JPH0420233U - - Google Patents
Info
- Publication number
- JPH0420233U JPH0420233U JP6020290U JP6020290U JPH0420233U JP H0420233 U JPH0420233 U JP H0420233U JP 6020290 U JP6020290 U JP 6020290U JP 6020290 U JP6020290 U JP 6020290U JP H0420233 U JPH0420233 U JP H0420233U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- molding
- type semiconductor
- zip type
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6020290U JPH0420233U (en, 2012) | 1990-06-08 | 1990-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6020290U JPH0420233U (en, 2012) | 1990-06-08 | 1990-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420233U true JPH0420233U (en, 2012) | 1992-02-20 |
Family
ID=31587363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6020290U Pending JPH0420233U (en, 2012) | 1990-06-08 | 1990-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420233U (en, 2012) |
-
1990
- 1990-06-08 JP JP6020290U patent/JPH0420233U/ja active Pending