the application, but it is usually 0.5 to 200% by weight (hereinafter abbreviated as "%") of the entire epoxy resin composition. It is preferably 0.5 to 50%.
この発明のエポキシ樹脂組成物は、上記各成分を用いて
、例えば、溶融部合法等従来公知の手段により、各成分
を混合し、粉砕および分級を行うことにより製造するこ
とができる。上記分級における粒度としては、３０メツ
シユを通過する程度に設定するのが好ましい。The epoxy resin composition of the present invention can be produced using the above-mentioned components, for example, by mixing the components, pulverizing and classifying them by conventionally known means such as the melt zone method. The particle size in the above classification is preferably set to an extent that allows the particles to pass through 30 meshes.
このようにして得られるエポキシ樹脂組成物は、上記特
殊なエポキシ樹脂（Ａ成分）および特殊なビニルフェノ
ール樹脂（Ｂ成分）の作用により、溶融時の粘度が低（
間隙充填性に優れ、被塗物に対する濡れ性や薄膜塗装性
も良好で、硬化後は優れた耐熱性と接着性を備えている
。The epoxy resin composition obtained in this way has a low viscosity (
It has excellent gap-filling properties, good wettability and thin film coating properties on objects to be coated, and has excellent heat resistance and adhesion after curing.
以上のように、この発明のエポキシ樹脂組成物は、前記
−数式（１）で表される特殊なエポキシ樹脂と、−数式
（ＩＩ）で表されるビニルフェノール樹脂を特定の配合
割合で含む特殊なエポキシ樹脂組成物であり、高温雰囲
気下での接着力および高温雰囲気放置後の接着力の双方
に優れ、しかも含浸性にも優れている。As described above, the epoxy resin composition of the present invention comprises a special epoxy resin represented by formula (1) and a vinylphenol resin represented by formula (II) in a specific blending ratio. This epoxy resin composition has excellent adhesive strength both in a high-temperature atmosphere and after being left in a high-temperature atmosphere, and also has excellent impregnation properties.
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
〔実施例１〜１３、比較例１〜９］
下記の第１表に示す各成分を、同表に示す割合で配合し
溶融混練して、粉砕することにより目的とする含浸用エ
ポキシ樹脂組成物を得た。[Examples 1 to 13, Comparative Examples 1 to 9] The desired epoxy resin composition for impregnation was prepared by blending the components shown in Table 1 below in the proportions shown in the table, melting, kneading, and pulverizing. I got it.
なお、下記の第１表中のエポキシ樹脂Ａ−Ｄ、ビニルフ
ェノール樹脂Ｅ−Ｊおよびビスマレイミドを下記に示す
。The epoxy resins A-D, vinylphenol resins E-J and bismaleimide in Table 1 below are shown below.
（エポキシ樹脂Ａ）
〈エポキシ樹脂Ｂ〜Ｄ）
ＣＨ３
（ビニルフェノール樹脂Ｅ〜Ｊ）
（ビスマレイミド）
（以下余白）
つぎに、このようにして得られた実施例および比較例の
含浸用エポキシ樹脂組成物について、２００°Ｃの剪断
接着力、耐熱率２間隙充填率を下記の方法にしたがい測
定した。その結果を下記の第２表に示した。(Epoxy resin A) <Epoxy resins B to D) CH3 (Vinyl phenol resins E to J) (Bismaleimide) (Hereafter the margins) Next, the epoxy resin compositions for impregnation of Examples and Comparative Examples obtained in this way The shear adhesive strength at 200°C, heat resistance rate 2, and gap filling rate of the product were measured according to the following methods. The results are shown in Table 2 below.
なお、上記剪断接着力、耐熱率および間隙充填率はつぎ
のようにして測定した。The above-mentioned shear adhesive strength, heat resistance rate, and gap filling rate were measured as follows.
（イ）２００°Ｃ剪断接着力
幅１５鵬×長さ１００ｍｘ厚み１．０鵬の２枚の鋼板を
、１８０°Ｃで予熱した後、１０ｍｍラップさせこのエ
ポキシ樹脂組成物で接着した。つぎに、これを１８０°
Ｃで３０分間保持して硬化させ剪断接着力試験片を作製
した。そして、このヰ試験片の２００°Ｃ雰囲気中での
剪断接着力を測定した。(a) 200°C Shear Adhesive Strength Two steel plates measuring 15mm width x 100m length x 1.0mm thickness were preheated at 180°C, then wrapped by 10mm and bonded with this epoxy resin composition. Next, change this to 180°
C for 30 minutes to cure and prepare a shear adhesive strength test piece. Then, the shear adhesive strength of this test piece in a 200°C atmosphere was measured.
（ロ）耐熱率
上記剪断接着力試験で作製した試験片を２００°Ｃ雰囲
気下で１０００時間放置した後、室温まで冷却し、剪断
接着力を測定して、初期の接着力に対する比率（％）で
示した。(b) Heat resistance rate The test piece prepared in the above shear adhesive strength test was left in an atmosphere of 200°C for 1000 hours, then cooled to room temperature, the shear adhesive strength was measured, and the ratio to the initial adhesive strength (%) It was shown in
（ハ）間隙充填率
幅１５胚×長さ１００ｍｘ厚み１．０−の２枚の鋼板間
に、厚み０．５ ｍｍのスペーサー２本を１０睡の間隔
において挟持し、鋼板を加熱して１５０°Ｃに到った時
点で両鋼板とスペーサーとの間で構成されたスリット状
の間隙にエポキシ樹脂組成物をふりかけ、その溶融物を
流し込んだ。その後、１８０°Ｃで３０分間保持して硬
化させ、室温まで冷却した後に剪断接着力を測定し、上
記（ロ）で得られた初期剪断接着力に対する比率（％）
で示した。(c) Gap filling ratio Two spacers with a thickness of 0.5 mm are sandwiched between two steel plates of width 15 embryos x length 100 m x thickness 1.0 mm, and the steel plates are heated to 150 m. When the temperature reached °C, an epoxy resin composition was sprinkled into the slit-shaped gap formed between both steel plates and the spacer, and the melt was poured. Thereafter, it was held at 180°C for 30 minutes to cure, and after cooling to room temperature, the shear adhesive strength was measured and the ratio (%) to the initial shear adhesive strength obtained in (b) above.
It was shown in
（以下余白）
上記第２表の結果から、比較例品は剪断接着力、耐熱率
および間隙充填率のいずれかの値が低い。これに対して
実施例品は全ての試験結果に対して良好な値が得られた
。このことから、実施例品は耐熱性および含浸性の双方
に優れていることがわかる。したがって、実施例品であ
るこの発明のエポキシ樹脂組成物は、モーターやトラン
ス等に組み込まれるコイルの含浸固着用接着剤等の用途
に最適である。(The following is a blank space) From the results in Table 2 above, the comparative example product has a low value in any one of shear adhesive strength, heat resistance rate, and gap filling rate. On the other hand, the example product obtained good values for all test results. From this, it can be seen that the example products are excellent in both heat resistance and impregnability. Therefore, the epoxy resin composition of the present invention, which is an example product, is most suitable for use as an adhesive for impregnating and fixing coils incorporated in motors, transformers, etc.
特許出願人 日東電工株式会社 代理人 弁理士 西 藤 征 彦Patent applicant: Nitto Denko Corporation Agent: Patent Attorney Yukihiko Nishifuji
Claims (1)
配合量が（Ａ）成分１００重量部に対して４０〜８０重
量部になるように設定されていることを特徴とするエポ
キシ樹脂組成物。 （Ａ）下記の一般式（ I ）で表されるエポキシ樹脂。 ▲数式、化学式、表等があります▼ ［上記式（ I ）において、Ｒ＿１は少なくとも１個の
炭素原子を含む一価の有機基，ハロゲン原子または水素
原子である。］ （Ｂ）下記の一般式（II）で表される繰り返し単位を主
成分とするビニルフエノール樹 脂。 ▲数式、化学式、表等があります▼ ［上記式（II）において、Ｒ＿２は炭素数１〜８のアル
キル基，ハロゲン原子または水素原子であり、ｎ＿１は
１５〜１５０である。］ （Ｃ）硬化促進剤。(1) It contains the following components (A) to (C), and the amount of component (B) is set to be 40 to 80 parts by weight per 100 parts by weight of component (A). An epoxy resin composition. (A) An epoxy resin represented by the following general formula (I). ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the above formula (I), R_1 is a monovalent organic group containing at least one carbon atom, a halogen atom, or a hydrogen atom. ] (B) A vinylphenol resin whose main component is a repeating unit represented by the following general formula (II). ▲There are mathematical formulas, chemical formulas, tables, etc.▼ [In the above formula (II), R_2 is an alkyl group having 1 to 8 carbon atoms, a halogen atom, or a hydrogen atom, and n_1 is 15 to 150. ] (C) Curing accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33965590A JPH04202517A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33965590A JPH04202517A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04202517A true JPH04202517A (en) | 1992-07-23 |
Family
ID=18329556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33965590A Pending JPH04202517A (en) | 1990-11-30 | 1990-11-30 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04202517A (en) |
-
1990
- 1990-11-30 JP JP33965590A patent/JPH04202517A/en active Pending
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