JPH0420230U - - Google Patents
Info
- Publication number
- JPH0420230U JPH0420230U JP6158390U JP6158390U JPH0420230U JP H0420230 U JPH0420230 U JP H0420230U JP 6158390 U JP6158390 U JP 6158390U JP 6158390 U JP6158390 U JP 6158390U JP H0420230 U JPH0420230 U JP H0420230U
- Authority
- JP
- Japan
- Prior art keywords
- heater
- heaters
- terminals
- shared
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Description
第１図は本考案を実施した加熱炉の一部を破断
した外観図、第２図は該実施例のヒータ配置図、
第３図は同前回路図、第４図は従来例の加熱炉の
一部を破断した外観図、第５図は該従来例のヒー
タ配置図、第６図は同前回路図である。
４ａ，４ｂは端子、５，６，７，８はヒータ、
９，１０，１１，１２は加熱ゾーンを示す。
Fig. 1 is a partially cutaway external view of a heating furnace in which the present invention is implemented, Fig. 2 is a heater arrangement diagram of the embodiment,
FIG. 3 is a circuit diagram of the same, FIG. 4 is a partially cutaway external view of a conventional heating furnace, FIG. 5 is a heater arrangement diagram of the conventional example, and FIG. 6 is a circuit diagram of the same. 4a, 4b are terminals, 5, 6, 7, 8 are heaters,
9, 10, 11, and 12 indicate heating zones.
Claims (1)
のヒータ端が同電位となる様に配列し、隣接する
ヒータの低電位側のヒータ端用端子を共用とした
ことを特徴とする半導体製造装置に於ける加熱装
置。 A semiconductor manufacturing device characterized in that a plurality of heaters forming a heating zone are arranged so that the heater ends of each heater are at the same potential, and the terminals for the heater ends on the low potential side of adjacent heaters are shared. heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990061583U JP2519157Y2 (en) | 1990-06-11 | 1990-06-11 | Heating equipment for semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990061583U JP2519157Y2 (en) | 1990-06-11 | 1990-06-11 | Heating equipment for semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0420230U true JPH0420230U (en) | 1992-02-20 |
| JP2519157Y2 JP2519157Y2 (en) | 1996-12-04 |
Family
ID=31589959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990061583U Expired - Lifetime JP2519157Y2 (en) | 1990-06-11 | 1990-06-11 | Heating equipment for semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2519157Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2017115758A1 (en) * | 2015-12-28 | 2017-12-28 | 日本碍子株式会社 | Disc heater and heater cooling plate assembly |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4928691A (en) * | 1972-07-14 | 1974-03-14 | ||
| JPS5143720U (en) * | 1974-09-28 | 1976-03-31 |
-
1990
- 1990-06-11 JP JP1990061583U patent/JP2519157Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4928691A (en) * | 1972-07-14 | 1974-03-14 | ||
| JPS5143720U (en) * | 1974-09-28 | 1976-03-31 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2017115758A1 (en) * | 2015-12-28 | 2017-12-28 | 日本碍子株式会社 | Disc heater and heater cooling plate assembly |
| US10256105B2 (en) | 2015-12-28 | 2019-04-09 | Ngk Insulators, Ltd. | Disc-shaped heater and heater-cooling-plate assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2519157Y2 (en) | 1996-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |