JPH04196702A - Microstrip patch type array antenna - Google Patents

Abstract

PURPOSE:To make the entire antenna small and to attain ease of communication even when an object of communication is a mobile body by providing a transmission/reception board whose front side is provided with plural transmission patches and plural reception patches and whose rear side is provided with a ground conductor plane and providing a transmission line board with a transmission line formed thereon to the antenna. CONSTITUTION:When a transmission signal is fed from a transmitter-receiver, the signal is received by a transmission converter 7 and divided into plural signals by a transmission wiring board 3 and fed to a transmission reception board 1, from which the signal is sent. Moreover, when the transmission reception board 1 receives a radio wave, it is fetched by a reception wiring board 2 and fed to the transmitter-receiver via a reception converter 6. Then a transmission patch 12 and a reception patch 11 formed on the transmission reception board 1 are energized from the rear side and the transmission and reception are implemented in a circularly polarized wave. Thus, even when an object of communication is a mobile body, communication is easily implemented by two frequencies and the entire antenna is made small.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a microstrip patch type array antenna used in satellite communications and the like.

(Prior Art) A waveguide slot type planar array antenna shown in FIG. 5 is conventionally known as one of the planar array antennas for subscriber radio.

The waveguide slot type planar array antenna shown in this figure has a plurality of waveguides 1 each having a large number of vertical slots 101 formed therein.
A transmitting/receiving antenna section 103 configured by 02;
It is equipped with a transmitting/receiving antenna section 106 constituted by a plurality of waveguides 105 in which many horizontal slots 104 are formed, and these transmitting/receiving antenna sections 103.10
By using one side of 6 for transmission only and the other for reception only, the plane of polarization of the radio wave at the time of transmission,
Transmission and reception are performed with the plane of polarization of radio waves orthogonal to the plane of polarization at the time of reception.

Further, as another planar antenna, a microstrip patch type antenna shown in FIG. 6 is also known.

The microstrip patch antenna shown in this figure has a dielectric substrate 111 with a ground plane 110 formed on the back side,
A conductor thin plate (patch) 112 formed in a rectangular (or other shape) shape on this substrate 111, and this patch 112
and a feed line 114 connected to the edge of the patch 112 from an angle 90 degrees different from the feed line 113.
By using one of the antennas for reception only and the other for transmission, the plane of polarization of the radio waves during transmission and the polarization of the radio waves during reception can be changed, similar to the above-mentioned waveguide slot type planar array antenna. Transmission and reception are performed by orthogonal to the wavefront.

(Problem to be Solved by the Invention) However, in each of the conventional planar antennas described above, the plane of polarization of the radio waves used for transmission is orthogonal to the plane of polarization of the radio waves used for reception, so the communication target When the plane of polarization changes, as in the case of a mobile object, communication becomes difficult.

Therefore, it is conceivable to arrange a large number of transmitting and receiving planar antennas side by side so that the polarization planes are slightly shifted, but this would make the antennas larger and make it difficult to secure installation space.

Furthermore, in the microstrip patch type antenna shown in FIG. 6, the patch 112 serving as the excitation element and the feeder lines 113 and 114 serving as the transmission line exist on the same plane.
There was a problem that designing wiring etc. was difficult.

In view of the above circumstances, the present invention enables easy communication even when the communication target is a moving body, and also allows the entire antenna to be miniaturized, and reduces the transmission loss of the transmission path. Furthermore, it is an object of the present invention to provide a microstrip patch type array antenna that can facilitate the design of the entire antenna.

[Structure of the invention]

(Means for Solving the Problems) In order to achieve the above object, a microstrip patch type array antenna according to the present invention has a plurality of transmitting patches and a plurality of receiving patches formed on the front side, and a plurality of receiving patches on the back side. It is characterized by comprising a transmitting/receiving board on which a ground conductor surface is formed, and a transmission path board on which a transmission path is formed to serve as a power feeding path for each transmitting patch and each receiving patch of this transmitting/receiving board.

(Function) In the above configuration, when a transmission signal is supplied from the transceiver, it is divided into a plurality of parts by the transmission line board, and then supplied to the transmission patch formed on the transmission and reception board and transmitted. When a radio wave is received by each receiving patch formed on the transmitting/receiving board, this is captured by the transmission line board and supplied to the transmitting/receiving device.

(Embodiment) FIG. 1 is a sectional view showing an embodiment of a microstrip patch type array antenna according to the present invention, and FIG. 2 is a sectional view when viewed from the direction of arrow A shown in FIG.

The microstrip patch array antenna shown in this figure includes a transmitting/receiving board 1, a receiving wiring board 2, a transmitting wiring board 3, a plurality of dielectric boards 4.5, and a receiving converter 6.
and a transmitting converter 7. When a transmitting signal is supplied from a transmitter/receiver (not shown), the transmitting converter 7 receives the signal, divides it into multiple parts by the transmitting wiring board 3, and then transmits and receives the signal. When a radio wave is supplied to the board 1 for transmission, and when the radio wave is received by this transmission/reception board 1,
This is taken in by the receiving wiring board 2 and supplied to the transmitter/receiver via the receiving converter 6.

Etching double-sided substrates such as double-sided copper-clad laminates,
It is a board formed by drilling holes, and a plurality of reception patches 11 and a plurality of transmission patches 12 are formed on the surface thereof, and a shield layer 13 serving as a ground conductor is formed on the back surface. Further, a power feeding hole 14 penetrating the back surface is formed in a portion serving as a feeding point of each receiving patch 11 and a portion serving as a feeding point of each transmitting patch 12.

As shown in FIG. 3, each receiving patch 11 is a rectangular conductive thin plate formed by etching or the like to a size corresponding to the frequency used, and is arranged at the most efficient pitch according to the frequency used. There is.

Further, the transmitting patch 12 is a rectangular conductive thin plate formed by etching or the like to a size corresponding to the frequency used (a frequency different from the receiving frequency), similarly to each of the receiving patches 11 described above. The receiving patches 11 are arranged at the same pitch as the receiving patches 11 at intermediate positions among the receiving patches 11 .

As shown in FIG. 4, the shield layer 13 is a thin conductive plate from which the conductor around each power supply hole 14 has been removed by etching or the like, and each power supply hole 14 has a power supply bin 15 for receiving and a power supply bin 15 for transmitting. A power supply pin 16 is inserted and connected to the back surface of the front receiving patch 11 and the back surface of the transmitting patch 12, respectively.

In this case, each feed hole 14 is formed at a position where the radio waves transmitted from the transmitting patch 12 and the radio waves received by the receiving patch 11 become circularly polarized waves.

Similarly to the transmitting/receiving board 1, the receiving wiring board 2 is made of a double-sided board such as a double-sided copper-clad laminate using a foamed PE/glass cloth board or a Teflon/glass cloth board for the insulating layer 17, or by etching holes. It is a substrate formed by processing, and reception transmission paths 18 are formed on the front surface at positions corresponding to the respective reception patches 11 by etching processing etc., and a shield layer 19 is formed on the back surface thereof, Further, a power supply hole 22 penetrating the back surface is formed in a portion corresponding to each of the transmission power supply pins 16, and a power supply hole 20 penetrating the back surface is formed in a portion corresponding to a predetermined portion of the reception transmission path 18. ing.

The reception transmission line 18 is a transmission line optimized to most efficiently collect the power from each of the reception patches 11 in the same phase, and the reception power supply is placed at the position where the reception patch 11 is fed. Each of the pins 15 is vertically arranged, and one end of a reception connection pin 21 is connected to the back surface of each pin 15 through the power supply hole 20, and is connected to the reception converter 6 by this reception connection pin 21.

Further, the shield layer 19 is formed by etching or the like around the power supply hole 22 into which each of the transmission power supply pins 16 is fitted, and around the power supply hole 22 into which the reception connection pin 21 is fitted.
This is a thin conductive plate from which the conductor around 0 has been removed, and a transmission power supply pin 16 and a reception connection pin 21 are fitted into each power supply hole 20, 22, respectively.

Similarly to the receiving wiring board 2, the transmitting wiring board 3 is a double-sided board such as a double-sided copper-clad laminate using a foamed PE/glass cloth board or a Teflon/glass cloth board for the insulating layer 25. It is a substrate formed by processing, and a transmission transmission path 26 is formed on the surface thereof at a position corresponding to each transmission patch 12 by etching processing or the like, and a shield layer 27 is formed on the back surface thereof. Further, a power supply hole 30 penetrating through the back surface is formed in a portion corresponding to the reception connection pin 21, and a power supply hole 28 penetrating through the back surface is formed in a portion corresponding to a predetermined portion of the transmission transmission path 260.

The transmission transmission line 26 is a transmission line optimized to most efficiently distribute transmission power in a predetermined phase, and the transmission power supply pin 1 is located at a position serving as the power supply point of each transmission patch 12.
6 are vertically installed, and a power supply hole 28 is provided on the back side of each.
One end of a transmission connection pin 29 is connected through the transmission connection pin 29, and is connected to the transmission converter 7 by this transmission connection pin 29.

Further, the shield layer 27 is a thin conductive plate in which the conductor around the power supply hole 30 corresponding to the reception connection pin 21 and the power supply hole 28 corresponding to the transmission connection pin 29 has been removed by etching or the like. Yes, each power supply hole 28.30 has a connection pin 29 for transmission and connection pin 2 for reception.
1 is inlaid in each.

Further, the dielectric substrate 4 is composed of a dielectric plate of the same type and thickness as the transmitting/receiving substrate 1, the receiving wiring board 2, and the transmitting wiring board 3, and corresponds to the transmitting power supply pin 16 and the receiving power supply pin 15. 6 31 that penetrates vertically is formed in the portion where the transmitting/receiving board 1 and the receiving wiring board 2 are inserted, with the transmitting power supply bottle 16 and the receiving power supply pin 15 inserted into each of these members 31. It is integrated with the transmitting/receiving board 1 and the receiving wiring board 2 using an adhesive, an adhesive film, or the like.

Further, the dielectric substrate 5 is made of a dielectric plate of the same type and thickness as the dielectric substrate 4, and has holes 32 penetrating vertically in portions corresponding to the transmission power supply bin 16 and reception connection pin 21. are formed and the transmitting power feeding bin 16 and the receiving connection bin 21 are inserted into each of these formulas 32, and then inserted between the receiving wiring board 2 and the transmitting wiring board 3, and an adhesive material, an adhesive film, etc. Thus, it is integrated with the receiving wiring board 2 and the transmitting wiring board 3.

As described above, in this embodiment, the transmitting/receiving board 1, the dielectric substrate 4, the receiving wiring board 2, the dielectric board 5, and the transmitting wiring board 3 are sequentially laminated, and a structure is formed on the transmitting/receiving board 1. Since power is supplied to the transmitting patch 12 and the receiving patch 11 from the back side so that they can transmit and receive circularly polarized waves, even when the communication target is a mobile object, communication can be easily performed using two frequencies. Since the transmitting patches 12 and the receiving patches 11 are arranged at the same pitch, the transmitting and receiving area can be minimized, thereby making it possible to downsize the entire antenna.

Further, in this embodiment, double-sided boards are used as the transmitter/receiver board 1, the receiver wiring board 2, and the transmitter wiring board 3,
Furthermore, since a dielectric substrate 4.5 of the same type and thickness is sandwiched between the transmitting/receiving board or the transmitting wiring board 3, the receiving transmission line 18 and the transmitting transmission line 26 are connected to the triplate line. This allows transmission loss to be reduced.

Furthermore, in this embodiment, since the transmitting patch 12, the receiving patch 11, the receiving transmission line 18, and the transmitting transmission line 26 are formed on independent substrates, the overall design of the antenna is can be facilitated.

In addition, in the above embodiment, the transmitting patch 12 and the receiving patch 11 are rectangular, but they may also be circular, pentagonal, etc. as long as the shape generates circularly polarized waves most efficiently. good.

In addition, in the embodiment described above, the receiving power supply pin 15
, the transmission power supply bin 16, the transmission connection pin 29, and the reception connection pin 21 are used, but the transmission and reception board 1
, the receiving wiring board 2, the transmitting wiring board 3, each dielectric board 4.
Through-holes may be formed in 5, and these through-holes may have the functions of the receiving power supply pin 15, the transmitting power supply pin 16, the transmitting connection pin 29, and the receiving connection pin 210.

〔Effect of the invention〕

As explained above, according to the present invention, even when the communication target is a moving body, communication can be easily performed, the entire antenna can be downsized, and the transmission loss of the transmission path can be reduced. In addition, the design of the entire antenna can be simplified.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing one embodiment of a microstrip patch array antenna according to the present invention, FIG. 2 is a cross-sectional view when viewed from the direction of arrow A shown in FIG. 1, and FIG. Fig. 4 is a plan view of the transceiver board shown in Fig. 1 when viewed from the back side, Fig. 5 is a plan view of the conventionally known waveguide slot type plane. FIG. 6 is a perspective view showing an example of an array antenna. FIG. 6 is a perspective view showing an example of a conventionally known microstrip patch antenna. 1... Transmission/reception board 2... Transmission line board (transmission wiring board) 3... Transmission line board (reception wiring board) 4.5... Dielectric substrate 11... Receiving patch 12... Transmission patch 13...Ground conductor surface (shield layer) 18...Transmission line (transmission line for reception) 26...Transmission line (transmission line for transmission) -1, Patent Attorney Hidekazu Miyoshi Figure 1, Figure 2 Figure 3 Figure 5 Figure 4 +10 Figure 6

Claims (3)

[Claims] (1) A transmitting/receiving board with a plurality of transmitting patches and a plurality of receiving patches formed on the front side and a ground conductor surface on the back side, each transmitting patch and each receiving patch of this transmitting/receiving board. A microstrip patch array antenna characterized by comprising: a transmission line board on which a transmission line serving as a power feeding line is formed; (2) The microstrip patch type array antenna according to claim 1, wherein the transmission path board is laminated on the back surface of the transmitter/receiver board. (3) The microstrip patch type array antenna according to claim 1, wherein the transmission path formed on the transmission path substrate has a triplate structure.