JPH04195050A - Photosensitive resin composition and photosensitive film using same - Google Patents

Photosensitive resin composition and photosensitive film using same

Info

Publication number
JPH04195050A
JPH04195050A JP32584690A JP32584690A JPH04195050A JP H04195050 A JPH04195050 A JP H04195050A JP 32584690 A JP32584690 A JP 32584690A JP 32584690 A JP32584690 A JP 32584690A JP H04195050 A JPH04195050 A JP H04195050A
Authority
JP
Japan
Prior art keywords
film
vinyl compound
benzophenone
integer
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32584690A
Other languages
Japanese (ja)
Inventor
Taku Kawaguchi
Takenori Mizoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP32584690A priority Critical patent/JPH04195050A/en
Publication of JPH04195050A publication Critical patent/JPH04195050A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve plating resistance and flexibility of a hardened film by using a film-forming polymer containing carboxyl groups, a photopolymerization initiator, such as benzophenone, and a specified vinyl compound.
CONSTITUTION: The composition to be used comprises the carboxy-containing film-forming polymer, such as an acrylate-acrylic acid copolymer, the photopolymerization initiator, such as benzophenone, and the vinyl compound represented by general formula in which R1 is H or methyl; R2 is a≥4C saturated hydrocarbon group; n is an integer of 2 - 5; and m is an integer of 1 - 4. It contains, when needed, a vinyl compound, such as tetraethyleneglycol dimethacrylate, a plasticizer, a thermopolymerization inhibitor, a dye, a pigment, a filler, an adhesion giving agent, and the like. A surface of a metal, such as copper, is coated with a coating material comprising this composition as a liquid resist and dried, or a support film made of polyester is coated with it and after drying, a protective film, such as a polyester film, is laminated when needed.
COPYRIGHT: (C)1992,JPO&Japio
JP32584690A 1990-11-28 1990-11-28 Photosensitive resin composition and photosensitive film using same Pending JPH04195050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32584690A JPH04195050A (en) 1990-11-28 1990-11-28 Photosensitive resin composition and photosensitive film using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32584690A JPH04195050A (en) 1990-11-28 1990-11-28 Photosensitive resin composition and photosensitive film using same

Publications (1)

Publication Number Publication Date
JPH04195050A true JPH04195050A (en) 1992-07-15

Family

ID=18181274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32584690A Pending JPH04195050A (en) 1990-11-28 1990-11-28 Photosensitive resin composition and photosensitive film using same

Country Status (1)

Country Link
JP (1) JPH04195050A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006129469A1 (en) * 2005-05-30 2006-12-07 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
US8007983B2 (en) 2006-03-31 2011-08-30 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board
US8101339B2 (en) 2005-10-25 2012-01-24 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006129469A1 (en) * 2005-05-30 2006-12-07 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
JPWO2006129469A1 (en) * 2005-05-30 2008-12-25 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
KR100935780B1 (en) * 2005-05-30 2010-01-06 히다치 가세고교 가부시끼가이샤 Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board
JP4586067B2 (en) * 2005-05-30 2010-11-24 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
US8101339B2 (en) 2005-10-25 2012-01-24 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board
US8007983B2 (en) 2006-03-31 2011-08-30 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board

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