JPH0419557U - - Google Patents

Info

Publication number
JPH0419557U
JPH0419557U JP5963390U JP5963390U JPH0419557U JP H0419557 U JPH0419557 U JP H0419557U JP 5963390 U JP5963390 U JP 5963390U JP 5963390 U JP5963390 U JP 5963390U JP H0419557 U JPH0419557 U JP H0419557U
Authority
JP
Japan
Prior art keywords
spool
exposed metal
spool body
wire
peripheral surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5963390U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5963390U priority Critical patent/JPH0419557U/ja
Publication of JPH0419557U publication Critical patent/JPH0419557U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す半導体用ボン
デイングワイヤースプールの正面図で一部切欠し
て示し、第2図はワイヤーを巻かない状態の側面
図で一部切欠して示す。 A……ワイヤー、A……巻線始端、A……
巻線始端部、1……スプール本体、2……フラン
ジ、3……金属面露出部(スプール本体内周面)
、4……金属面露出部(スプール本体外周面)、
5……絶縁被膜、6……テープ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 少なくともスプール本体の内周面の一部に金属
    面露出部を残して、スプール本体及びその開口端
    に設けられるフランジの内外全面に絶縁被膜を形
    成し、このフランジにワイヤーの巻線始端をテー
    プ止めした半導体用ボンデイングワイヤースプー
    ルにおいて、前記スプール本体の外周面のテープ
    止め側に金属面露出部を部分的に設け、この金属
    面露出部にワイヤーの巻線始端部を巻き込んだこ
    とを特徴とする半導体用ボンデイングワイヤース
    プール。
JP5963390U 1990-06-04 1990-06-04 Pending JPH0419557U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5963390U JPH0419557U (ja) 1990-06-04 1990-06-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5963390U JPH0419557U (ja) 1990-06-04 1990-06-04

Publications (1)

Publication Number Publication Date
JPH0419557U true JPH0419557U (ja) 1992-02-19

Family

ID=31586304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5963390U Pending JPH0419557U (ja) 1990-06-04 1990-06-04

Country Status (1)

Country Link
JP (1) JPH0419557U (ja)

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